Patent Application
20240098880
The present disclosure relates to an electronic device, and more specifically, to an electronic device including a heat dissipation unit capable of improving heat dissipation performance on an opposite surface of a printed circuit board on which a heat-generating element is mounted while preventing limitations in a pattern circuit design of the printed circuit board.
In general, an electronic device includes a printed circuit board (PCB) 1000, and as shown in
One surface of the printed circuit board 1000 may be provided with at least one heat-generating element Tr that is driven by supplied power and emits a predetermined amount of heat. When the heat emitted from the heat-generating element Tr is not quickly dissipated to the outside, the inherent performance of the electronic device may be deteriorated. In particular, as shown in
In this case, as shown in
However, in order for the heat transfer coin 2100 to be inserted and installed in a completely embedded form, the printed circuit board 1000 needs to be manufactured to have a large thickness of at least 2.5 mm as shown in (A) of
Since the thickness of the printed circuit board 1000 needs to be 2.5 mm or more, there is a problem in that design to dissipate heat transmitted through the printed circuit board 1000 the rear side is difficult.
The present disclosure is directed to providing an electronic device capable of removing limitations in a thickness of a printed circuit board by removing a process of inserting a heat transfer coin into the printed circuit board, and improving heat dissipation performance.
Objects of the present disclosure are not limited to the above-described objects, and other objects that are not mentioned will be able to be clearly understood by those skilled in the art from the following description.
In order to achieve the objects, an electronic device according to the present disclosure includes a printed circuit board including a heat-generating element arranged on one surface of the printed circuit board; and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element.
The printed circuit board may be formed with an element mounting hole through which the heat-generating element passes, and the heat transfer coin may cover the element mounting hole, the one surface being in contact with a heat-generating surface of the heat-generating element.
The heat transfer coin may be made of copper or brass.
The electronic device according to the present disclosure may further include a heat pipe having a straight line shape and including one end in contact with the other surface of the heat transfer coin and the other end protruding outward in a direction parallel to the other surface of the printed circuit board.
The heat transfer coin may be formed with a heat-generating surface receiving groove for accommodating a part of an end including the heat-generating surface of the heat-generating element.
The heat transfer coin may be surface-adhered to the other surface of the printed circuit board by using a conductive adhesive.
The heat transfer coin may be closely coupled to the other surface of the printed circuit board by using an assembly screw passing through the printed circuit board.
The electronic device according to the present disclosure may further include a shield cover that covers the one surface of the printed circuit board to prevent leakage of signals generated from the heat-generating element, and the heat transfer coin may be closely coupled to the other surface of the printed circuit board by using an assembly screw passing through the shield cover and the printed circuit board.
The printed circuit board may be formed in a multilayer and may have a thickness of 1.6 mm or less.
The printed circuit board may include a plurality of sections divided in a direction parallel to the one surface of the printed circuit board by a plating part that forms a circuit printed on the one surface of the printed circuit board. The element mounting hole may be formed in the plurality of sections one by one to be formed as a plurality of element mounting holes. The heat-generating element may be formed as a plurality of heat-generating elements passing through the plurality of element mounting holes, respectively. The heat transfer coin may be formed as a plurality of heat transfer coins each having one surface with which a heat-generating surface of each of the plurality of heat-generating elements comes into contact.
An electronic device according to the present disclosure includes a metal housing having an installation space therein, a printed circuit board stacked on an inner surface of the metal housing and including a heat-generating element arranged on one surface of the printed circuit board, and a heat transfer coin provided such that one surface of the heat transfer coin comes into contact with a portion of the other surface of the printed circuit board, opposite to the heat-generating element, so as to dissipate heat generated from the heat-generating element.
An inner surface of the metal housing may be formed with a seating groove into which the heat transfer coin is completely inserted.
The heat transfer coin may be closely coupled to the other surface of the printed circuit board by a board assembly screw fastened to a board screw fastening hole provided on an inner surface of the metal housing by passing through the printed circuit board.
Specific details of other embodiments are included in the detailed description and drawings.
An electronic device according to the present disclosure can achieve the following various effects.
First, the present disclosure has the effect of removing the need for additional processes such as groove processing on a printed circuit board in order to install a heat dissipation unit including a heat transfer coin on the printed circuit board.
Second, the present disclosure has no need to adopt a printed circuit board with specifications having a predetermined thickness or more, and has the effect of improving heat dissipation performance in that heat can be dissipated on both sides of the printed circuit board because a printed circuit board with a small thickness can be adopted.
Effects of the present disclosure are not limited to the above-described effects, and other effects that are not mentioned will be able to be clearly understood by those skilled in the art from the following description.
Hereinafter, an electronic device according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.
It is to be noted that in assigning reference numerals to elements in the drawings, the same reference numerals denote the same elements throughout the drawings even in cases where the elements are shown in different drawings. Furthermore, in describing the embodiments of the present disclosure, a detailed description of the known configurations or functions will be omitted if it is deemed to obscure the understanding for the embodiments of the present disclosure.
In describing the elements of the embodiments the present disclosure, terms, such as the first, the second, A, B, (a), and (b) may be used. However, the terms are used only to distinguish one element from the other element, and the essence, order, or sequence of the elements is not limited by the terms. Furthermore, unless otherwise defined, all terms used herein including technical or scientific terms have the same meanings as the terms generally understood by those skilled in the art to which the present disclosure pertains. The terms, such as terms defined in dictionaries, which are generally used, should be interpreted as having meanings identical to contextual meanings of the related art, and are not interpreted as ideal or excessively formal meanings unless they are definitely defined in the present disclosure.
In the following description, one surface may refer to an upper surface in the drawing, the other surface may refer to a lower surface in the drawing, and the other side may refer to a lower side in the drawing.
As shown in
Although not shown in the drawings, in the printed circuit board 10, a plurality of raw material boards may be stacked to form a multilayer, a pattern circuit may be printed on each layer, and a via hole for electrically connecting the pattern circuits of the respective layers may be formed by plating.
As shown in
The at least one heat-generating element 20 may be inserted into the element mounting hole 15 from one surface side of the printed circuit board 10 so that a mounting piece (not shown) is mounted on one surface of the printed circuit board 10 and the heat-generating surface protrudes toward the other surface side of the printed circuit board 10. That is, the heat-generating surface of the heat-generating element 20 may protrude further outward than at least the other surface of the printed circuit board 10.
The at least one heat-generating element 20 is a type of electrical element that generates a predetermined amount of heat while operating when power is supplied. For example, in the embodiment of the present disclosure, when the electronic device 1 is an antenna device, the heat-generating surface may be any one of Rx and Tx elements responsible for output and transmission of signals.
As shown in
As shown in
The heat-generating element 20 may include a first heat-generating element 20 that generates a relatively large amount of heat, and a second heat-generating element that generates a relatively small amount of heat (not shown, see reference numeral 21 in
The heat transfer coins 210 and 220 may include a first heat transfer coin 210 that receives heat from the first heat-generating element 20, and a second heat transfer coin 220 that receives heat from the second heat-generating element (not shown).
The heat-generating element 20 may be arranged on the one surface of the printed circuit board 10 to protrude, and the heat transfer coins 210 and 220 may each be provided such that one surface thereof comes into contact with a portion of the other surface of the printed circuit board 10, opposite to the heat-generating element 20. The opposite side of the heat-generating element 20 may refer to an opposite part corresponding to the one surface on which the heat-generating element 20 is arranged, and the one surface of each of the heat transfer coins 210 and 220 may come into contact with a portion of the other surface of the printed circuit board 10 corresponding to the one surface on which the heat-generating element 20 is arranged.
The heat transfer coins 210 and 220 may each be made of a metal material with excellent heat dissipation performance. In the present embodiment, the heat transfer coins 210 and 220 may each be arranged so that the one surface thereof comes into contact with the other surface of the printed circuit board 10. The one surface of the first heat transfer coin 210 may be arranged on the other surface of the printed circuit board 10 to cover the element mounting hole 15.
The heat transfer coins 210 and 220 are each formed in a rectangular plate shape in the present embodiment, but do not necessarily have to be formed in a rectangular plate shape, and may be formed in at least one plate shape of a circular plate and a polygonal plate (triangular plate, pentagonal plate, hexagonal plate, or the like).
The heat pipe 230 may directly receive heat from one (the first heat transfer coin 210) of the heat transfer coins 210 and 220 in consideration of the amount of heat generation of the heat transfer coins 210 and 220. Although not shown in the drawings, the heat pipe 230 may be connected to both the heat transfer coins 210 and 220 to receive heat. Hereinafter, the heat pipe 230 will be described focusing on an example in which the heat pipe 230 is connected only to the first heat transfer coin 210 out of the first heat transfer coin 210 and the second heat transfer coin 220.
A heat-generating surface of the first heat-generating element 20 may be arranged in contact with the one surface of the first heat transfer coin 210, and one end of the heat pipe 230 may be arranged in contact with the other surface of the first heat transfer coin 210. The other end of the heat pipe 230 may be arranged to protrude from the printed circuit board 10 to the outside in a direction parallel to the other surface of the printed circuit board 10 (to the right in a left-right direction in
The first heat transfer coin 210 may be formed on the one surface thereof with a heat-generating surface receiving groove 215 for accommodating the heat-generating surface of the heat-generating element 20. The heat-generating surface receiving groove 215 may accommodate a part of an end including the heat-generating surface of the heat-generating element 20. More specifically, the heat-generating surface of the heat-generating element 20 mounted on the other surface of the printed circuit board 10 to pass through the element mounting hole 15 may protrude to the other side of the printed circuit board 10 by a predetermined length, and in the state in which the one surface of the first heat transfer coin 210 comes into surface contact with the other surface of the printed circuit board 10, the protruding heat-generating surface of the heat-generating element 20 may be received and seated inside the heat-generating surface receiving groove 215 and may come into thermal contact with the heat-generating surface receiving groove 215.
Although not shown in the drawings, the heat transfer coins 210 and 220 may be surface-adhered to the other surface of the printed circuit board 10 by using a conductive adhesive. The conductive adhesive (not shown) may be made of a conductive material, and may improve the conduction performance of heat transferred from the printed circuit board 10 by bonding the other surface of the printed circuit board 10 and the heat transfer coins 210 and 220 to each other.
In particular, since the heat transfer coin 210 is coupled to the other surface of the printed circuit board 10 so as not to overlap in a horizontal direction, there is no need to separately groove the printed circuit board 10 in order to install the heat transfer coin 210 on the other surface of the printed circuit board 10, so that it is possible to reduce assembly man-hours and to shorten the manufacturing time of the printed circuit board 10.
The heat-generating surface of the heat-generating element 20 may be received and seated in the heat-generating surface receiving groove 215 of the heat transfer coin 210, and driving heat generated from the heat-generating element 20 may be directly transmitted to the heat transfer coin 210. The heat transferred to the heat transfer coin 210 may be dissipated through the heat pipe 230 described above, or may be directly transferred to a metal housing (not shown) and dissipated.
Referring to
In the present embodiment, the plurality of sections S1 to S4 may be formed into four, but the number of the plurality of sections S1 to S4 is not limited to four and the printed circuit board 10 may be formed into at least two or more sections. Hereinafter, only an example in which the plurality of sections S1 to S4 are formed into four will be described.
The plurality of sections S1 to S4 may include a first section S1, a second section S2, a third section S3, and a fourth section S4.
The first section S1 may be arranged on the leftmost side of the printed circuit board 10. The first section S1 may be arranged on the left side of the second section S2 on the printed circuit board 10.
The second section S2 may be arranged on the right side of the first section S1 on the printed circuit board 10. The second section S2 may be arranged on the left side of the third section S3 on the printed circuit board 10. The second section S2 may be arranged between the first section S1 and the third section S3 on the printed circuit board 10.
The third section S3 may be arranged on the right side of the second section S2 on the printed circuit board 10. The third section S3 may be arranged on the left side of the fourth section S4 on the printed circuit board 10. The third section S3 may be arranged between the second section S2 and the fourth section S4 on the printed circuit board 10.
The fourth section S4 may be arranged on the right side of the third section S3 on the printed circuit board 10. The fourth section S4 may be arranged on the rightmost side of the printed circuit board 10.
