TREA

Composition of the atmosphere

Follow

Industry

  • CPC
  • H01L2224/85054
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85054Composition of the atmosphere
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Method for forming ball in bonding wire
    • Patent number 10,121,764
    • Issue date Nov 6, 2018
    • Nippon Micrometal Corporation
    • Noritoshi Araki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding wire for semiconductor device
    • Patent number 10,032,741
    • Issue date Jul 24, 2018
    • Nippon Micrometal Corporation
    • Daizo Oda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Antioxidant gas blow-off unit
    • Patent number 9,415,456
    • Issue date Aug 16, 2016
    • Shinkawa Ltd.
    • Toru Maeda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Antioxidant gas blow-off unit
    • Patent number 9,362,251
    • Issue date Jun 7, 2016
    • Shinkawa Ltd.
    • Mitsuaki Sakakura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Antioxidant gas supply unit
    • Patent number 9,044,821
    • Issue date Jun 2, 2015
    • Shinkawa Ltd.
    • Toru Maeda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Integrated circuit including bond wire directly bonded to pad
    • Patent number 8,432,024
    • Issue date Apr 30, 2013
    • Infineon Technologies AG
    • Manfred Schneegans
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents