Component over metal

Industry

CPC
H05K2201/10553

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10553Component over metal

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate structure
- Patent number 11,711,887
- Issue date Jul 25, 2023
- Autonetworks Technologies, Ltd.
- Shungo Hiratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanically-compliant and electrically and thermally conductive le...
- Patent number 11,272,618
- Issue date Mar 8, 2022
- Analog Devices International Unlimited Company
- John David Brazzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control device for an electric machine
- Patent number 11,129,270
- Issue date Sep 21, 2021
- Robert Bosch GmbH
- Harald Hundt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin substrate, component-mounting resin substrate, and method of...
- Patent number 10,741,462
- Issue date Aug 11, 2020
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit assembly with increased mounting area
- Patent number 10,652,994
- Issue date May 12, 2020
- AutoNetworks Technologies, Ltd.
- Arinobu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed-circuit board, printed-wiring board, and electronic apparatus
- Patent number 10,375,816
- Issue date Aug 6, 2019
- Canon Kabushiki Kaisha
- Keita Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal performance of logic chip in a package-on-package structure
- Patent number 10,096,534
- Issue date Oct 9, 2018
- NVIDIA Corporation
- Abraham F. Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current switch
- Patent number 10,070,514
- Issue date Sep 4, 2018
- Ellenberger & Poensgen GmbH
- Wolfgang Ullermann
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Optical apparatus, printed circuit board
- Patent number 9,977,204
- Issue date May 22, 2018
- Sumitomo Electric Industries, Ltd.
- Kaoru Oomori
- G02 - OPTICS
Information Patent Grant
Noise blocking printed circuit board and manufacturing method thereof
- Patent number 9,907,157
- Issue date Feb 27, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Se Jong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
L-bending PCB
- Patent number 9,706,645
- Issue date Jul 11, 2017
- Shenzhen China Star Optoelectronics Technology Co., Ltd.
- Hu He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder wettable flanges and devices and systems incorporating solde...
- Patent number 9,538,659
- Issue date Jan 3, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, electronic apparatus, and moving object
- Patent number 9,468,105
- Issue date Oct 11, 2016
- Seiko Epson Corporation
- Manabu Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring boards having thermal management features and therma...
- Patent number 9,433,074
- Issue date Aug 30, 2016
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal transmission device
- Patent number 9,198,277
- Issue date Nov 24, 2015
- Hitachi Metals, Ltd.
- Yoshinori Sunaga
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
PWB cooling system with heat dissipation through posts
- Patent number 9,192,043
- Issue date Nov 17, 2015
- Hamilton Sundstrand Corporation
- Rachel Farner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and light emitting device
- Patent number 9,137,890
- Issue date Sep 15, 2015
- Shinko Electric Industries Co., Ltd.
- Kazutaka Kobayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Use of a local constraint to enhance attachment of an IC device to...
- Patent number 8,432,034
- Issue date Apr 30, 2013
- International Business Machines Corporation
- Eric Vance Kline
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two dimensional light source using light emitting diode and liquid...
- Patent number 8,368,846
- Issue date Feb 5, 2013
- Samsung Display Co., Ltd.
- Gi-Cherl Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Imaging device unit and imaging apparatus
- Patent number 8,106,952
- Issue date Jan 31, 2012
- Sony Corporation
- Koji Yoshida
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backlight structure including clipping connectors
- Patent number 8,070,313
- Issue date Dec 6, 2011
- AU Optronics Corp.
- Chuan-Ho Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical power distribution unit and electrical punched grid ther...
- Patent number 8,068,348
- Issue date Nov 29, 2011
- Tyco Electronics AMP GmbH
- Gunther Chritz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a semiconductor chip assembly with a post/base hea...
- Patent number 8,003,415
- Issue date Aug 23, 2011
- Bridge Semiconductor Corporation
- Chia-Chung Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera unit
- Patent number 8,005,355
- Issue date Aug 23, 2011
- Hitachi, Ltd.
- Masaaki Fukuhara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of making printed wiring board with enhanced structural inte...
- Patent number 7,948,766
- Issue date May 24, 2011
- Harris Corporation
- Gregory M. Jandzio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly with post/base heat spreader and vertic...
- Patent number 7,948,076
- Issue date May 24, 2011
- Bridge Semiconductor Corporation
- Chia-Chung Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two dimensional light source using light emitting diode and liquid...
- Patent number 7,932,970
- Issue date Apr 26, 2011
- Samsung Electronics Co., Ltd.
- Gi-Cherl Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board (PCB)with enhanced structural integrity
- Patent number 7,907,417
- Issue date Mar 15, 2011
- Harris Corporation
- Gregory M. Jandzio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing bendable solid state lighting
- Patent number 7,871,836
- Issue date Jan 18, 2011
- Industrial Technology Research Institute
- Chien-Cheng Yang
- F21 - LIGHTING
Information Patent Grant
