Combinations of two or more hardening methods provided for in at least two different groups from H01L2224/81855 - H01L2224/8188

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81885Combinations of two or more hardening methods provided for in at least two different groups from H01L2224/81855 - H01L2224/8188

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding materials comprising ball grid arrays and metal inve...
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- Issue date Sep 3, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounted structure and manufacturing method of mounted structure
- Patent number 9,603,295
- Issue date Mar 21, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Yamaguchi
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Information Patent Grant
Method and system for producing component mounting board
- Patent number 9,237,686
- Issue date Jan 12, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded structure using conductive adhesives, and a manufacturing me...
- Patent number 7,157,800
- Issue date Jan 2, 2007
- Ricoh Company, Ltd.
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE FOR SEMICONDUCTOR, PRODUCTION METHOD THEREFOR, AND SEMICON...
- Publication number 20220352116
- Publication date Nov 3, 2022
- Showa Denko Materials Co., Ltd.
- Toshiyasu AKIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR PRODUCING COMPONENT MOUNTING BOARD
- Publication number 20140158751
- Publication date Jun 12, 2014
- PANASONIC CORPORATION
- Koji Motomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTED STRUCTURE AND MANUFACTURING METHOD OF MOUNTED STRUCTURE
- Publication number 20140049930
- Publication date Feb 20, 2014
- PANASONIC CORPORATION
- Atsushi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded structure using conductive adhesives, and a manufacturing me...
- Publication number 20050062168
- Publication date Mar 24, 2005
- Takeshi Sano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR