Components mounted in and supported by recessed areas of the printed circuit board

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CPC
H05K1/183

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/183Components mounted in and supported by recessed areas of the printed circuit board

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Embeddable semiconductor-based capacitor
- Patent number 12,159,945
- Issue date Dec 3, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 12,156,348
- Issue date Nov 26, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,144,116
- Issue date Nov 12, 2024
- LG Innotek Co., Ltd
- Jong Bae Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board PCB assembly and electronic device
- Patent number 12,127,347
- Issue date Oct 22, 2024
- HONOR DEVICE CO., LTD.
- Zhijie Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Opto-mechanical structure design of thin LGA package with glass cover
- Patent number 12,117,337
- Issue date Oct 15, 2024
- PixArt Imaging Inc.
- Sai Mun Lee
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,114,428
- Issue date Oct 8, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yun Je Ji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat removal from silicon photonics chip using a recessed side-by-s...
- Patent number 12,114,416
- Issue date Oct 8, 2024
- Mellanox Technologies, Ltd.
- Elad Mentovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing thereof
- Patent number 12,108,533
- Issue date Oct 1, 2024
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanocomposite material for ultraviolet curable direct write semicon...
- Patent number 12,096,561
- Issue date Sep 17, 2024
- Raytheon Company
- Craig A. Armiento
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Component carrier with stack-stack connection for connecting compon...
- Patent number 12,096,555
- Issue date Sep 17, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Markus Leitgeb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,089,337
- Issue date Sep 10, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jun Oh Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device convinient for replacement of camera module thereof
- Patent number 12,088,906
- Issue date Sep 10, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Ye-Quang Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module
- Patent number 12,069,354
- Issue date Aug 20, 2024
- LG Innotek Co., Ltd
- Young Bae Jang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 12,058,810
- Issue date Aug 6, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,052,903
- Issue date Jul 30, 2024
- Samsung Display Co., Ltd.
- Jong-Tae Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising surface-mount device type dipoles, and...
- Patent number 12,048,099
- Issue date Jul 23, 2024
- STMicroelectronics (Grenoble 2) SAS
- Pierino Calascibetta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser light source and laser projection device
- Patent number 12,040,591
- Issue date Jul 16, 2024
- Hisense Laser Display Co., Ltd.
- Xintuan Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 12,035,477
- Issue date Jul 9, 2024
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-based circuit board assemblies formed using metal nanoparti...
- Patent number 12,016,118
- Issue date Jun 18, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pluggable CPU modules with vertical power
- Patent number 12,002,795
- Issue date Jun 4, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods providing high-density memory arrangements with...
- Patent number 11,997,792
- Issue date May 28, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate and method for manufacturing the same
- Patent number 11,997,798
- Issue date May 28, 2024
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 11,991,838
- Issue date May 21, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier having component covered with ultra-thin transiti...
- Patent number 11,963,310
- Issue date Apr 16, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,963,311
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sample holder and superconducting quantum computer
- Patent number 11,956,889
- Issue date Apr 9, 2024
- NEC Corporation
- Yoshihito Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 11,947,164
- Issue date Apr 2, 2024
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diagnostic disc with a high vacuum and temperature tolerant power s...
- Patent number 11,924,972
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Phillip A. Criminale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,917,757
- Issue date Feb 27, 2024
- Murata Manufacturing Co., Ltd.
- Hiroki Maegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible catheter-based in vivo detection device and system
- Patent number 11,903,565
- Issue date Feb 20, 2024
- Innovex Medical Co., Ltd.
- Hang Yan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD
- Publication number 20240407103
- Publication date Dec 5, 2024
- LG Innotek Co., Ltd.
- Chae Young YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Cigarette
- Publication number 20240389668
- Publication date Nov 28, 2024
- Carnault AG
- Michael Schwitzer
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Application
NETWORK DEVICE WITH ELEVATED TEMPERATURE SENSOR
- Publication number 20240389233
- Publication date Nov 21, 2024
- Arista Networks, Inc.
- Eric Jau Heng Tse
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAMERA MODULE
- Publication number 20240364989
- Publication date Oct 31, 2024
- LG Innotek Co., Ltd.
- Young Bae JANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LASER LIGHT SOURCE AND LASER PROJECTION DEVICE
- Publication number 20240339808
- Publication date Oct 10, 2024
- HISENSE LASER DISPLAY CO., LTD.
- Xintuan TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING SURFACE-MOUNT DEVICE TYPE DIPOLES, AND...
- Publication number 20240341037
- Publication date Oct 10, 2024
- STMicroelectronics (Grenoble 2) SAS
- Pierino CALASCIBETTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20240321483
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jaehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods Providing High-Density Memory Arrangements with...
- Publication number 20240306305
- Publication date Sep 12, 2024
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS ASSEMBLIES HAVING POWER ELECTRONICS DEVICES EMBED...
- Publication number 20240292576
- Publication date Aug 29, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...
- Publication number 20240292531
- Publication date Aug 29, 2024
- Kuprion Inc.
- Alfred A. ZINN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pluggable CPU Modules with Vertical Power
- Publication number 20240290763
- Publication date Aug 29, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD PCB ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240268032
- Publication date Aug 8, 2024
- Honor Device Co., Ltd.
- Zhijie XU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL ELEMENT- MOUNTING SUBSTRATE AND ELECTRICAL DEVICE
- Publication number 20240251505
- Publication date Jul 25, 2024
- KYOCERA CORPORATION
- Kazuhiro OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240234366
- Publication date Jul 11, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically Functional Circuit Board Core Material
- Publication number 20240237220
- Publication date Jul 11, 2024
- KEMET Electronics Corporation
- Brandon Summey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT...
- Publication number 20240215163
- Publication date Jun 27, 2024
- Intel Corporation
- Onur OZKAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING CAMERA MODULE
- Publication number 20240205530
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Sewon KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SAMPLE HOLDER AND SUPERCONDUCTING QUANTUM COMPUTER
- Publication number 20240196521
- Publication date Jun 13, 2024
- NEC Corporation
- Yoshihito HASHIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240196538
- Publication date Jun 13, 2024
- TDK Corporation
- Akihiro MASUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY WITH REDUCED TOTAL HEIGHT
- Publication number 20240196539
- Publication date Jun 13, 2024
- MEDIATEK INC.
- Chun-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC WAFER COMMUNICATION SYSTEMS AND RELATED PACKAGES
- Publication number 20240176066
- Publication date May 30, 2024
- Lightmatter, Inc
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC CIRCUIT FOR ULTRASOUND CATHETERS
- Publication number 20240164751
- Publication date May 23, 2024
- St. Jude Medical, Cardiology Division, Inc.
- Fermin Lupotti
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE FOR SEMICONDUCTOR ELEMENT
- Publication number 20240170353
- Publication date May 23, 2024
- ROHM CO., LTD.
- Tsuyoshi TACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Terminal Device
- Publication number 20240172367
- Publication date May 23, 2024
- Honor Device Co., Ltd.
- Yihe Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240164021
- Publication date May 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM AND DISPLAY PANEL
- Publication number 20240147607
- Publication date May 2, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Xin LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD
- Publication number 20240136325
- Publication date Apr 25, 2024
- NHK Spring Co., Ltd.
- Ryo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240130050
- Publication date Apr 18, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240120243
- Publication date Apr 11, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND SUBSTRATE MODULE
- Publication number 20240107676
- Publication date Mar 28, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiko SUGIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Components mounted in and supported by recessed areas of the printed circuit board

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embeddable semiconductor-based capacitor

Embedded circuit board and manufacturing method thereof

Printed circuit board

Printed circuit board PCB assembly and electronic device

Opto-mechanical structure design of thin LGA package with glass cover

Electronic component embedded substrate

Heat removal from silicon photonics chip using a recessed side-by-s...

Circuit board and method for manufacturing thereof

Nanocomposite material for ultraviolet curable direct write semicon...

Component carrier with stack-stack connection for connecting compon...

Circuit board

Electronic device convinient for replacement of camera module thereof

Camera module

Semi-flex component carrier with dielectric material having high el...

Electronic device and method of manufacturing the same

Electronic device comprising surface-mount device type dipoles, and...

Laser light source and laser projection device

Electronic module and method for producing an electronic module

Ceramic-based circuit board assemblies formed using metal nanoparti...

Pluggable CPU modules with vertical power

Systems and methods providing high-density memory arrangements with...

Package substrate and method for manufacturing the same

Embedded circuit board and manufacturing method thereof

Component carrier having component covered with ultra-thin transiti...

Printed circuit board and method of manufacturing the same

Sample holder and superconducting quantum computer

Photonic wafer communication systems and related packages

Diagnostic disc with a high vacuum and temperature tolerant power s...

Circuit board

Flexible catheter-based in vivo detection device and system

Patents Applicationslast 30 patents

CIRCUIT BOARD

Electronic Cigarette

NETWORK DEVICE WITH ELEVATED TEMPERATURE SENSOR

CAMERA MODULE

LASER LIGHT SOURCE AND LASER PROJECTION DEVICE

ELECTRONIC DEVICE COMPRISING SURFACE-MOUNT DEVICE TYPE DIPOLES, AND...

WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE...

Systems and Methods Providing High-Density Memory Arrangements with...

POWER ELECTRONICS ASSEMBLIES HAVING POWER ELECTRONICS DEVICES EMBED...

CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTI...

Pluggable CPU Modules with Vertical Power

PRINTED CIRCUIT BOARD PCB ASSEMBLY AND ELECTRONIC DEVICE

ELECTRICAL ELEMENT- MOUNTING SUBSTRATE AND ELECTRICAL DEVICE

CIRCUIT BOARD AND MANUFACTURING METHOD

Electrically Functional Circuit Board Core Material

SUBSTRATE GLASS CORE PATTERNING FOR CTV IMPROVEMENT AND LAYER COUNT...

ELECTRONIC DEVICE COMPRISING CAMERA MODULE

SAMPLE HOLDER AND SUPERCONDUCTING QUANTUM COMPUTER

ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD ASSEMBLY WITH REDUCED TOTAL HEIGHT

PHOTONIC WAFER COMMUNICATION SYSTEMS AND RELATED PACKAGES

FLEXIBLE ELECTRONIC CIRCUIT FOR ULTRASOUND CATHETERS

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE FOR SEMICONDUCTOR ELEMENT

Terminal Device

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CONDUCTIVE FILM AND DISPLAY PANEL

CIRCUIT BOARD AND MANUFACTURING METHOD

EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

CIRCUIT MODULE AND SUBSTRATE MODULE