Backlight structure including clipping connectors
- Patent number 7,824,072
- Issue date Nov 2, 2010
- AU Optronics Corp.
- Chuan-Ho Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240064893
- Publication date Feb 22, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Wei TAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED PLATE AND WIRING BASE BOARD PRODUCTION METHOD
- Publication number 20240049395
- Publication date Feb 8, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20220361317
- Publication date Nov 10, 2022
- AUTONETWORKS TECHNOLOGIES, LTD.
- Shungo Hiratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Control Device for an Electric Machine
- Publication number 20210168927
- Publication date Jun 3, 2021
- ROBERT BOSCH GmbH
- Harald Hundt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LE...
- Publication number 20190141834
- Publication date May 9, 2019
- John David Brazzle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20180310410
- Publication date Oct 25, 2018
- AUTONETWORKS TECHNOLOGIES, LTD.
- Arinobu Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CAPACITOR BUILT-IN SUBSTRATE
- Publication number 20180132356
- Publication date May 10, 2018
- Murata Manufacturing Co., Ltd.
- TATSUYA FUNAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LE...
- Publication number 20170311447
- Publication date Oct 26, 2017
- Linear Technology Corporation
- John David BRAZZLE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL APPARATUS, PRINTED CIRCUIT BOARD
- Publication number 20170097479
- Publication date Apr 6, 2017
- Sumitomo Electric Industries, Ltd.
- Kaoru OOMORI
- G02 - OPTICS
Information Patent Application
COMPOSITE LAMINAE HAVING THERMAL MANAGEMENT FEATURES AND THERMAL MA...
- Publication number 20140318758
- Publication date Oct 30, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARDS HAVING THERMAL MANAGEMENT FEATURES AND THERMA...
- Publication number 20140318829
- Publication date Oct 30, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Mehmet Dede
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT
- Publication number 20140313682
- Publication date Oct 23, 2014
- NIHON DEMPA KOGYO CO., LTD.
- HIROYUKI MITOME
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNIFIED PCB DESIGN FOR SSD APPLICATIONS, VARIOUS DENSITY CONFIGURAT...
- Publication number 20140264904
- Publication date Sep 18, 2014
- Anthony Fai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND LIGHT EMITTING DEVICE
- Publication number 20140226346
- Publication date Aug 14, 2014
- Shinko Electric Industries Co., Ltd.
- Kazutaka KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE OF LOGIC CHIP IN A PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20140131847
- Publication date May 15, 2014
- NVIDIA Corporation
- Abraham F. Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Signal Transmission Device
- Publication number 20140133101
- Publication date May 15, 2014
- Hitachi Cable, Ltd.
- Yoshinori SUNAGA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-CAVITY WIRING BOARD FOR SEMICONDUCTOR ASSEMBLY WITH INTERNAL...
- Publication number 20140048326
- Publication date Feb 20, 2014
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lighting Device and Method for Producing a Lighting Device
- Publication number 20140042489
- Publication date Feb 13, 2014
- OSRAM GMBH
- Thomas Preuschl
- F21 - LIGHTING
Information Patent Application
Use of a Local Constraint to Enhance Attachment of an IC Device to...
- Publication number 20120299201
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Eric V. Kline
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
TWO DIMENSIONAL LIGHT SOURCE USING LIGHT EMITTING DIODE AND LIQUID...
- Publication number 20110163343
- Publication date Jul 7, 2011
- Samsung Electronics Co., Ltd.
- Gi-Cherl KIM
- G02 - OPTICS
Information Patent Application
RADIANT HEAT STRUCTURE FOR PIN TYPE POWER LED
- Publication number 20110084303
- Publication date Apr 14, 2011
- Yeon Su Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Backlight Structure Including Clipping Connectors
- Publication number 20110013380
- Publication date Jan 20, 2011
- AU Optronics Corp.
- Chuan-Ho Cheng
- G02 - OPTICS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...
- Publication number 20100003788
- Publication date Jan 7, 2010
- Bridge Semiconductor Corporation
- Chia-Chung Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND VERTIC...
- Publication number 20100001395
- Publication date Jan 7, 2010
- Bridge Semiconductor Corporation
- Chia-Chung Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING BENDABLE SOLID STATE LIGHTING
- Publication number 20090311810
- Publication date Dec 17, 2009
- Industrial Technology Research Institute
- Chien-Cheng Yang
- F21 - LIGHTING
Information Patent Application
Camera Unit
- Publication number 20090269050
- Publication date Oct 29, 2009
- Hitachi, Ltd
- Masaaki FUKUHARA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY
- Publication number 20090265930
- Publication date Oct 29, 2009
- Harris Corporation
- Gregory M. JANDZIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGING DEVICE UNIT AND IMAGING APPARATUS
- Publication number 20090153684
- Publication date Jun 18, 2009
- SONY CORPORATION
- Koji YOSHIDA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BACKLIGHT STRUCTURE
- Publication number 20090067167
- Publication date Mar 12, 2009
- AU Optronics Corp.
- Chuan-Ho Cheng
- G02 - OPTICS
Information Patent Application
ELECTRICAL POWER DISTRIBUTION UNIT AND ELECTRICAL PUNCHED GRID THER...
- Publication number 20090016035
- Publication date Jan 15, 2009
- Gunther Chritz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Component over metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate structure

Mechanically-compliant and electrically and thermally conductive le...

Control device for an electric machine

Resin substrate, component-mounting resin substrate, and method of...

Circuit assembly with increased mounting area

Printed-circuit board, printed-wiring board, and electronic apparatus

Thermal performance of logic chip in a package-on-package structure

High current switch

Optical apparatus, printed circuit board

Noise blocking printed circuit board and manufacturing method thereof

L-bending PCB

Solder wettable flanges and devices and systems incorporating solde...

Electronic component, electronic apparatus, and moving object

Printed wiring boards having thermal management features and therma...

Signal transmission device

PWB cooling system with heat dissipation through posts

Wiring board and light emitting device

Use of a local constraint to enhance attachment of an IC device to...

Two dimensional light source using light emitting diode and liquid...

Imaging device unit and imaging apparatus

Backlight structure including clipping connectors

Electrical power distribution unit and electrical punched grid ther...

Method of making a semiconductor chip assembly with a post/base hea...

Camera unit

Method of making printed wiring board with enhanced structural inte...

Semiconductor chip assembly with post/base heat spreader and vertic...

Two dimensional light source using light emitting diode and liquid...

Printed circuit board (PCB)with enhanced structural integrity

Method of manufacturing bendable solid state lighting

Backlight structure including clipping connectors

Patents Applicationslast 30 patents

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

LAYERED PLATE AND WIRING BASE BOARD PRODUCTION METHOD

SUBSTRATE STRUCTURE

Control Device for an Electric Machine

MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LE...

CIRCUIT ASSEMBLY

METHOD FOR MANUFACTURING CAPACITOR BUILT-IN SUBSTRATE

MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LE...

OPTICAL APPARATUS, PRINTED CIRCUIT BOARD

COMPOSITE LAMINAE HAVING THERMAL MANAGEMENT FEATURES AND THERMAL MA...

PRINTED WIRING BOARDS HAVING THERMAL MANAGEMENT FEATURES AND THERMA...

COMPOSITE ELECTRONIC COMPONENT

UNIFIED PCB DESIGN FOR SSD APPLICATIONS, VARIOUS DENSITY CONFIGURAT...

WIRING BOARD AND LIGHT EMITTING DEVICE

THERMAL PERFORMANCE OF LOGIC CHIP IN A PACKAGE-ON-PACKAGE STRUCTURE

Signal Transmission Device

MULTI-CAVITY WIRING BOARD FOR SEMICONDUCTOR ASSEMBLY WITH INTERNAL...

Lighting Device and Method for Producing a Lighting Device

Use of a Local Constraint to Enhance Attachment of an IC Device to...

TWO DIMENSIONAL LIGHT SOURCE USING LIGHT EMITTING DIODE AND LIQUID...

RADIANT HEAT STRUCTURE FOR PIN TYPE POWER LED

Backlight Structure Including Clipping Connectors

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND VERTIC...

METHOD OF MANUFACTURING BENDABLE SOLID STATE LIGHTING

Camera Unit

PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY

IMAGING DEVICE UNIT AND IMAGING APPARATUS

BACKLIGHT STRUCTURE

ELECTRICAL POWER DISTRIBUTION UNIT AND ELECTRICAL PUNCHED GRID THER...