Combinations of two or more hardening methods provided for in at least two different groups from H01L2224/83855 - H01L2224/8388

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CPC
H01L2224/83885

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83885Combinations of two or more hardening methods provided for in at least two different groups from H01L2224/83855 - H01L2224/8388

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Alignment method, method for connecting electronic component, metho...
- Patent number 11,049,842
- Issue date Jun 29, 2021
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Assembly process for circuit carrier and circuit carrier
- Patent number 10,991,632
- Issue date Apr 27, 2021
- A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Andreas Karch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placement method for circuit carrier and circuit carrier
- Patent number 10,672,672
- Issue date Jun 2, 2020
- A.B. MIKROELEKTRONIK GESELLSCHAFT MIT BESCHRAENKTER HAFTUNG
- Andreas Karch
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,550,299
- Issue date Feb 4, 2020
- FRAIVILLIG TECHNOGIES COMPANY
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound containing...
- Patent number 10,435,603
- Issue date Oct 8, 2019
- Fravillig Technologies Company
- James B. Fraivillig
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 10,373,926
- Issue date Aug 6, 2019
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
A-staged thermoplastic-polyimide (TPI) adhesive compound and method...
- Patent number 10,035,936
- Issue date Jul 31, 2018
- James B. Fraivillig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for semiconductor and adhesive film including...
- Patent number 9,957,425
- Issue date May 1, 2018
- Cheil Industries, Inc.
- Jun Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film, method for producing anisotropic condu...
- Patent number 9,960,139
- Issue date May 1, 2018
- Dexerials Corporation
- Kouichi Sato
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Dicing film and dicing die-bonding film
- Patent number 9,761,476
- Issue date Sep 12, 2017
- LG Chem, Ltd.
- Se Ra Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film adhesive, dicing tape with film adhesive, method of manufactur...
- Patent number 9,484,240
- Issue date Nov 1, 2016
- Nitto Denko Corporation
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device connected by anisotropic conductive film
- Patent number 9,252,117
- Issue date Feb 2, 2016
- Cheil Industries, Inc.
- Kyoung Hun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet for manufacturing semiconductor device, manufacturin...
- Patent number 9,153,556
- Issue date Oct 6, 2015
- Nitto Denko Corporation
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, and adhesive sheet, semiconductor apparatus-p...
- Patent number 8,808,865
- Issue date Aug 19, 2014
- Shin-Etsu Chemical Co., Ltd.
- Kazunori Kondo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stress-engineered interconnect packages with activator-assisted molds
- Patent number 8,652,878
- Issue date Feb 18, 2014
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-engineered interconnect packages with activator-assisted molds
- Patent number 8,405,198
- Issue date Mar 26, 2013
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive composition, film-like adhesive, adhesive sheet and semico...
- Patent number 8,373,283
- Issue date Feb 12, 2013
- Hitachi Chemical Company, Ltd.
- Takashi Masuko
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 8,283,246
- Issue date Oct 9, 2012
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive film, dicing die bonding film and semiconductor device usi...
- Patent number 8,207,616
- Issue date Jun 26, 2012
- LG Chem, Ltd.
- Jong Wan Hong
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing semiconductor chip with adhesive film, adhesiv...
- Patent number 8,198,176
- Issue date Jun 12, 2012
- Hitachi Chemical Company, Ltd.
- Keiichi Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of resin-sealed semiconductor device
- Patent number 8,114,710
- Issue date Feb 14, 2012
- Renesas Electronics Corporation
- Akira Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition suitable to be applied by screen printing
- Patent number 8,110,066
- Issue date Feb 7, 2012
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya Kanamaru
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for producing semiconductor chip with adhesive film, adhesiv...
- Patent number 8,071,465
- Issue date Dec 6, 2011
- Hitachi Chemical Company, Ltd.
- Keiichi Hatakeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method of semiconductor device and bonding film
- Patent number 8,034,659
- Issue date Oct 11, 2011
- Hitachi Chemical Company, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dicing/die bonding film
- Patent number 7,998,552
- Issue date Aug 16, 2011
- Nittok Denko Corporation
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,951,700
- Issue date May 31, 2011
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive film composition, associated dicing die bonding film, and...
- Patent number 7,863,758
- Issue date Jan 4, 2011
- Cheil Industries, Inc.
- Ki Sung Jung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermosetting die-bonding film
- Patent number 7,829,441
- Issue date Nov 9, 2010
- Nitto Denko Corporation
- Naohide Takamoto
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and device including reworkable alpha particle barrier and c...
- Patent number 7,615,850
- Issue date Nov 10, 2009
- International Business Machines Corporation
- Rehan Choudhary
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting die bonding film
- Patent number 7,611,926
- Issue date Nov 3, 2009
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20240071898
- Publication date Feb 29, 2024
- Fuji Electric Co., Ltd.
- Koji OSAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Manufacturing Led Display
- Publication number 20200402867
- Publication date Dec 24, 2020
- V TECHNOLOGY CO., LTD.
- Yoshikatsu YANAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...
- Publication number 20190048238
- Publication date Feb 14, 2019
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...
- Publication number 20180346777
- Publication date Dec 6, 2018
- James B. Fraivillig
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...
- Publication number 20180218994
- Publication date Aug 2, 2018
- DEXERIALS CORPORATION
- Kouichi SATO
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
- Publication number 20140252640
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Min-Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTUR...
- Publication number 20140231983
- Publication date Aug 21, 2014
- Yuki SUGO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING...
- Publication number 20140194555
- Publication date Jul 10, 2014
- Jun Woo LEE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
- Publication number 20140159229
- Publication date Jun 12, 2014
- Kyoung Hun SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE COMPOSITION, AND ADHESIVE SHEET, SEMICONDUCTOR APPARATUS-P...
- Publication number 20130289225
- Publication date Oct 31, 2013
- Shin-Etsu Chemical Co., Ltd.
- Kazunori KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS
- Publication number 20130196471
- Publication date Aug 1, 2013
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20120295400
- Publication date Nov 22, 2012
- Keiichi Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME
- Publication number 20120273799
- Publication date Nov 1, 2012
- Kabushiki Kaisha Toshiba
- Kazutaka TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COM...
- Publication number 20120261174
- Publication date Oct 18, 2012
- Toshiaki Chuma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
BONDING SHEET
- Publication number 20120114934
- Publication date May 10, 2012
- Megumi Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20110318879
- Publication date Dec 29, 2011
- Keiichi HATAKEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20110201195
- Publication date Aug 18, 2011
- PANASONIC CORPORATION
- Takashi KITAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIV...
- Publication number 20110193244
- Publication date Aug 11, 2011
- Takashi MASUKO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICO...
- Publication number 20110187009
- Publication date Aug 4, 2011
- Takashi Masuko
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20100311227
- Publication date Dec 9, 2010
- Keiichi Hatakeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS
- Publication number 20100295165
- Publication date Nov 25, 2010
- Palo Alto Research Center Incorporated
- Christopher L. Chua
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FILM, DICING DIE BONDING FILM AND SEMICONDUCTOR DEVICE USI...
- Publication number 20100289158
- Publication date Nov 18, 2010
- Jong Wan Hong
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...
- Publication number 20100267199
- Publication date Oct 21, 2010
- Keiichi Hatakeyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...
- Publication number 20100197080
- Publication date Aug 5, 2010
- Takeshi Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING/DIE BONDING FILM
- Publication number 20100093154
- Publication date Apr 15, 2010
- Nitto Denko Corporation
- Yasuhiro Amano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20100081258
- Publication date Apr 1, 2010
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD F...
- Publication number 20100047968
- Publication date Feb 25, 2010
- Yasuhiro Amano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND BONDING FILM
- Publication number 20100003771
- Publication date Jan 7, 2010
- Hitachi Chemical Company, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER ADHESIVE FILM FOR DIE STACKING
- Publication number 20090311520
- Publication date Dec 17, 2009
- Hwail Jin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Microwave Cure of Semiconductor Devices
- Publication number 20090253232
- Publication date Oct 8, 2009
- Gary Philip Thomson
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Combinations of two or more hardening methods provided for in at least two different groups from H01L2224/83855 - H01L2224/8388

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alignment method, method for connecting electronic component, metho...

Assembly process for circuit carrier and circuit carrier

Placement method for circuit carrier and circuit carrier

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

A-staged thermoplastic-polyimide (TPI) adhesive compound containing...

Anisotropic conductive film, method for producing anisotropic condu...

A-staged thermoplastic-polyimide (TPI) adhesive compound and method...

Adhesive composition for semiconductor and adhesive film including...

Anisotropic conductive film, method for producing anisotropic condu...

Dicing film and dicing die-bonding film

Film adhesive, dicing tape with film adhesive, method of manufactur...

Semiconductor device connected by anisotropic conductive film

Adhesive sheet for manufacturing semiconductor device, manufacturin...

Adhesive composition, and adhesive sheet, semiconductor apparatus-p...

Stress-engineered interconnect packages with activator-assisted molds

Stress-engineered interconnect packages with activator-assisted molds

Adhesive composition, film-like adhesive, adhesive sheet and semico...

Flip chip mounting method and bump forming method

Adhesive film, dicing die bonding film and semiconductor device usi...

Method for producing semiconductor chip with adhesive film, adhesiv...

Manufacturing method of resin-sealed semiconductor device

Adhesive composition suitable to be applied by screen printing

Method for producing semiconductor chip with adhesive film, adhesiv...

Production method of semiconductor device and bonding film

Dicing/die bonding film

Flip chip mounting method and bump forming method

Adhesive film composition, associated dicing die bonding film, and...

Thermosetting die-bonding film

Method and device including reworkable alpha particle barrier and c...

Thermosetting die bonding film

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Method For Manufacturing Led Display

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound Containing...

A-staged Thermoplastic-Polyimide (TPI) Adhesive Compound and Method...

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDU...

SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...

FILM ADHESIVE, DICING TAPE WITH FILM ADHESIVE, METHOD OF MANUFACTUR...

ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING...

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM

ADHESIVE COMPOSITION, AND ADHESIVE SHEET, SEMICONDUCTOR APPARATUS-P...

STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COM...

BONDING SHEET

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIV...

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICO...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

STRESS-ENGINEERED INTERCONNECT PACKAGES WITH ACTIVATOR-ASSISTED MOLDS

ADHESIVE FILM, DICING DIE BONDING FILM AND SEMICONDUCTOR DEVICE USI...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIV...

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURIN...

DICING/DIE BONDING FILM

THERMOSETTING DIE-BONDING FILM

ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD F...

PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND BONDING FILM

MULTI-LAYER ADHESIVE FILM FOR DIE STACKING

Microwave Cure of Semiconductor Devices