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ELECTRICITY
H01
Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/83201
Compression bonding
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last 30 patents
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Patent Grant
Structure and formation method of chip package with protective lid
Patent number
11,978,715
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Meng-Tsung Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including binding agent adhering an integrated...
Patent number
11,929,345
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method of forming same
Patent number
11,908,829
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Yao-Te Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device
Patent number
11,874,705
Issue date
Jan 16, 2024
LG Display Co., Ltd.
Mose Lee
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
Patent number
11,855,065
Issue date
Dec 26, 2023
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device having connection unit
Patent number
11,830,802
Issue date
Nov 28, 2023
Samsung Display Co., Ltd.
Myongsoo Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Foldable display device and foldable electronic device
Patent number
11,824,050
Issue date
Nov 21, 2023
Innolux Corporation
Yuan-Lin Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process and device for low-temperature pressure sintering
Patent number
11,776,932
Issue date
Oct 3, 2023
Danfoss Silicon Power GmbH
Ronald Eisele
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,769,747
Issue date
Sep 26, 2023
Kioxia Corporation
Genki Sawada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Anisotropic conductive film and display device using the same
Patent number
11,683,963
Issue date
Jun 20, 2023
SAMSUNG DISPLAY CO., LTD.
Chungseok Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heterogeneous annealing method
Patent number
11,631,586
Issue date
Apr 18, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for securing components of an integrated circuit
Patent number
11,631,600
Issue date
Apr 18, 2023
Cerebras Systems Inc.
Jean-Philippe Fricker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process and device for low-temperature pressure sintering
Patent number
11,626,383
Issue date
Apr 11, 2023
Danfoss Silicon Power GmbH
Ronald Eisele
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Diffusion soldering with contaminant protection
Patent number
11,610,861
Issue date
Mar 21, 2023
Infineon Technologies Austria AG
Victor Verdugo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Power module comprising two substrates and method of manufacturing...
Patent number
11,574,889
Issue date
Feb 7, 2023
Infineon Technologies AG
Ottmar Geitner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembly
Patent number
11,508,694
Issue date
Nov 22, 2022
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for bonding substrates
Patent number
11,315,901
Issue date
Apr 26, 2022
EV Group E. Thallner GmbH
Dominik Zinner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device having connection unit
Patent number
11,296,018
Issue date
Apr 5, 2022
Samsung Display Co., Ltd.
Myongsoo Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated fan-out package and method of fabricating the same
Patent number
11,282,796
Issue date
Mar 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Yen Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip bonding method and bonding device
Patent number
11,239,198
Issue date
Feb 1, 2022
BOE Technology Group Co., Ltd.
Lili Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for processing a semiconductor device
Patent number
11,227,779
Issue date
Jan 18, 2022
ASM Technology Singapore Pte. Ltd.
Jiapei Ding
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for setting conditions for heating semiconductor chip during...
Patent number
11,201,132
Issue date
Dec 14, 2021
Shinkawa Ltd.
Tomonori Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding apparatus and method
Patent number
11,201,133
Issue date
Dec 14, 2021
Samsung Display Co., Ltd.
Joo Nyung Jang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Enhanced adhesive materials and processes for 3D applications
Patent number
11,168,234
Issue date
Nov 9, 2021
International Business Machines Corporation
James L. Hedrick
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Thermal interface materials including polymeric phase-change materials
Patent number
11,130,845
Issue date
Sep 28, 2021
International Business Machines Corporation
Dylan J. Boday
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor die assemblies with support members and assoc...
Patent number
11,101,262
Issue date
Aug 24, 2021
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded structure and method of manufacturing the same
Patent number
11,094,661
Issue date
Aug 17, 2021
Kabushiki Kaisha Toyota Chuo Kenkyusho
Hirofumi Ito
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing an integral join and automatic placement machine
Patent number
11,081,464
Issue date
Aug 3, 2021
Infineon Technologies AG
Nicolas Heuck
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Method of manufacturing semiconductor structure
Patent number
11,069,652
Issue date
Jul 20, 2021
Taiwan Semiconductor Manufacturing Company Ltd.
Alexander Kalnitsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Locking dual leadframe for flip chip on leadframe packages
Patent number
11,056,462
Issue date
Jul 6, 2021
Texas Instruments Incorporated
Lee Han Meng @ Eugene Lee
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240162184
Publication date
May 16, 2024
Samsung Electronics Co., Ltd.
