Components mounted in and supported by recessed areas of the printed circuit board

Industry

CPC
H05K1/183

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/183Components mounted in and supported by recessed areas of the printed circuit board

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sample holder and superconducting quantum computer
- Patent number 12,232,248
- Issue date Feb 18, 2025
- NEC Corporation
- Yoshihito Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,232,268
- Issue date Feb 18, 2025
- Ibiden Co., Ltd.
- Hirotaka Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly for blocking unwanted light, camera module,...
- Patent number 12,225,660
- Issue date Feb 11, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Ying-Lin Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Terminal device
- Patent number 12,219,714
- Issue date Feb 4, 2025
- HONOR DEVICE CO., LTD.
- Yihe Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 12,211,781
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring boards, printed wiring board assemblies, and electro...
- Patent number 12,207,411
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sample holder and superconducting quantum computer
- Patent number 12,207,393
- Issue date Jan 21, 2025
- NEC Corporation
- Yoshihito Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portable electronic device, and image-capturing device and assembly...
- Patent number 12,200,336
- Issue date Jan 14, 2025
- Shine Optics Technology Company Limited
- Jie-Qiao Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,193,167
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,193,156
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,185,471
- Issue date Dec 31, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embeddable semiconductor-based capacitor
- Patent number 12,159,945
- Issue date Dec 3, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 12,156,348
- Issue date Nov 26, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,144,116
- Issue date Nov 12, 2024
- LG Innotek Co., Ltd
- Jong Bae Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board PCB assembly and electronic device
- Patent number 12,127,347
- Issue date Oct 22, 2024
- HONOR DEVICE CO., LTD.
- Zhijie Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Opto-mechanical structure design of thin LGA package with glass cover
- Patent number 12,117,337
- Issue date Oct 15, 2024
- PixArt Imaging Inc.
- Sai Mun Lee
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,114,428
- Issue date Oct 8, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yun Je Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat removal from silicon photonics chip using a recessed side-by-s...
- Patent number 12,114,416
- Issue date Oct 8, 2024
- Mellanox Technologies, Ltd.
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing thereof
- Patent number 12,108,533
- Issue date Oct 1, 2024
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanocomposite material for ultraviolet curable direct write semicon...
- Patent number 12,096,561
- Issue date Sep 17, 2024
- Raytheon Company
- Craig A. Armiento
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Component carrier with stack-stack connection for connecting compon...
- Patent number 12,096,555
- Issue date Sep 17, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,089,337
- Issue date Sep 10, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jun Oh Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device convinient for replacement of camera module thereof
- Patent number 12,088,906
- Issue date Sep 10, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Ye-Quang Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module
- Patent number 12,069,354
- Issue date Aug 20, 2024
- LG Innotek Co., Ltd
- Young Bae Jang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 12,058,810
- Issue date Aug 6, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,052,903
- Issue date Jul 30, 2024
- Samsung Display Co., Ltd.
- Jong-Tae Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising surface-mount device type dipoles, and...
- Patent number 12,048,099
- Issue date Jul 23, 2024
- STMicroelectronics (Grenoble 2) SAS
- Pierino Calascibetta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser light source and laser projection device
- Patent number 12,040,591
- Issue date Jul 16, 2024
- Hisense Laser Display Co., Ltd.
- Xintuan Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 12,035,477
- Issue date Jul 9, 2024
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD
- Publication number 20250063665
- Publication date Feb 20, 2025
- TDK Corporation
- Yukari WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...
- Publication number 20250056728
- Publication date Feb 13, 2025
- NIPPON MEKTRON, LTD.
- Akihiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE AND OPTICAL DEVICE COMPRISING SAME
- Publication number 20250056107
- Publication date Feb 13, 2025
- LG Innotek Co., Ltd.
- Sang Yeon HAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250056727
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250048557
- Publication date Feb 6, 2025
- LG Innotek Co., Ltd.
- Soo Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250031312
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250031303
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Dong Keon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROTARY LIGHT SWITCH FOR A LIGHTING APPARATUS
- Publication number 20250022673
- Publication date Jan 16, 2025
- Gantri, Inc.
- Zachary ROTHOLZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024592
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024599
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH EMBEDDED CONDUCTIVE COIN
- Publication number 20250016929
- Publication date Jan 9, 2025
- Microchip Technology Caldicot Limited
- George Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES
- Publication number 20250016930
- Publication date Jan 9, 2025
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240407103
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Chae Young YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Cigarette
- Publication number 20240389668
- Publication date Nov 28, 2024
- Carnault AG
- Michael Schwitzer
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Application
NETWORK DEVICE WITH ELEVATED TEMPERATURE SENSOR
- Publication number 20240389233
- Publication date Nov 21, 2024
- Arista Networks, Inc.
- Eric Jau Heng Tse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAMERA MODULE
- Publication number 20240364989
- Publication date Oct 31, 2024
- LG Innotek Co., Ltd.
- Young Bae JANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LASER LIGHT SOURCE AND LASER PROJECTION DEVICE
- Publication number 20240339808
- Publication date Oct 10, 2024
- HISENSE LASER DISPLAY CO., LTD.
- Xintuan TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING SURFACE-MOUNT DEVICE TYPE DIPOLES, AND...
- Publication number 20240341037
- Publication date Oct 10, 2024
- STMicroelectronics (Grenoble 2) SAS
- Pierino CALASCIBETTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20240321483
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jaehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods Providing High-Density Memory Arrangements with...
- Publication number 20240306305
- Publication date Sep 12, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING POWER ELECTRONICS DEVICES EMBED...
- Publication number 20240292576
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
- Publication number 20240292531
- Publication date Aug 29, 2024
- Kuprion Inc.
- Alfred A. ZINN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pluggable CPU Modules with Vertical Power
- Publication number 20240290763
- Publication date Aug 29, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD PCB ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240268032
- Publication date Aug 8, 2024
- Honor Device Co., Ltd.
- Zhijie XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL ELEMENT- MOUNTING SUBSTRATE AND ELECTRICAL DEVICE
- Publication number 20240251505
- Publication date Jul 25, 2024
- KYOCERA CORPORATION
- Kazuhiro OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240234366
- Publication date Jul 11, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Functional Circuit Board Core Material
- Publication number 20240237220
- Publication date Jul 11, 2024
- KEMET Electronics Corporation
- Brandon Summey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT...
- Publication number 20240215163
- Publication date Jun 27, 2024
- Intel Corporation
- Onur OZKAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING CAMERA MODULE
- Publication number 20240205530
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Sewon KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SAMPLE HOLDER AND SUPERCONDUCTING QUANTUM COMPUTER
- Publication number 20240196521
- Publication date Jun 13, 2024
- NEC Corporation
- Yoshihito HASHIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Components mounted in and supported by recessed areas of the printed circuit board

