Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes

Industry

CPC
H05K1/184

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/184Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Electronic element mounting substrate, electronic device, and elect...
- Patent number 12,144,114
- Issue date Nov 12, 2024
- Kyocera Corporation
- Kanae Horiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including interface terminal having outer shell a...
- Patent number 12,126,122
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Juho Yi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cable assembly, signal transmission structure, and electronic device
- Patent number 12,114,425
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Guodong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and circuit module
- Patent number 12,108,520
- Issue date Oct 1, 2024
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery pack and method of manufacture
- Patent number 12,095,046
- Issue date Sep 17, 2024
- BLACK & DECKER INC.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board configuration blocks and edge projections
- Patent number 12,082,342
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Rathnait Long
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,063,743
- Issue date Aug 13, 2024
- Nichia Corporation
- Masakazu Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,052,903
- Issue date Jul 30, 2024
- Samsung Display Co., Ltd.
- Jong-Tae Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and manufacturing method thereof
- Patent number 12,047,662
- Issue date Jul 23, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Kuei-Feng Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device comprising surface-mount device type dipoles, and...
- Patent number 12,048,099
- Issue date Jul 23, 2024
- STMicroelectronics (Grenoble 2) SAS
- Pierino Calascibetta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board, inverter, motor vehicle and method for produ...
- Patent number 11,956,895
- Issue date Apr 9, 2024
- ZF Friedrichshafen AG
- Michael Sperber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control unit and method for assembling electronic contro...
- Patent number 11,956,900
- Issue date Apr 9, 2024
- Hitachi Astemo, Ltd.
- Tomohiro Fukuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sealed interface power module housing
- Patent number 11,956,914
- Issue date Apr 9, 2024
- Virginia Tech Intellectual Properties, Inc.
- Christina DiMarino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, electronic device and electronic module
- Patent number 11,930,586
- Issue date Mar 12, 2024
- Kyocera Corporation
- Toshiyuki Hamachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a computer device
- Patent number 11,889,615
- Issue date Jan 30, 2024
- Graphcore Limited
- Stephen Felix
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antenna and assembly
- Patent number 11,888,219
- Issue date Jan 30, 2024
- Japan Aviation Electronics Industry, Limited
- Osamu Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof, and electro...
- Patent number 11,882,665
- Issue date Jan 23, 2024
- Huawei Technologies Co., Ltd.
- Zhengbao Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Creating inductors, resistors, capacitors and other structures in p...
- Patent number 11,864,327
- Issue date Jan 2, 2024
- International Business Machines Corporation
- Gerald Bartley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Fingerprint sensor and button combinations and methods of making same
- Patent number 11,829,565
- Issue date Nov 28, 2023
- Synaptics Incorporated
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for producing a camera module, camera module
- Patent number 11,818,449
- Issue date Nov 14, 2023
- Robert Bosch GmbH
- Michael Gockel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Module substrate and semiconductor module including the same
- Patent number 11,792,921
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Sunki Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, semiconductor device and method of manufacturing cir...
- Patent number 11,792,920
- Issue date Oct 17, 2023
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating carrier structure
- Patent number 11,792,938
- Issue date Oct 17, 2023
- Silicon Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
- Patent number 11,792,928
- Issue date Oct 17, 2023
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliability enhancement of press fit connectors
- Patent number 11,784,424
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic board having components in cavities and shared solder pa...
- Patent number 11,770,899
- Issue date Sep 26, 2023
- SAFRAN ELECTRONICS & DEFENSE
- Philippe Chocteau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board layout
- Patent number 11,770,900
- Issue date Sep 26, 2023
- ABB Schweiz AG
- Alok K. Lohia
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board
- Patent number 11,758,655
- Issue date Sep 12, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed electrical connector and printed circuit board thereof
- Patent number 11,757,215
- Issue date Sep 12, 2023
- Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
- Qigui Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BATTERY PACK AND METHOD OF MANUFACTURE
- Publication number 20240421365
- Publication date Dec 19, 2024
