Components mounted in and supported by recessed areas of the printed circuit board

Industry

CPC
H05K1/183

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/183Components mounted in and supported by recessed areas of the printed circuit board

Industries

Patents Grantslast 30 patents

Information Patent Grant
Component carrier having component covered with ultra-thin transiti...
- Patent number 11,963,310
- Issue date Apr 16, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,963,311
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample holder and superconducting quantum computer
- Patent number 11,956,889
- Issue date Apr 9, 2024
- NEC Corporation
- Yoshihito Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 11,947,164
- Issue date Apr 2, 2024
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diagnostic disc with a high vacuum and temperature tolerant power s...
- Patent number 11,924,972
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Phillip A. Criminale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,917,757
- Issue date Feb 27, 2024
- Murata Manufacturing Co., Ltd.
- Hiroki Maegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible catheter-based in vivo detection device and system
- Patent number 11,903,565
- Issue date Feb 20, 2024
- Innovex Medical Co., Ltd.
- Hang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,903,129
- Issue date Feb 13, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chi Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 11,882,660
- Issue date Jan 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-incorporated substrate and method for manufacturing same
- Patent number 11,871,524
- Issue date Jan 9, 2024
- Fujikura Ltd.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Z-axis interconnection with protruding component
- Patent number 11,864,319
- Issue date Jan 2, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Mario Schober
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure with embedded electronic components and method...
- Patent number 11,864,329
- Issue date Jan 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical element, method of preparing an electrical element for a...
- Patent number 11,864,321
- Issue date Jan 2, 2024
- TE Connectivity Germany GmbH
- Rudi Blumenschein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,856,701
- Issue date Dec 26, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyun Woo Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 11,856,710
- Issue date Dec 26, 2023
- INNOLUX CORPORATION
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency signal coupling to surface emitters
- Patent number 11,855,415
- Issue date Dec 26, 2023
- CREDO TECHNOLOGY GROUP LIMITED
- Xike Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and spectroscopic camera
- Patent number 11,841,269
- Issue date Dec 12, 2023
- Seiko Epson Corporation
- Daisuke Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 11,842,893
- Issue date Dec 12, 2023
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for capturing data
- Patent number 11,838,613
- Issue date Dec 5, 2023
- ALLIED VISION TECHNOLOGIES GMBH
- Ralf Steffen Hesterberg
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Three-dimensional molded circuit component
- Patent number 11,839,023
- Issue date Dec 5, 2023
- MAXELL, LTD.
- Atsushi Yusa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Manufacturing method of circuit board assembly
- Patent number 11,825,595
- Issue date Nov 21, 2023
- HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic sensor and torque sensing device having the same
- Patent number 11,808,648
- Issue date Nov 7, 2023
- Denso Corporation
- Ken Tanaka
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component built-in wiring substrate
- Patent number 11,792,937
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Takahiro Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and electronic device having the camera module
- Patent number 11,778,296
- Issue date Oct 3, 2023
- TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
- Jing-Wei Li
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic board having components in cavities and shared solder pa...
- Patent number 11,770,899
- Issue date Sep 26, 2023
- SAFRAN ELECTRONICS & DEFENSE
- Philippe Chocteau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods related to nested filters
- Patent number 11,765,814
- Issue date Sep 19, 2023
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opto-mechanical structure design of thin LGA package with glass cov...
- Patent number 11,754,440
- Issue date Sep 12, 2023
- PixArt Imaging Inc.
- Sai Mun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,758,655
- Issue date Sep 12, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Eun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE FILM AND DISPLAY PANEL
- Publication number 20240147607
- Publication date May 2, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Xin LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240136325
- Publication date Apr 25, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240130050
- Publication date Apr 18, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240120243
- Publication date Apr 11, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND SUBSTRATE MODULE
- Publication number 20240107676
- Publication date Mar 28, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiko SUGIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NESTED FILTERS
- Publication number 20240090123
- Publication date Mar 14, 2024
- Skyworks Solutions, Inc.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240090140
- Publication date Mar 14, 2024
- FUJIKURA LTD.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARDS, PRINTED WIRING BOARD ASSEMBLIES, AND ELECTRO...
- Publication number 20240064906
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME
- Publication number 20240055340
- Publication date Feb 15, 2024
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20240057264
- Publication date Feb 15, 2024
- Innolux Corporation
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20240040687
- Publication date Feb 1, 2024
- Avary Holding (Shenzhen) Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20240040686
- Publication date Feb 1, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Maria BØE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMALLER MODULE BY STACKING
- Publication number 20240038743
- Publication date Feb 1, 2024
- Dingyou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRA...
- Publication number 20240032202
- Publication date Jan 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Yun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240032200
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Taihwan CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND DISPLAY DEVICE
- Publication number 20240023248
- Publication date Jan 18, 2024
- KYOCERA CORPORATION
- Nobuyuki HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER S...
- Publication number 20240023246
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Phillip A. Criminale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD MODULE
- Publication number 20240023245
- Publication date Jan 18, 2024
- CHICONY ELECTRONICS CO., LTD.
- Hsueh Hua Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Systems and Methods Providing High-Density Memory Arrangements with...
- Publication number 20240015890
- Publication date Jan 11, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT WRITE DUAL CURE GASKET
- Publication number 20240002692
- Publication date Jan 4, 2024
- Raytheon Company
- Susan C. Trulli
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD ASSEMBLY FOR BLOCKING UNWANTED LIGHT, CAMERA MODULE,...
- Publication number 20230413426
- Publication date Dec 21, 2023
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- YING-LIN CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRING BOARD AND MODULE
- Publication number 20230413439
- Publication date Dec 21, 2023
- MURATA MANUFACTURING CO., LTD.
- Issei YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230411313
- Publication date Dec 21, 2023
- Fuji Electric Co., Ltd.
- Akira HIRAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER S...
- Publication number 20230413446
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Phillip A. Criminale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR MOUNT...
- Publication number 20230395322
- Publication date Dec 7, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Soohwan Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20230389191
- Publication date Nov 30, 2023
- InnoLux Corporation
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20230389185
- Publication date Nov 30, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Zhi GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAS SENSOR
- Publication number 20230375723
- Publication date Nov 23, 2023
- Airthings ASA
- Bjørn Magne SUNDAL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR
- Publication number 20230375724
- Publication date Nov 23, 2023
- Airthings ASA
- Bjørn Magne SUNDAL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTO-MECHANICAL STRUCTURE DESIGN OF THIN LGA PACKAGE WITH GLASS COVER
- Publication number 20230366730
- Publication date Nov 16, 2023
- PixArt Imaging Inc.
- Sai Mun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Components mounted in and supported by recessed areas of the printed circuit board