Sang-Sick Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY D...
Publication number
20240164022
Publication date
May 16, 2024
BOE MLED TECHNOLOGY CO., LTD.
Jing WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUT...
Publication number
20240145421
Publication date
May 2, 2024
SOLAR APPLIED MATERIALS TECHNOLOGY CORP.
Kuan-Neng CHEN
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
Publication number
20240145430
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Yao-Te Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITE COMPONENT
Publication number
20240136268
Publication date
Apr 25, 2024
Murata Manufacturing Co., Ltd.
Yoshiaki SATAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
Publication number
20240128227
Publication date
Apr 18, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Perceval COUDRAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
Publication number
20240128254
Publication date
Apr 18, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20240071898
Publication date
Feb 29, 2024
Fuji Electric Co., Ltd.
Koji OSAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
Publication number
20240055422
Publication date
Feb 15, 2024
Fuji Electric Co., Ltd.
Tatsuo NISHIZAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR FABRICATING SILICON DIE STACKS FOR ELECTRON...
Publication number
20240047415
Publication date
Feb 8, 2024
NANO-X IMAGING LTD
Ukyo JEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE
Publication number
20240038749
Publication date
Feb 1, 2024
InnoLux Corporation
Yuan-Lin WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20240030176
Publication date
Jan 25, 2024
Samsung Electronics Co., Ltd.
Ji-Yong PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR APPLYING A SINTERING FORCE VIA A COMPRESSIBLE FILM
Publication number
20240030181
Publication date
Jan 25, 2024
ASMPT SINGAPORE PTE. LTD
Jiapei DING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER MODULE FOR HIGH-FREQUENCY USE AND METHOD FOR MANUFACTURING TH...
Publication number
20230411334
Publication date
Dec 21, 2023
BOARDTEK ELECTRONICS CORPORATION
CHIEN-CHENG LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230402424
Publication date
Dec 14, 2023
Samsung Electronics Co., Ltd.
Yongjin Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
Publication number
20230326894
Publication date
Oct 12, 2023
Chipbond Technology Corporation
Fei-Jain Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INSULATING PASTE-BASED CONDUCTIVE DEVICE AND MANUFACTURING METHOD T...
Publication number
20230307408
Publication date
Sep 28, 2023
Shenzhen Guangshe Zhaoming Technology Co., LTD
Jianwei CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Publication number
20230282611
Publication date
Sep 7, 2023
FUJI ELECTRIC CO., LTD.
Hiroki TAKAHASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Joining and Insulating Power Electronic Semiconductor Components
Publication number
20230215838
Publication date
Jul 6, 2023
SIEMENS AKTIENGESELLSCHAFT
Bernd Müller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DRIVING BACKPLANE, TRANSFER METHOD FOR LIGHT-EMITTING DIODE CHIP, D...
Publication number
20230215851
Publication date
Jul 6, 2023
BOE TECHNOLOGY GROUP CO., LTD.
Zhijun LV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20230207517
Publication date
Jun 29, 2023
Fuji Electric Co., Ltd.
Tsunehiro NAKAJIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
Publication number
20230207322
Publication date
Jun 29, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND...
Publication number
20230187403
Publication date
Jun 15, 2023
Hyundai Motor Company
Kyoung-Kook Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
Publication number
20230163096
Publication date
May 25, 2023
TORAY ENGINEERING CO., LTD.
Katsumi TERADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING T...
Publication number
20230163094
Publication date
May 25, 2023
Samsung Electronics Co., Ltd.
Euisun Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
Publication number
20230139612
Publication date
May 4, 2023
SK HYNIX INC.
Jin Woong KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
Publication number
20230060577
Publication date
Mar 2, 2023
Showa Denko Materials Co., Ltd.
Kunihiko AKAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD FOR IMPROVED BO...
Publication number
20230068886
Publication date
Mar 2, 2023
NXP USA, Inc.
You Ge
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GUIDE APPARATUS FOR TRANSFERRING LIGHT-EMITTING DEVICES ONTO A SUBS...
Publication number
20220384231
Publication date
Dec 1, 2022
Samsung Electronics Co., Ltd.
Myunghee KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID METAL THERMAL INTERFACE
Publication number
20220375817
Publication date
Nov 24, 2022
Indium Corporation
Ross B. Berntson
H01 - BASIC ELECTRIC ELEMENTS