- Black & Decker Inc.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING SURFACE-MOUNT DEVICE TYPE DIPOLES, AND...
- Publication number 20240341037
- Publication date Oct 10, 2024
- STMicroelectronics (Grenoble 2) SAS
- Pierino CALASCIBETTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CARRIER BOARD
- Publication number 20240292517
- Publication date Aug 29, 2024
- ASIA PACIFIC MICROSYSTEMS, INC.
- Jer-Wei HSIEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Device
- Publication number 20240244754
- Publication date Jul 18, 2024
- MITSUBISHI ELECTRIC CORPORATION
- Yoshimichi SAITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...
- Publication number 20240237210
- Publication date Jul 11, 2024
- International Business Machines Corporation
- James D. BIELICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
- Publication number 20240237228
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FASTENER AND SEALANT
- Publication number 20240224427
- Publication date Jul 4, 2024
- LEAR CORPORATION
- Antoni PUJOL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOVEL TIMER MODULE
- Publication number 20240206085
- Publication date Jun 20, 2024
- NINGBO HAPPY ELECTRICAL CO., LTD.
- Yi WEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...
- Publication number 20240138064
- Publication date Apr 25, 2024
- International Business Machines Corporation
- James D. BIELICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL
- Publication number 20240138074
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Theron Lee Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE AND POWER SUPPLY DEVICE COMPRISING SAME
- Publication number 20240130037
- Publication date Apr 18, 2024
- LG INNOTEK CO LTD
- Sung June PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR M...
- Publication number 20240107666
- Publication date Mar 28, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- MING-HSUN LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED ELECTRICAL CONNECTOR AND PRINTED CIRCUIT BOARD THEREOF
- Publication number 20240106140
- Publication date Mar 28, 2024
- Amphenol East Asia Electronic Technology (Shenzhen) Co., Ltd.
- Qigui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL DEVICE, INVERTER, ELECTRIC DRIVE, VEHICLE AND MANUFACTUR...
- Publication number 20240098927
- Publication date Mar 21, 2024
- Valeo eAutomotive Germany GmbH
- Alexandros KOURGIALIS
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098880
- Publication date Mar 21, 2024
- KMW Inc.
- Bae Mook JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURGE SUPPRESSION DEVICE
- Publication number 20240072535
- Publication date Feb 29, 2024
- Proterial, Ltd.
- Tsukasa KONDO
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME
- Publication number 20240061537
- Publication date Feb 22, 2024
- SYNAPTICS INCORPORATED
- Brett Dunlap
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH-CURRENT ELEMENT FOR HIGH-CURRENT PRINTED CIRCUIT BOARDS
- Publication number 20240032187
- Publication date Jan 25, 2024
- ZF Friedrichshafen AG
- Michael Sperber
- B60 - VEHICLES IN GENERAL
Information Patent Application
LEAF SPRING CONNECTOR FOR LITHIUM-ION BATTERY CELLS
- Publication number 20240014515
- Publication date Jan 11, 2024
- Holding Zero, LLC
- Derek Simkowiak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD CONFIGURATION BLOCKS AND EDGE PROJECTIONS
- Publication number 20230413447
- Publication date Dec 21, 2023
- MACOM Technology Solutions Holdings, Inc.
- Rathnait Long
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKABLE VIA PACKAGE AND METHOD
- Publication number 20230354523
- Publication date Nov 2, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE-BASED SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE...
- Publication number 20230354525
- Publication date Nov 2, 2023
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH GUIDE PIN
- Publication number 20230317579
- Publication date Oct 5, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER-PROOF STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20230284401
- Publication date Sep 7, 2023
- PAX COMPUTER TECHNOLOGY (SHENZHEN) CO., LTD.
- Xiaoyan SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE SENSOR FOR AN INVERTER FOR OPERATING AN ELECTRIC DRIVE...
- Publication number 20230254976
- Publication date Aug 10, 2023
- ZF Friedrichshafen AG
- Pengshuai WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MOUNTING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20230232536
- Publication date Jul 20, 2023
- Kyocera Corporation
- Yukio MORITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20230207190
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Jaehyun KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY PACK AND METHOD OF MANUFACTURE
- Publication number 20230207899
- Publication date Jun 29, 2023
- Black & Decker Inc.
- Moriah Counts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, ELECTRONIC DEVICE AND ELECTRONIC MODULE
- Publication number 20230199937
- Publication date Jun 22, 2023
- Kyocera Corporation
- Toshiyuki HAMACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS WITH PLATED BLIND SLOTS FOR IMPROVED VERTICA...
- Publication number 20230199958
- Publication date Jun 22, 2023
- ABB Schweiz AG
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic element mounting substrate, electronic device, and elect...

