Compression bonding

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H01L2224/85201

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85201Compression bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wire bonding apparatus and method for manufacturing semiconductor d...
- Patent number 12,107,070
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bond clamp design and lead frame capable of engaging with same
- Patent number 10,861,777
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Yuh-Harng Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,770,375
- Issue date Sep 8, 2020
- Renesas Electronics Corporation
- Jun Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball bond attachment for a semiconductor die
- Patent number 10,692,835
- Issue date Jun 23, 2020
- Texas Instruments Incorporated
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded electronic devices to round wire
- Patent number 10,172,240
- Issue date Jan 1, 2019
- Automated Assembly Corporation
- Robert Neuman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming wire interconnect structures
- Patent number 10,153,247
- Issue date Dec 11, 2018
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures
- Patent number 9,865,560
- Issue date Jan 9, 2018
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,793,236
- Issue date Oct 17, 2017
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for production
- Patent number 9,754,912
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a bond pad structure
- Patent number 9,601,446
- Issue date Mar 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded electronic devices to round wire
- Patent number 9,595,501
- Issue date Mar 14, 2017
- Automated Assembly Corporation
- Robert Neuman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor package having the same
- Patent number 9,543,251
- Issue date Jan 10, 2017
- SK hynix Inc.
- Tae Min Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct die solder of gallium arsenide integrated circuit dies and m...
- Patent number 9,530,719
- Issue date Dec 27, 2016
- Skyworks Solutions, Inc.
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures
- Patent number 9,502,371
- Issue date Nov 22, 2016
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for production
- Patent number 9,368,447
- Issue date Jun 14, 2016
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Bond pad structure
- Patent number 8,981,580
- Issue date Mar 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with bonding wire and method for making the same
- Patent number 8,847,410
- Issue date Sep 30, 2014
- Rohm Co., Ltd.
- Kosuke Miyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,810,047
- Issue date Aug 19, 2014
- PS4 Luxco S.A.R.L.
- Mitsuhisa Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper bonding compatible bond pad structure and method
- Patent number 8,753,972
- Issue date Jun 17, 2014
- Alpha and Omega Semiconductor Incorporated
- François Hébert
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating a through wire interconnect (TWI) on a semic...
- Patent number 8,741,667
- Issue date Jun 3, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device having lead wires connecting bonding pads form...
- Patent number 8,637,975
- Issue date Jan 28, 2014
- Marvell International Ltd.
- Shiann-Ming Liou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,604,627
- Issue date Dec 10, 2013
- Rohm Co., Ltd.
- Hideki Hiromoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,586,416
- Issue date Nov 19, 2013
- Renesas Electronics Corporation
- Masahiko Sekihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through wire interconnect (TWI) having bonded connection and encaps...
- Patent number 8,581,387
- Issue date Nov 12, 2013
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device and method for production
- Patent number 8,552,571
- Issue date Oct 8, 2013
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing type semiconductor device and method of manufacturing...
- Patent number 8,502,360
- Issue date Aug 6, 2013
- Sanyo Semiconductor Co., Ltd.
- Takeshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and endoscope apparatus
- Patent number 8,471,392
- Issue date Jun 25, 2013
- Olympus Corporation
- Kazuaki Kojima
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
DOUBLE STITCH WIREBONDS
- Publication number 20240113065
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Xiaolin KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR D...
- Publication number 20220328450
- Publication date Oct 13, 2022
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BOND ATTACHMENT FOR A SEMICONDUCTOR DIE
- Publication number 20190378814
- Publication date Dec 12, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Han Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190259687
- Publication date Aug 22, 2019
- RENESAS ELECTRONICS CORPORATION
- Jun SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME
- Publication number 20190206769
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Yuh-Harng CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING WIRE BONDING STRUCTURES AND METHODS OF...
- Publication number 20190157237
- Publication date May 23, 2019
- Samsung Electronics Co., Ltd.
- Yong Je LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES
- Publication number 20170345787
- Publication date Nov 30, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDED ELECTRONIC DEVICES TO ROUND WIRE
- Publication number 20170200694
- Publication date Jul 13, 2017
- AUTOMATED ASSEMBLY CORPORATION
- Robert Neuman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150303166
- Publication date Oct 22, 2015
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20150249063
- Publication date Sep 3, 2015
- SHINKAWA LTD.
- NAOKI SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES
- Publication number 20150132888
- Publication date May 14, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCTION
- Publication number 20130328197
- Publication date Dec 12, 2013
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20130049231
- Publication date Feb 28, 2013
- ROHM CO., LTD.
- Kosuke MIYOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120302009
- Publication date Nov 29, 2012
- RENESAS ELECTRONICS CORPORATION
- Masahiko SEKIHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...
- Publication number 20120288997
- Publication date Nov 15, 2012
- Micron Technology, Inc.
- DAVID R. HEMBREE
- G01 - MEASURING TESTING
Information Patent Application
Method for Assemblying a Semiconductor Chip Package with Deflection...
- Publication number 20120276692
- Publication date Nov 1, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE
- Publication number 20120211902
- Publication date Aug 23, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd., ("TSMC")
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20120208322
- Publication date Aug 16, 2012
- Renesas Electronics Corporation
- MIKAKO OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20120189845
- Publication date Jul 26, 2012
- Sadahito Misumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COPPER BONDING COMPATIBLE BOND PAD STRUCTURE AND METHOD
- Publication number 20120064711
- Publication date Mar 15, 2012
- François Hébert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module System Having Stacked Components With Encapsul...
- Publication number 20120043670
- Publication date Feb 23, 2012
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR PRODUCTION
- Publication number 20120025384
- Publication date Feb 2, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS
- Publication number 20120018905
- Publication date Jan 26, 2012
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME
- Publication number 20120006882
- Publication date Jan 12, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked Semiconductor Package Having Discrete Components
- Publication number 20110215438
- Publication date Sep 8, 2011
- Chua Swee Kwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND ENDOSCOPE APPARATUS
- Publication number 20110199473
- Publication date Aug 18, 2011
- OLYMPUS CORPORATION
- Kazuaki KOJIMA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20110199737
- Publication date Aug 18, 2011
- International Business Machines Corporation
- Katsuyuki Yonehara
- H01 - BASIC ELECTRIC ELEMENTS

