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Compound repelling a metal

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  • CPC
  • H05K2201/2081
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/2081Compound repelling a metal
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240155764
    • Publication date May 9, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Seong Ho CHOI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240147622
    • Publication date May 2, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Yoon LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240074049
    • Publication date Feb 29, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Kyun Bae
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230387026
    • Publication date Nov 30, 2023
    • Samsung Electronics Co., Ltd.
    • SEONGHO SHIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAMERA MODULE
    • Publication number 20230371170
    • Publication date Nov 16, 2023
    • LG Innotek Co., Ltd.
    • Won Seob SHIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20230354520
    • Publication date Nov 2, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Chan Hoon KO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD WITH CARRIER AND METHO...
    • Publication number 20230209707
    • Publication date Jun 29, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Jung Han KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230171886
    • Publication date Jun 1, 2023
    • LG Innotek Co., Ltd.
    • Se Woong NA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND ELECTRONIC DEVICE
    • Publication number 20230164908
    • Publication date May 25, 2023
    • Shinko Electric Industries Co., Ltd.
    • Tatsuaki Denda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20230156915
    • Publication date May 18, 2023
    • LG Innotek Co., Ltd.
    • Myung Gu KANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MOUNTING STRUCTURE OF ELECTRONIC COMPONENT
    • Publication number 20230104369
    • Publication date Apr 6, 2023
    • Murata Manufacturing Co., Ltd.
    • Noboru SERITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    • Publication number 20220330426
    • Publication date Oct 13, 2022
    • IBIDEN CO., LTD.
    • Yoshiki MATSUI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20220132674
    • Publication date Apr 28, 2022
    • Mitsubishi Electric Corporation
    • Koji SHIGETA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD AND DISPLAY APPARATUS INCLUDING THE SAME
    • Publication number 20210307171
    • Publication date Sep 30, 2021
    • SAMSUNG DISPLAY CO., LTD.
    • MYONG-SOO OH
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OPTICAL MODULE
    • Publication number 20210100097
    • Publication date Apr 1, 2021
    • CIG Photonics Japan Limited
    • Shigeru MIEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LIGHT EMITTING ELEMENT
    • Publication number 20190387616
    • Publication date Dec 19, 2019
    • CHUNGHWA PICTURE TUBES, LTD.
    • Wen-Jiunn Hsieh
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH-FREQUENCY MODULE
    • Publication number 20180145397
    • Publication date May 24, 2018
    • Alps Electric Co., Ltd.
    • Masashi Nakagawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD...
    • Publication number 20180092211
    • Publication date Mar 29, 2018
    • Canon Kabushiki Kaisha
    • Kunihiko Minegishi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER RESIST COMPOSITION AND COVERED PRINTED WIRING BOARD
    • Publication number 20170269477
    • Publication date Sep 21, 2017
    • Goo Chemical Co., Ltd.
    • Michiya Higuchi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF AEROSOL PRINTING A SOLDER MASK INK COMPOSITION
    • Publication number 20170136779
    • Publication date May 18, 2017
    • Xerox Corporation
    • Yiliang Wu
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    ADAPTIVE INTERPOSER AND ELECTRONIC APPARATUS
    • Publication number 20170006705
    • Publication date Jan 5, 2017
    • Tse E. Wong
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    WIRING BOARD, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTU...
    • Publication number 20160174379
    • Publication date Jun 16, 2016
    • Shinko Electric Industries Co., Ltd.
    • Noriyoshi Shimizu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Test Structure and Method of Testing Electrical Characteristics of...
    • Publication number 20150208504
    • Publication date Jul 23, 2015
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shang-Yun Hou
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Thin Low Profile Strip Dual In-Line Memory Module
    • Publication number 20150208510
    • Publication date Jul 23, 2015
    • FREESCALE SEMICONDUCTOR, INC.
    • Perry H. Pelley
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    THERMOCHROMIC SOLDER MASK FOR ELECTRONIC DEVICES
    • Publication number 20150173178
    • Publication date Jun 18, 2015
    • EchoStar Technologies L.L.C.
    • Adam Charles Morzos
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER RESIST OPENING STRUCTURE AND CIRCUIT BOARD
    • Publication number 20150156860
    • Publication date Jun 4, 2015
    • Samsung Electro-Mechanics Co., Ltd.
    • Chang Bo LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
    • Publication number 20150136461
    • Publication date May 21, 2015
    • HARIMA CHEMICALS, INCORPORATED
    • Yoji Imamura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT SUBSTRATE AND ELECTRONIC DEVICE
    • Publication number 20150043184
    • Publication date Feb 12, 2015
    • Canon Kabushiki Kaisha
    • Koichi Odagaki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Test Structure and Method of Testing Electrical Characteristics of...
    • Publication number 20130120018
    • Publication date May 16, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Shang-Yun Hou
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device and Method of Forming Insulating Layer on Cond...
    • Publication number 20130075900
    • Publication date Mar 28, 2013
    • STATS ChipPAC, Ltd.
    • Seong Bo Shim
    • H01 - BASIC ELECTRIC ELEMENTS