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Combinations of two or more cleaning methods provided for in at least two different groups from H01L2224/8001 - H01L2224/80014

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  • H01L2224/80019
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/80019Combinations of two or more cleaning methods provided for in at least two different groups from H01L2224/8001 - H01L2224/80014
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Die processing
    • Patent number 11,742,315
    • Issue date Aug 29, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die processing
    • Patent number 10,985,133
    • Issue date Apr 20, 2021
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die processing
    • Patent number 10,714,449
    • Issue date Jul 14, 2020
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die processing
    • Patent number 10,515,925
    • Issue date Dec 24, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Die processing
    • Patent number 10,269,756
    • Issue date Apr 23, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Alignment systems and wafer bonding systems and methods
    • Patent number 9,646,860
    • Issue date May 9, 2017
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Xin-Hua Huang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Structures and Processes for Void-Free Hybrid Bonding
    • Publication number 20240222313
    • Publication date Jul 4, 2024
    • International Business Machines Corporation
    • Roy R. Yu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED PROCESS FLOWS FOR HYBRID BONDING
    • Publication number 20240170443
    • Publication date May 23, 2024
    • Ruiping WANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE PROCESSING
    • Publication number 20240021572
    • Publication date Jan 18, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT BONDING METHODS AND STRUCTURES
    • Publication number 20220139867
    • Publication date May 5, 2022
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE PROCESSING
    • Publication number 20210233888
    • Publication date Jul 29, 2021
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE PROCESSING
    • Publication number 20200321307
    • Publication date Oct 8, 2020
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE PROCESSING
    • Publication number 20190371761
    • Publication date Dec 5, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE PROCESSING
    • Publication number 20190189588
    • Publication date Jun 20, 2019
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Die Processing
    • Publication number 20180308819
    • Publication date Oct 25, 2018
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Cyprian Emeka UZOH
    • H01 - BASIC ELECTRIC ELEMENTS