Composition of the atmosphere

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H01L2224/81054

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81054Composition of the atmosphere

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic-assisted solder transfer
- Patent number 11,541,472
- Issue date Jan 3, 2023
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-selective sintering laser systems and methods thereof
- Patent number 10,722,947
- Issue date Jul 28, 2020
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 10,340,239
- Issue date Jul 2, 2019
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for heating a substrate during die bonding
- Patent number 10,199,350
- Issue date Feb 5, 2019
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Luke Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide and semiconductor packaging
- Patent number 9,960,204
- Issue date May 1, 2018
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 9,754,907
- Issue date Sep 5, 2017
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package with conductive clips
- Patent number 9,620,471
- Issue date Apr 11, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide and semiconductor packaging
- Patent number 9,478,458
- Issue date Oct 25, 2016
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 9,437,573
- Issue date Sep 6, 2016
- Cypress Semiconductor Corporation
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method of substrate to substrate bonding for three di...
- Patent number 9,418,961
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 9,324,629
- Issue date Apr 26, 2016
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact-based encapsulation
- Patent number 9,147,635
- Issue date Sep 29, 2015
- Cufer Asset Ltd. L.L.C.
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 9,119,336
- Issue date Aug 25, 2015
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor package
- Patent number 9,048,196
- Issue date Jun 2, 2015
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having electrodes bonded with each other
- Patent number 8,922,027
- Issue date Dec 30, 2014
- Fujitsu Limited
- Taiji Sakai
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Electronic device having electrodes bonded with each other
- Patent number 8,860,232
- Issue date Oct 14, 2014
- Fujitsu Limited
- Taiji Sakai
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Inverse chip connector
- Patent number 8,846,445
- Issue date Sep 30, 2014
- Cufer Asset Ltd. L.L.C.
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure manufacturing method, heating and melting treatme...
- Patent number 8,757,474
- Issue date Jun 24, 2014
- Ayumi Industry Co., Ltd.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacture method for semiconductor device with bristled conductiv...
- Patent number 8,735,274
- Issue date May 27, 2014
- Fujitsu Limited
- Masataka Mizukoshi
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,664,106
- Issue date Mar 4, 2014
- Tokyo Electron Limited
- Haruo Iwatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 8,651,363
- Issue date Feb 18, 2014
- Bondtech, Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing thereof
- Patent number 8,637,986
- Issue date Jan 28, 2014
- Spansion LLC
- Naomi Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of plasma preparation of metallic contacts to enhance mechan...
- Patent number 8,567,658
- Issue date Oct 29, 2013
- Ontos Equipment Systems, Inc.
- Eric Frank Schulte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method of substrate to substrate bonding for three di...
- Patent number 8,528,802
- Issue date Sep 10, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MEMS device having chip scale packaging
- Patent number 8,525,278
- Issue date Sep 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrode bonding method and part mounting apparatus
- Patent number 8,449,712
- Issue date May 28, 2013
- Panasonic Corporation
- Yoshimasa Inamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20220384412
- Publication date Dec 1, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC-ASSISTED SOLDER TRANSFER
- Publication number 20210229203
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20180132397
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Silver-Based Contacting M...
- Publication number 20180132398
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Indium-Based Contacting M...
- Publication number 20180132395
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20180132396
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20180132394
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
System for Low-Force Thermocompression Bonding
- Publication number 20180132393
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20180132399
- Publication date May 10, 2018
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF
- Publication number 20180065186
- Publication date Mar 8, 2018
- Board of Regents, The University of Texas System
- Michael A. Cullinan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20180033754
- Publication date Feb 1, 2018
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflow Process and Tool
- Publication number 20150249062
- Publication date Sep 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20140342504
- Publication date Nov 20, 2014
- FUJITSU LIMITED
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAVEGUIDE AND SEMICONDUCTOR PACKAGING
- Publication number 20140254979
- Publication date Sep 11, 2014
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...
- Publication number 20140246481
- Publication date Sep 4, 2014
- Hideyuki ABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20140113411
- Publication date Apr 24, 2014
- SPANSION LLC
- Naomi MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PLASMA PREPARATION OF METALLIC CONTACTS TO ENHANCE MECHAN...
- Publication number 20140102594
- Publication date Apr 17, 2014
- Ontos Equipment Systems, Inc.
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
Apparatus and Method of Substrate to Substrate Bonding for Three Di...
- Publication number 20130320071
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR HEATING A SUBSTRATE DURING DIE BONDING
- Publication number 20130316294
- Publication date Nov 28, 2013
- Ming Yeung Luke WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable...
- Publication number 20130270329
- Publication date Oct 17, 2013
- Eric Frank Schulte
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20130187293
- Publication date Jul 25, 2013
- Fujitsu Limited
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Serial thermal linear processor arrangement
- Publication number 20130175323
- Publication date Jul 11, 2013
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Structure Manufacturing Method, Heating And Melting Treatme...
- Publication number 20130105558
- Publication date May 2, 2013
- AYUMI INDUSTRY CO., LTD.
- Hideyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMS DEVICE HAVING CHIP SCALE PACKAGING
- Publication number 20130043547
- Publication date Feb 21, 2013
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. ("TSMC")
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120171858
- Publication date Jul 5, 2012
- TOKYO ELECTRON LIMITED
- Haruo Iwatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT
- Publication number 20120104076
- Publication date May 3, 2012
- TADATOMO SUGA
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED CONTACT
- Publication number 20110275178
- Publication date Nov 10, 2011
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERSE CHIP CONNECTOR
- Publication number 20110250722
- Publication date Oct 13, 2011
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN-TYPE CHIP TOOLING
- Publication number 20110223717
- Publication date Sep 15, 2011
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS

Composition of the atmosphere

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding of bridge to multiple semiconductor chips

Bonding of bridge to multiple semiconductor chips

Ultrasonic-assisted solder transfer

3D packaging with low-force thermocompression bonding of oxidizable...

Micro-selective sintering laser systems and methods thereof

Tooling for coupling multiple electronic chips

Apparatus for heating a substrate during die bonding

Waveguide and semiconductor packaging

Method of manufacturing an electronic device, and electronic device...

Tooling for coupling multiple electronic chips

Power semiconductor package with conductive clips

Waveguide and semiconductor packaging

Semiconductor device and method for manufacturing thereof

Apparatus and method of substrate to substrate bonding for three di...

Tooling for coupling multiple electronic chips

Contact-based encapsulation

Bonding structure manufacturing method, heating and melting treatme...

Power semiconductor package

Electronic device having electrodes bonded with each other

Electronic device having electrodes bonded with each other

Inverse chip connector

Bonding structure manufacturing method, heating and melting treatme...

Manufacture method for semiconductor device with bristled conductiv...

Method of manufacturing semiconductor device

Joining method and device produced by this method and joining unit

Semiconductor device and method for manufacturing thereof

Method of plasma preparation of metallic contacts to enhance mechan...

Apparatus and method of substrate to substrate bonding for three di...

MEMS device having chip scale packaging

Electrode bonding method and part mounting apparatus

Patents Applicationslast 30 patents

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

ULTRASONIC-ASSISTED SOLDER TRANSFER

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Silver-Based Contacting M...

Thermocompression Bonding with Passivated Indium-Based Contacting M...

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

System for Low-Force Thermocompression Bonding

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

MICRO-SELECTIVE SINTERING LASER SYSTEMS AND METHODS THEREOF

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

Reflow Process and Tool

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

WAVEGUIDE AND SEMICONDUCTOR PACKAGING

BONDING STRUCTURE MANUFACTURING METHOD, HEATING AND MELTING TREATME...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF

METHOD OF PLASMA PREPARATION OF METALLIC CONTACTS TO ENHANCE MECHAN...

Apparatus and Method of Substrate to Substrate Bonding for Three Di...

APPARATUS FOR HEATING A SUBSTRATE DURING DIE BONDING

3D Packaging With Low-Force Thermocompression Bonding Of Oxidizable...

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

Serial thermal linear processor arrangement

Bonding Structure Manufacturing Method, Heating And Melting Treatme...

MEMS DEVICE HAVING CHIP SCALE PACKAGING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT

PATTERNED CONTACT

INVERSE CHIP CONNECTOR

PIN-TYPE CHIP TOOLING