The element mounting hole 15 may be formed as a plurality of element mounting holes 15. The plurality of element mounting holes 15 may be formed in the plurality of sections S1 to S4 one by one. That is, the plurality of element mounting holes 15 include a first element mounting hole 15A formed in the first section S1, a second element mounting hole 15B formed in the second section S2, a third element mounting hole 15C formed in the third section S3, and a fourth element mounting hole 15D formed in the fourth section S4.
The first heat-generating element 20 may be formed as a plurality of first heat-generating elements 20. The plurality of first heat-generating elements 20 may pass through the plurality of element mounting holes 15, respectively. That is, the plurality of first heat-generating elements 20 include a first-first heat-generating element 20A passing through the first element mounting hole 15A, a first-second heat-generating element 20B passing through the second element mounting hole 15B, a first-third heat-generating element 20C passing through the third element mounting hole 15C, and a first-fourth heat-generating element 20D passing through the fourth element mounting hole 15D.
The first heat transfer coin 210 may be formed as a plurality of first heat transfer coins 210. The heat-generating surface of each of the plurality of first heat-generating elements 20 may come into contact with one surface of each of the plurality of first heat transfer coins 210. That is, the plurality of first heat transfer coins 210 may include a first-first heat transfer coin 210A with which a heat-generating surface of the first-first heat-generating element 20A comes into contact, a first-second heat transfer coin 210B with which a heat-generating surface of the first-second heat-generating element 20B comes into contact, a first-third heat transfer coin 210C with which a heat-generating surface of the first-third heat-generating element 20C comes into contact, and a first-fourth heat transfer coin 210D with which a heat-generating surface of the first-fourth heat-generating element 20D comes into contact.
The heat-generating surface receiving groove 215 may be formed on the one surface of each of the plurality of first heat transfer coins 20. That is, the heat-generating surface receiving grooves 215 may include a first heat-generating surface receiving groove 215A formed in one surface of the first-first heat transfer coin 210A to receive the heat-generating surface of the first-first heat-generating element 20A, a second heat-generating surface receiving groove 215B formed in one surface of the first-second heat transfer coin 210B to receive the heat-generating surface of the first-second heat-generating element 20B, a third heat-generating surface receiving groove 215C formed in one surface of the first-third heat transfer coin 210C to receive the heat-generating surface of the first-third heat-generating element 20C, and a fourth heat-generating surface receiving groove 215D formed in one surface of the first-fourth heat transfer coin 210D to receive the heat-generating surface of the first-fourth heat-generating element 20D.
The second heat-generating element (not shown) may be formed as a plurality of second heat-generating elements. The plurality of second heat-generating elements may be installed on one surfaces of the plurality of sections S1 to S4 one by one. That is, the plurality of second heat-generating elements may include a second-first heat-generating element installed on the one surface of the first section S1, a second-second heat-generating element installed on the one surface of the second section S2, a second-third heat-generating element installed on the one surface of the third section S3, and a second-fourth heat-generating element installed on the one surface of the fourth section S4.
The second heat transfer coin 220 may be formed as a plurality of second heat transfer coins 220. That is, the plurality of second heat transfer coins 220 may include a second-first heat transfer coin 220A arranged on the opposite side of the second-first heat-generating element on the other surface of the printed circuit board 10, a second-second heat transfer coin 220B arranged on the opposite side of the second-second heat-generating element on the other surface of the printed circuit board 10, a second-third heat transfer coin 220C arranged on the opposite side of the second-third heat-generating element on the other surface of the printed circuit board 10, and a second-fourth heat transfer coin 220D arranged on the opposite side of the second-fourth heat-generating element on the other surface of the printed circuit board 10.
The heat pipe 230 may be provided as a plurality of heat pipes 230 being arranged in contact with the other surface of each of the plurality of first heat transfer coins 210 by one pair. That is, the plurality of heat pipes 230 may include a pair of a first-first heat pipes 230A arranged in contact with the other surface of the first-first heat transfer coin 210A, a pair of second heat pipes 230B arranged in contact with the other surface of the first-second heat transfer coin 210B, a pair of third heat pipes 230C arranged in contact with the other surface of the a first-third heat transfer coin 210C, and a pair of fourth heat pipes 230D arranged in contact with the other surface of the first-fourth heat transfer coin 210D.