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sample holder and superconducting quantum computer

Wiring substrate and method for manufacturing wiring substrate

Circuit board assembly for blocking unwanted light, camera module,...

Terminal device

Printed circuit board and package substrate including same

Printed wiring boards, printed wiring board assemblies, and electro...

Sample holder and superconducting quantum computer

Component carrier having a double dielectric layer and method of ma...

Portable electronic device, and image-capturing device and assembly...

Method of manufacturing an electronic device

Wiring substrate and method for manufacturing wiring substrate

Electronic component embedded substrate

Embeddable semiconductor-based capacitor

Embedded circuit board and manufacturing method thereof

Printed circuit board

Printed circuit board PCB assembly and electronic device

Opto-mechanical structure design of thin LGA package with glass cover

Electronic component embedded substrate

Heat removal from silicon photonics chip using a recessed side-by-s...

Circuit board and method for manufacturing thereof

Nanocomposite material for ultraviolet curable direct write semicon...

Component carrier with stack-stack connection for connecting compon...

Circuit board

Electronic device convinient for replacement of camera module thereof

Camera module

Semi-flex component carrier with dielectric material having high el...

Electronic device and method of manufacturing the same

Electronic device comprising surface-mount device type dipoles, and...

Laser light source and laser projection device

Electronic module and method for producing an electronic module

Patents Applicationslast 30 patents

CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD

FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...

CAMERA MODULE AND OPTICAL DEVICE COMPRISING SAME

PRINTED CIRCUIT BOARD

CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD

ROTARY LIGHT SWITCH FOR A LIGHTING APPARATUS

CERAMIC WIRING MEMBER

CERAMIC WIRING MEMBER

SUBSTRATE WITH EMBEDDED CONDUCTIVE COIN

PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES

CIRCUIT BOARD

Electronic Cigarette

NETWORK DEVICE WITH ELEVATED TEMPERATURE SENSOR

CAMERA MODULE

LASER LIGHT SOURCE AND LASER PROJECTION DEVICE

ELECTRONIC DEVICE COMPRISING SURFACE-MOUNT DEVICE TYPE DIPOLES, AND...

WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE...

Systems and Methods Providing High-Density Memory Arrangements with...

POWER ELECTRONICS ASSEMBLIES HAVING POWER ELECTRONICS DEVICES EMBED...

CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...

Pluggable CPU Modules with Vertical Power

PRINTED CIRCUIT BOARD PCB ASSEMBLY AND ELECTRONIC DEVICE

ELECTRICAL ELEMENT- MOUNTING SUBSTRATE AND ELECTRICAL DEVICE

CIRCUIT BOARD AND MANUFACTURING METHOD

Electrically Functional Circuit Board Core Material

SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT...

ELECTRONIC DEVICE COMPRISING CAMERA MODULE

SAMPLE HOLDER AND SUPERCONDUCTING QUANTUM COMPUTER