Compression bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire bonding apparatus and method for manufacturing semiconductor d...

Wire bonding apparatus

Wire bond clamp design and lead frame capable of engaging with same

Semiconductor device

Ball bond attachment for a semiconductor die

Wire bonded electronic devices to round wire

Methods of forming wire interconnect structures

Methods of forming wire interconnect structures

Wire-bonding apparatus and method of manufacturing semiconductor de...

Electronic device and method for production

Method of fabricating a bond pad structure

Wire bonded electronic devices to round wire

Semiconductor chip and semiconductor package having the same

Direct die solder of gallium arsenide integrated circuit dies and m...

Methods of forming wire interconnect structures

Electronic device and method for production

Apparatus with a multi-layer coating and method of forming the same

Semiconductor module system having encapsulated through wire interc...

Bond pad structure

Semiconductor chip with bonding wire and method for making the same

Semiconductor device and method of manufacturing the same

Copper bonding compatible bond pad structure and method

Method for fabricating a through wire interconnect (TWI) on a semic...

Semiconductor device having lead wires connecting bonding pads form...

Semiconductor device

Method of manufacturing semiconductor device

Through wire interconnect (TWI) having bonded connection and encaps...

Electronic device and method for production

Resin sealing type semiconductor device and method of manufacturing...

Semiconductor apparatus and endoscope apparatus

Patents Applicationslast 30 patents

DOUBLE STITCH WIREBONDS

WIRE BONDING APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR D...

BALL BOND ATTACHMENT FOR A SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE

WIRE BOND CLAMP DESIGN AND LEAD FRAME CAPABLE OF ENGAGING WITH SAME

SEMICONDUCTOR DEVICES HAVING WIRE BONDING STRUCTURES AND METHODS OF...

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES

WIRE BONDED ELECTRONIC DEVICES TO ROUND WIRE

SEMICONDUCTOR DEVICE

WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

ELECTRONIC DEVICE AND METHOD FOR PRODUCTION

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...

Method for Assemblying a Semiconductor Chip Package with Deflection...

BOND PAD STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

COPPER BONDING COMPATIBLE BOND PAD STRUCTURE AND METHOD

Semiconductor Module System Having Stacked Components With Encapsul...

ELECTRONIC DEVICE AND METHOD FOR PRODUCTION

ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS

CONDUCTIVE BUMPS, WIRE LOOPS, AND METHODS OF FORMING THE SAME

Apparatus with a Multi-Layer Coating and Method of Forming the Same

Stacked Semiconductor Package Having Discrete Components

SEMICONDUCTOR APPARATUS AND ENDOSCOPE APPARATUS

SEMICONDUCTOR PACKAGE