Components mounted in and supported by recessed areas of the printed circuit board

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CPC
H05K1/183

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/183Components mounted in and supported by recessed areas of the printed circuit board

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 12,306,434
- Issue date May 20, 2025
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device mountable in an electrical motor and method for m...
- Patent number 12,301,069
- Issue date May 13, 2025
- Melexis Bulgaria Ltd
- Dirk Leman
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assemblies having power electronics devices embed...
- Patent number 12,284,792
- Issue date Apr 22, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and display device
- Patent number 12,279,378
- Issue date Apr 15, 2025
- Kyocera Corporation
- Nobuyuki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 12,267,961
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor-wire-embedded wiring board
- Patent number 12,267,962
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor module and method for manufacturing the...
- Patent number 12,255,169
- Issue date Mar 18, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module of an inverter and method for mounting thereof
- Patent number 12,235,010
- Issue date Feb 25, 2025
- HANON SYSTEMS
- Bernd Guntermann
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Systems and methods providing high-density memory arrangements with...
- Patent number 12,238,866
- Issue date Feb 25, 2025
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sample holder and superconducting quantum computer
- Patent number 12,232,248
- Issue date Feb 18, 2025
- NEC Corporation
- Yoshihito Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,232,268
- Issue date Feb 18, 2025
- Ibiden Co., Ltd.
- Hirotaka Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly for blocking unwanted light, camera module,...
- Patent number 12,225,660
- Issue date Feb 11, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Ying-Lin Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Terminal device
- Patent number 12,219,714
- Issue date Feb 4, 2025
- HONOR DEVICE CO., LTD.
- Yihe Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 12,211,781
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring boards, printed wiring board assemblies, and electro...
- Patent number 12,207,411
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sample holder and superconducting quantum computer
- Patent number 12,207,393
- Issue date Jan 21, 2025
- NEC Corporation
- Yoshihito Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portable electronic device, and image-capturing device and assembly...
- Patent number 12,200,336
- Issue date Jan 14, 2025
- Shine Optics Technology Company Limited
- Jie-Qiao Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,193,167
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,193,156
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,185,471
- Issue date Dec 31, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embeddable semiconductor-based capacitor
- Patent number 12,159,945
- Issue date Dec 3, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 12,156,348
- Issue date Nov 26, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,144,116
- Issue date Nov 12, 2024
- LG Innotek Co., Ltd
- Jong Bae Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board PCB assembly and electronic device
- Patent number 12,127,347
- Issue date Oct 22, 2024
- HONOR DEVICE CO., LTD.
- Zhijie Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Opto-mechanical structure design of thin LGA package with glass cover
- Patent number 12,117,337
- Issue date Oct 15, 2024
- PixArt Imaging Inc.
- Sai Mun Lee
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,114,428
- Issue date Oct 8, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yun Je Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat removal from silicon photonics chip using a recessed side-by-s...
- Patent number 12,114,416
- Issue date Oct 8, 2024
- Mellanox Technologies, Ltd.
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing thereof
- Patent number 12,108,533
- Issue date Oct 1, 2024
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
- Publication number 20250168965
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS
- Publication number 20250159813
- Publication date May 15, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME
- Publication number 20250125240
- Publication date Apr 17, 2025
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20250126717
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Cheolmin Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250112562
- Publication date Apr 3, 2025
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250107005
- Publication date Mar 27, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Long HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250105197
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Tatsuto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250089172
- Publication date Mar 13, 2025
- LG Innotek Co., Ltd.
- Eom Ji KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250089173
- Publication date Mar 13, 2025
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DEVICE CELL AND POWER ELECTRONICS ASSEMBLY INCLUDING THE POWE...
- Publication number 20250087561
- Publication date Mar 13, 2025
- Infineon Technologies Austria AG
- Martial Duchamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20250089178
- Publication date Mar 13, 2025
- Innolux Corporation
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250081332
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Joo Yul Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250081337
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD
- Publication number 20250063665
- Publication date Feb 20, 2025
- TDK Corporation
- Yukari WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE AND OPTICAL DEVICE COMPRISING SAME
- Publication number 20250056107
- Publication date Feb 13, 2025
- LG Innotek Co., Ltd.
- Sang Yeon HAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...
- Publication number 20250056728
- Publication date Feb 13, 2025
- NIPPON MEKTRON, LTD.
- Akihiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250056727
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250048557
- Publication date Feb 6, 2025
- LG Innotek Co., Ltd.
- Soo Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250031312
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250031303
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Dong Keon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROTARY LIGHT SWITCH FOR A LIGHTING APPARATUS
- Publication number 20250022673
- Publication date Jan 16, 2025
- Gantri, Inc.
- Zachary ROTHOLZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024592
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024599
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH EMBEDDED CONDUCTIVE COIN
- Publication number 20250016929
- Publication date Jan 9, 2025
- Microchip Technology Caldicot Limited
- George Taylor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES
- Publication number 20250016930
- Publication date Jan 9, 2025
- Intel Corporation
- Min Suet Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240407103
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Chae Young YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Cigarette
- Publication number 20240389668
- Publication date Nov 28, 2024
- Carnault AG
- Michael Schwitzer
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Application
NETWORK DEVICE WITH ELEVATED TEMPERATURE SENSOR
- Publication number 20240389233
- Publication date Nov 21, 2024
- Arista Networks, Inc.
- Eric Jau Heng Tse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAMERA MODULE
- Publication number 20240364989
- Publication date Oct 31, 2024
- LG Innotek Co., Ltd.
- Young Bae JANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LASER LIGHT SOURCE AND LASER PROJECTION DEVICE
- Publication number 20240339808
- Publication date Oct 10, 2024
- HISENSE LASER DISPLAY CO., LTD.
- Xintuan TIAN
- H01 - BASIC ELECTRIC ELEMENTS