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component carrier having component covered with ultra-thin transiti...

Printed circuit board and method of manufacturing the same

Sample holder and superconducting quantum computer

Photonic wafer communication systems and related packages

Diagnostic disc with a high vacuum and temperature tolerant power s...

Circuit board

Flexible catheter-based in vivo detection device and system

Printed circuit board

Manufacturing method of package structure

Embedded component package structure and manufacturing method thereof

Component-incorporated substrate and method for manufacturing same

Z-axis interconnection with protruding component

Packaging structure with embedded electronic components and method...

Electrical element, method of preparing an electrical element for a...

Printed circuit board

Method of manufacturing an electronic device

High frequency signal coupling to surface emitters

Electronic apparatus and spectroscopic camera

Printed circuit board and package substrate including same

Method for capturing data

Three-dimensional molded circuit component

Manufacturing method of circuit board assembly

Magnetic sensor and torque sensing device having the same

Circuit board structure and method for manufacturing a circuit boar...

Component built-in wiring substrate

Camera module and electronic device having the camera module

Electronic board having components in cavities and shared solder pa...

Devices and methods related to nested filters

Opto-mechanical structure design of thin LGA package with glass cov...

Printed circuit board

Patents Applicationslast 30 patents

CONDUCTIVE FILM AND DISPLAY PANEL

CIRCUIT BOARD AND MANUFACTURING METHOD

EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

CIRCUIT MODULE AND SUBSTRATE MODULE

NESTED FILTERS

COMPONENT-INCORPORATED SUBSTRATE AND METHOD FOR MANUFACTURING SAME

PRINTED WIRING BOARDS, PRINTED WIRING BOARD ASSEMBLIES, AND ELECTRO...

PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

CIRCUIT BOARD ASSEMBLY

PRINTED CIRCUIT BOARD ASSEMBLY

SMALLER MODULE BY STACKING

PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRA...

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME

WIRING BOARD AND DISPLAY DEVICE

DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER S...

CIRCUIT BOARD MODULE

Systems and Methods Providing High-Density Memory Arrangements with...

DIRECT WRITE DUAL CURE GASKET

CIRCUIT BOARD ASSEMBLY FOR BLOCKING UNWANTED LIGHT, CAMERA MODULE,...

WIRING BOARD AND MODULE

SEMICONDUCTOR DEVICE

DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT POWER S...

MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR MOUNT...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF

GAS SENSOR

SENSOR

OPTO-MECHANICAL STRUCTURE DESIGN OF THIN LGA PACKAGE WITH GLASS COVER