When the electronic device 1 according to an embodiment of the present disclosure is implemented as an antenna device, the electronic device 1 may further include a shield cover 100 as shown in
The shield cover 100 may be provided with a grid-shaped shield cover wall 103 that forms a predetermined space C for accommodating at least one heat-generating element 20 on a surface facing the printed circuit board 10. The predetermined space C may be covered by the shield cover wall 103 and the one surface of the printed circuit board 10. Such a shield cover 100 may serve to prevent the leakage of signals so that there is no interference between the heat-generating element 20 within the predetermined space C and external signals.
The shield cover 100 may be formed with cover screw through holes 101 through which assembly screws (not shown) to be described below pass, the printed circuit board 10 may be formed with substrate screw through holes 11 so that the assembly screws having passed through the cover screw through holes 101 of the shield cover 100 sequentially pass through the substrate screw through holes 11, and at least the first heat transfer coin 210 of the heat transfer coins 210 and 220 may be formed with screw fastening holes 211 into which the assembly screws are fastened. When a metal housing 5 (see
The heat-generating surface of the heat-generating element 20 and the mutual bonding surface of the heat transfer coin 210 are closely adhered by the assembling force of the assembling screws, so that thermal contact resistance from the heat-generating element 20 to the heat transfer coin 210 can be minimized.
As described above, the electronic device 1 according to an embodiment of the present disclosure has an advantage capable of preventing deterioration of overall heat dissipation performance because it is not necessary to adopt a multi-layer printed circuit board 10 having a predetermined thickness (for example, 2.5 mm) or more for installation of at least the heat transfer coins 210 and 220 in the heat dissipation unit 200 and it is possible to adopt a printed circuit board 10 having a predetermined small thickness (for example, 1.6 mm) or less that facilitates heat transfer to both sides.
Moreover, since it is not necessary to install the heat transfer coins 210 and 220 of the heat dissipation unit 200 in an embedded form on the printed circuit board 10 and the heat transfer coins 210 and 220 can be easily attached using a conductive adhesive even without grooving the other surface of the printed circuit board 10, the electronic device 1 has an advantage capable of shortening the assembly time of an entire product.
As shown in
The metal housing 5 is made of a metal material with excellent heat conduction, and a plurality of heat sink fins 5a may be integrally formed on the rear surface side of the metal housing 5. The plurality of heat sink fins 5a may be formed such that a plurality of fins long in a vertical direction may be spaced apart from one another in a left-right direction.
On the inner surface of the installation space 5s (see
The electronic device 1a according to another embodiment of the present disclosure may further include a printed circuit board 10 stacked on the inner surface of the installation space 5s of the metal housing 5 and formed with an element mounting hole 15 passing through in a front-rear direction.
Since the mounting form of the heat-generating elements 20 and 21 (in particular, the first heat-generating element 20), which will be described below, to the element mounting hole 15 is the same as in the case of the electronic device 1 according to an embodiment of the present disclosure described above, detailed description thereof will be omitted. However, out of the heat-generating elements 20 and 21 to be described below, the second heat-generating element 21 is an electrical component with a relatively low amount of heat generation (for example, in the case of a signal-related component of an antenna device, an Rx element (LNA) may correspond to the electrical component), and may be directly mounted on the front surface of the printed circuit board 10 without providing the element mounting hole 15.
As shown in
When the electronic device 1a according to another embodiment of the present disclosure is implemented as an antenna device, the first heat-generating element 20 may be a Tx element (Tr, Da element) with a relatively large amount of heat generation among signal-related components, and the second heat-generating element 21 may be an Rx element (LNA element) with a relatively small amount of heat generation among the signal-related components.
Preferably, the heat-generating surface of the first heat-generating element 20 passes through the element mounting hole 15 and is exposed to the other surface of the printed circuit board 10, and the heat-generating surface of the first heat-generating element 20 and the other surface of the printed circuit board 10 form the same surface.