Electronic device including interface terminal having outer shell a...

Cable assembly, signal transmission structure, and electronic device

Circuit board and circuit module

Battery pack and method of manufacture

Printed circuit board configuration blocks and edge projections

Printed circuit board

Electronic device and method of manufacturing the same

Camera module and manufacturing method thereof

Electronic device comprising surface-mount device type dipoles, and...

Stackable via package and method

Printed circuit board, inverter, motor vehicle and method for produ...

Electronic control unit and method for assembling electronic contro...

Sealed interface power module housing

Wiring substrate, electronic device and electronic module

Method of manufacturing a computer device

Antenna and assembly

Printed circuit board and manufacturing method thereof, and electro...

Creating inductors, resistors, capacitors and other structures in p...

Fingerprint sensor and button combinations and methods of making same

Method for producing a camera module, camera module

Module substrate and semiconductor module including the same

Circuit board, semiconductor device and method of manufacturing cir...

Method for fabricating carrier structure

Printed circuit boards with plated blind slots for improved vertica...

Reliability enhancement of press fit connectors

Electronic board having components in cavities and shared solder pa...

Printed circuit board layout

Printed circuit board

High speed electrical connector and printed circuit board thereof

Patents Applicationslast 30 patents

BATTERY PACK AND METHOD OF MANUFACTURE

ELECTRONIC DEVICE COMPRISING SURFACE-MOUNT DEVICE TYPE DIPOLES, AND...

CIRCUIT CARRIER BOARD

Circuit Device

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...

REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

FASTENER AND SEALANT

NOVEL TIMER MODULE

MODIFIED INTERNAL CLEARANCE(S) AT CONNECTOR PIN APERTURE(S) OF A CI...

REWORKING SOLDER COMPONENT WITHOUT PART REMOVAL

ELECTRONIC COMPONENT MODULE AND POWER SUPPLY DEVICE COMPRISING SAME

CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR M...

HIGH SPEED ELECTRICAL CONNECTOR AND PRINTED CIRCUIT BOARD THEREOF

ELECTRICAL DEVICE, INVERTER, ELECTRIC DRIVE, VEHICLE AND MANUFACTUR...

ELECTRONIC DEVICE

SURGE SUPPRESSION DEVICE

FINGERPRINT SENSOR AND BUTTON COMBINATIONS AND METHODS OF MAKING SAME

HIGH-CURRENT ELEMENT FOR HIGH-CURRENT PRINTED CIRCUIT BOARDS

LEAF SPRING CONNECTOR FOR LITHIUM-ION BATTERY CELLS

PRINTED CIRCUIT BOARD CONFIGURATION BLOCKS AND EDGE PROJECTIONS

STACKABLE VIA PACKAGE AND METHOD

NITRIDE-BASED SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE...

SEMICONDUCTOR PACKAGE WITH GUIDE PIN

TAMPER-PROOF STRUCTURE AND ELECTRONIC DEVICE

TEMPERATURE SENSOR FOR AN INVERTER FOR OPERATING AN ELECTRIC DRIVE...

ELECTRONIC MOUNTING SUBSTRATE AND ELECTRONIC DEVICE

CAPACITOR AND ELECTRONIC DEVICE COMPRISING SAME

BATTERY PACK AND METHOD OF MANUFACTURE

WIRING SUBSTRATE, ELECTRONIC DEVICE AND ELECTRONIC MODULE

PRINTED CIRCUIT BOARDS WITH PLATED BLIND SLOTS FOR IMPROVED VERTICA...