Components mounted in and supported by recessed areas of the printed circuit board

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photonic wafer communication systems and related packages

Electronic device mountable in an electrical motor and method for m...

Semiconductor packages

Power electronics assemblies having power electronics devices embed...

Wiring board and display device

Embedded component package structure and manufacturing method thereof

Capacitor-wire-embedded wiring board

Nitride-based semiconductor module and method for manufacturing the...

Electronic module of an inverter and method for mounting thereof

Systems and methods providing high-density memory arrangements with...

Sample holder and superconducting quantum computer

Wiring substrate and method for manufacturing wiring substrate

Circuit board assembly for blocking unwanted light, camera module,...

Terminal device

Printed circuit board and package substrate including same

Printed wiring boards, printed wiring board assemblies, and electro...

Sample holder and superconducting quantum computer

Component carrier having a double dielectric layer and method of ma...

Portable electronic device, and image-capturing device and assembly...

Method of manufacturing an electronic device

Wiring substrate and method for manufacturing wiring substrate

Electronic component embedded substrate

Embeddable semiconductor-based capacitor

Embedded circuit board and manufacturing method thereof

Printed circuit board

Printed circuit board PCB assembly and electronic device

Opto-mechanical structure design of thin LGA package with glass cover

Electronic component embedded substrate

Heat removal from silicon photonics chip using a recessed side-by-s...

Circuit board and method for manufacturing thereof

Patents Applicationslast 30 patents

CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME

PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS

PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME

CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE

SEMICONDUCTOR DEVICE

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF

POWER DEVICE CELL AND POWER ELECTRONICS ASSEMBLY INCLUDING THE POWE...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD

CAMERA MODULE AND OPTICAL DEVICE COMPRISING SAME

FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...

PRINTED CIRCUIT BOARD

CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD

ROTARY LIGHT SWITCH FOR A LIGHTING APPARATUS

CERAMIC WIRING MEMBER

CERAMIC WIRING MEMBER

SUBSTRATE WITH EMBEDDED CONDUCTIVE COIN

PRINTED CIRCUIT BOARDS WITH INDUCTORS IN THE MOUNTING HOLES

CIRCUIT BOARD

Electronic Cigarette

NETWORK DEVICE WITH ELEVATED TEMPERATURE SENSOR

CAMERA MODULE

LASER LIGHT SOURCE AND LASER PROJECTION DEVICE