The electronic device 1a according to another embodiment of the present disclosure may further include the heat transfer coins 210 and 220 coupled to the other surface of the printed circuit board 10 and coupled in surface thermal contact with the exposed heat-generating surface of the first heat-generating element 20.
The heat transfer coins 210 and 220 may include a first heat transfer coin 210 provided corresponding to a position of the first heat-generating element 20 to receive heat from the first heat-generating element 20, and a second heat transfer coin 220 provided corresponding to a position of the second heat-generating element 21 to receive heat from the second heat-generating element 21.
The first heat transfer coin 210 may be arranged to be in direct surface thermal contact with the heat-generating surface of the first heat-generating element 20, while the second heat transfer coin 220 is not in direct surface thermal contact with the second heat-generating element 21, but may be adhered to the other surface of the printed circuit board 10, corresponding to the opposite surface of the first heat-generating element 20 on which the first heat transfer coin 210 is mounted, by using the conductive adhesive described above. The first heat transfer coin 210 and the second heat transfer coin 220 may each made of copper or brass among metal materials with excellent heat conduction, as described in the electronic device 1 according to an embodiment of the present disclosure described above.
The electronic device 1a according to another embodiment of the present disclosure may further include a shield cover 100 coupled to the front end of the metal housing 5 to cover one surface of the printed circuit board 10, as shown in
As in the embodiment already described above, the shield cover 100 may be provided with a shield cover wall (not indicated by reference numeral) formed on the rear surface thereof, may be provided with a predetermined space C for accommodating the first heat-generating element 20 and the second heat-generating element 21 between the shield cover 100 and the front surface of the printed circuit board 10, and may serve to prevent the leakage of internal signals on the predetermined space C.
One surface of the metal housing 5 facing the other surface of the printed circuit board 10 may be open, the printed circuit board 10 may be inserted into the installation space 5s of the metal housing 5 through the opened one surface of the metal housing 5, and the shield cover 100 may cover the opened one surface of the metal housing 5 after the printed circuit board 10 is inserted into the installation space 5s of the metal housing 5.
The printed circuit board 10 may be formed with a board screw through hole 11 through which at least one board assembly screw 10s passes, and the metal housing 5 may be formed with a board screw fastening hole 5h into which the board assembly screw 10s is fastened by passing through the printed circuit board 10.
The shield cover 100 may be formed with a cover screw through hole 100h through which at least one cover assembly screw 100s passes, and the cover assembly screw 100s may be fastened into a cover screw fastening hole 5h′ formed in the metal housing 5 by passing through the cover screw through hole 100h of the shield cover 100 and the printed circuit board 10, so that the shield cover 100 may be installed on the metal housing 5.
The heat transfer coins 210 and 220 may be closely coupled to the other surface of the printed circuit board 10 by the board assembly screw 10s fastened into the board screw fastening hole 5h provided on the inner surface of the metal housing 5 by passing through the printed circuit board 10.
As described above, the electronic device 1a according to another embodiment of the present disclosure is different from the embodiment described above in that the metal housing 5 is further provided, but since it is not necessary to adopt the printed circuit board 10 having a predetermined thickness (2.5 mm) or more in order to install the first heat transfer coin 210 and the second heat transfer coin 220 of the heat dissipation unit 200 on the printed circuit board 10 and separate groove processing is not necessary, assembly time can be shortened, and a small thickness (for example, 1.6 mm) can be adopted, thereby providing an advantage of improving heat dissipation performance on both sides of the printed circuit board 10.
Above, embodiments of the electronic device according to the present disclosure have been described in detail with reference to the attached drawings. However, embodiments of the present disclosure are not necessarily limited to the above-described embodiments, and it is natural that various modifications and implementations in an equivalent range can be made by those skilled in the art. Accordingly, the true scope of the present disclosure will be determined by the claims to be described below.
The present disclosure provides an electronic device capable of removing limitations in a thickness of a printed circuit board by removing a process of inserting a heat transfer coin into the printed circuit board, and improving heat dissipation performance.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2021-0070796 | Jun 2021 | KR | national |
| 10-2022-0065241 | May 2022 | KR | national |
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/KR2022/007554 | May 2022 | US |
| Child | 18525872 | US |
