Components mounted in and supported by recessed areas of the printed circuit board

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CPC
H05K1/183

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/183Components mounted in and supported by recessed areas of the printed circuit board

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Backside recess in motherboard with thermally conductive mold
- Patent number 12,363,831
- Issue date Jul 15, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-incorporated substrate and method for manufacturing same
- Patent number 12,356,556
- Issue date Jul 8, 2025
- Fujikura Ltd.
- Masahiro Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor formed with coupled dies
- Patent number 12,356,552
- Issue date Jul 8, 2025
- Intel Corporation
- Changyok Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,349,283
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Co-planar interconnection mechanisms for circuit boards
- Patent number 12,349,276
- Issue date Jul 1, 2025
- Intel Corporation
- Mooi Ling Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connector and board connecting assembly comprising the same
- Patent number 12,347,949
- Issue date Jul 1, 2025
- Gigalane Co., Ltd.
- Sun-hwa Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical three-dimensional printing and soldering
- Patent number 12,320,028
- Issue date Jun 3, 2025
- University of South Florida
- Arash Takshi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 12,324,100
- Issue date Jun 3, 2025
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic wafer communication systems and related packages
- Patent number 12,306,434
- Issue date May 20, 2025
- Lightmatter, Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device mountable in an electrical motor and method for m...
- Patent number 12,301,069
- Issue date May 13, 2025
- Melexis Bulgaria Ltd
- Dirk Leman
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor packages
- Patent number 12,283,555
- Issue date Apr 22, 2025
- Analog Devices International Unlimited Company
- Bilge Bayrakci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assemblies having power electronics devices embed...
- Patent number 12,284,792
- Issue date Apr 22, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and display device
- Patent number 12,279,378
- Issue date Apr 15, 2025
- Kyocera Corporation
- Nobuyuki Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 12,267,961
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor-wire-embedded wiring board
- Patent number 12,267,962
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor module and method for manufacturing the...
- Patent number 12,255,169
- Issue date Mar 18, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module of an inverter and method for mounting thereof
- Patent number 12,235,010
- Issue date Feb 25, 2025
- HANON SYSTEMS
- Bernd Guntermann
- F24 - HEATING RANGES VENTILATING
Information Patent Grant
Systems and methods providing high-density memory arrangements with...
- Patent number 12,238,866
- Issue date Feb 25, 2025
- TORmem Inc.
- Steven White
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sample holder and superconducting quantum computer
- Patent number 12,232,248
- Issue date Feb 18, 2025
- NEC Corporation
- Yoshihito Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,232,268
- Issue date Feb 18, 2025
- Ibiden Co., Ltd.
- Hirotaka Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly for blocking unwanted light, camera module,...
- Patent number 12,225,660
- Issue date Feb 11, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Ying-Lin Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Terminal device
- Patent number 12,219,714
- Issue date Feb 4, 2025
- HONOR DEVICE CO., LTD.
- Yihe Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and package substrate including same
- Patent number 12,211,781
- Issue date Jan 28, 2025
- LG Innotek Co., Ltd
- Se Woong Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring boards, printed wiring board assemblies, and electro...
- Patent number 12,207,411
- Issue date Jan 21, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sample holder and superconducting quantum computer
- Patent number 12,207,393
- Issue date Jan 21, 2025
- NEC Corporation
- Yoshihito Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portable electronic device, and image-capturing device and assembly...
- Patent number 12,200,336
- Issue date Jan 14, 2025
- Shine Optics Technology Company Limited
- Jie-Qiao Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,193,167
- Issue date Jan 7, 2025
- INNOLUX CORPORATION
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,193,156
- Issue date Jan 7, 2025
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250227849
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Embedding a Component in a Printed Circuit Board
- Publication number 20250227850
- Publication date Jul 10, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DOCK PRINTED CIRCUIT BOARD
- Publication number 20250203778
- Publication date Jun 19, 2025
- Weathered Security, LLC
- Dale Robert Wooden
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIBRATION SENSOR, ELECTRONIC DEVICE AND VIBRATION DETECTION METHOD
- Publication number 20250194002
- Publication date Jun 12, 2025
- GOERTEK MICROELECTRONICS INC.
- Tangliu Yan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250194017
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Soo Bin Jeong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER
- Publication number 20250194018
- Publication date Jun 12, 2025
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Daniel SCHLICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES
- Publication number 20250194016
- Publication date Jun 12, 2025
- Western Digital Technologies, Inc.
- Dibin Gangadharan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
- Publication number 20250168965
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS
- Publication number 20250159813
- Publication date May 15, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME
- Publication number 20250125240
- Publication date Apr 17, 2025
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20250126717
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Cheolmin Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250112562
- Publication date Apr 3, 2025
- Hitachi Astemo, Ltd.
- Junpei KUSUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250107005
- Publication date Mar 27, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Long HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250105197
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Tatsuto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250089172
- Publication date Mar 13, 2025
- LG Innotek Co., Ltd.
- Eom Ji KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250089173
- Publication date Mar 13, 2025
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DEVICE CELL AND POWER ELECTRONICS ASSEMBLY INCLUDING THE POWE...
- Publication number 20250087561
- Publication date Mar 13, 2025
- Infineon Technologies Austria AG
- Martial Duchamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20250089178
- Publication date Mar 13, 2025
- Innolux Corporation
- Kai Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250081332
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Joo Yul Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250081337
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Young Kuk KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD
- Publication number 20250063665
- Publication date Feb 20, 2025
- TDK Corporation
- Yukari WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE AND OPTICAL DEVICE COMPRISING SAME
- Publication number 20250056107
- Publication date Feb 13, 2025
- LG Innotek Co., Ltd.
- Sang Yeon HAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...
- Publication number 20250056728
- Publication date Feb 13, 2025
- NIPPON MEKTRON, LTD.
- Akihiro NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250056727
- Publication date Feb 13, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250048557
- Publication date Feb 6, 2025
- LG Innotek Co., Ltd.
- Soo Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250031312
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250031303
- Publication date Jan 23, 2025
- LG Innotek Co., Ltd.
- Dong Keon LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROTARY LIGHT SWITCH FOR A LIGHTING APPARATUS
- Publication number 20250022673
- Publication date Jan 16, 2025
- Gantri, Inc.
- Zachary ROTHOLZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024592
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC WIRING MEMBER
- Publication number 20250024599
- Publication date Jan 16, 2025
- NGK Electronics Devices, Inc.
- Hiroshi KOUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Components mounted in and supported by recessed areas of the printed circuit board

