Composition of the atmosphere

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H01L2224/83054

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83054Composition of the atmosphere

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Micro-selective sintering laser systems and methods thereof
- Patent number 10,722,947
- Issue date Jul 28, 2020
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Apparatus for heating a substrate during die bonding
- Patent number 10,199,350
- Issue date Feb 5, 2019
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Luke Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct adhesion via low-roughness metal layers
- Patent number 10,115,698
- Issue date Oct 30, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for preparing layered semiconductor structures
- Patent number 10,068,795
- Issue date Sep 4, 2018
- GlobalWafers Co., Ltd.
- Michael J. Ries
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for connecting joining parts
- Patent number 9,502,376
- Issue date Nov 22, 2016
- Osram Opto Semiconductors GmbH
- Andreas Plöβl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 9,287,237
- Issue date Mar 15, 2016
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a bond and a semiconductor module
- Patent number 9,202,800
- Issue date Dec 1, 2015
- Infineon Technologies AG
- Tao Hong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 8,975,105
- Issue date Mar 10, 2015
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20230282611
- Publication date Sep 7, 2023
- FUJI ELECTRIC CO., LTD.
- Hiroki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATING METHOD
- Publication number 20220310557
- Publication date Sep 29, 2022
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF
- Publication number 20180065186
- Publication date Mar 8, 2018
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
System and Method for Immersion Bonding
- Publication number 20170330855
- Publication date Nov 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DIRECT ADHESION VIA LOW-ROUGHNESS METAL LAYERS
- Publication number 20170236800
- Publication date Aug 17, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Paul GONDCHARTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20140151341
- Publication date Jun 5, 2014
- SHINKAWA LTD.
- Katsutoshi KUNIYOSHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE
- Publication number 20140013595
- Publication date Jan 16, 2014
- Tao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR HEATING A SUBSTRATE DURING DIE BONDING
- Publication number 20130316294
- Publication date Nov 28, 2013
- Ming Yeung Luke WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20120319261
- Publication date Dec 20, 2012
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS

Composition of the atmosphere

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micro-selective sintering laser systems and methods thereof

Apparatus for heating a substrate during die bonding

Method for direct adhesion via low-roughness metal layers

Methods for preparing layered semiconductor structures

Process for connecting joining parts

Hermetically sealed wafer packages

Methods for producing a bond and a semiconductor module

Hermetically sealed wafer packages

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

WAFER LAMINATING METHOD

MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF

System and Method for Immersion Bonding

METHOD FOR DIRECT ADHESION VIA LOW-ROUGHNESS METAL LAYERS

WIRE BONDING APPARATUS

METHODS FOR PRODUCING A BOND AND A SEMICONDUCTOR MODULE

APPARATUS FOR HEATING A SUBSTRATE DURING DIE BONDING

HERMETICALLY SEALED WAFER PACKAGES