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Backside recess in motherboard with thermally conductive mold

Component-incorporated substrate and method for manufacturing same

Capacitor formed with coupled dies

Electronic component embedded substrate

Co-planar interconnection mechanisms for circuit boards

Connector and board connecting assembly comprising the same

Electrochemical three-dimensional printing and soldering

Circuit board assembly and manufacturing method thereof

Wiring board, semiconductor device, and method of manufacturing wir...

Photonic wafer communication systems and related packages

Electronic device mountable in an electrical motor and method for m...

Semiconductor packages

Power electronics assemblies having power electronics devices embed...

Wiring board and display device

Embedded component package structure and manufacturing method thereof

Capacitor-wire-embedded wiring board

Nitride-based semiconductor module and method for manufacturing the...

Electronic module of an inverter and method for mounting thereof

Systems and methods providing high-density memory arrangements with...

Sample holder and superconducting quantum computer

Wiring substrate and method for manufacturing wiring substrate

Circuit board assembly for blocking unwanted light, camera module,...

Terminal device

Printed circuit board and package substrate including same

Printed wiring boards, printed wiring board assemblies, and electro...

Sample holder and superconducting quantum computer

Component carrier having a double dielectric layer and method of ma...

Portable electronic device, and image-capturing device and assembly...

Method of manufacturing an electronic device

Wiring substrate and method for manufacturing wiring substrate

Patents Applicationslast 30 patents

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Method for Embedding a Component in a Printed Circuit Board

MULTI-DOCK PRINTED CIRCUIT BOARD

VIBRATION SENSOR, ELECTRONIC DEVICE AND VIBRATION DETECTION METHOD

PRINTED CIRCUIT BOARD

COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER

EFFICIENT ASSEMBLY FOR ELECTROLYTIC CAPACITORS ON SOLID STATE DRIVES

CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME

PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS

PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME

CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE

SEMICONDUCTOR DEVICE

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF

POWER DEVICE CELL AND POWER ELECTRONICS ASSEMBLY INCLUDING THE POWE...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD

CAMERA MODULE AND OPTICAL DEVICE COMPRISING SAME

FLEXIBLE TRANSPARENT WIRING BOARD AND METHOD FOR MANUFACTURING FLEX...

PRINTED CIRCUIT BOARD

CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD

ROTARY LIGHT SWITCH FOR A LIGHTING APPARATUS

CERAMIC WIRING MEMBER

CERAMIC WIRING MEMBER