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H01L2223/54406

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/54406comprising alphanumeric information

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated chip and manufacturing method therefor, and full-color i...
- Patent number 12,183,868
- Issue date Dec 31, 2024
- FOSHAN NATIONSTAR OPTOELECRONICS CO., LTD.
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable and wire bondable part marking
- Patent number 12,021,038
- Issue date Jun 25, 2024
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board, heat-dissipating member, and aluminum-diamon...
- Patent number 11,983,586
- Issue date May 14, 2024
- DENKA COMPANY LIMITED
- Daisuke Goto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages
- Patent number 11,955,435
- Issue date Apr 9, 2024
- SK hynix Inc.
- Ki Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 11,923,318
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device having information code on a lateral side of display...
- Patent number 11,923,316
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Sun Kwun Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,869,879
- Issue date Jan 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel including vernier mark for aligning conductive adhesi...
- Patent number 11,825,725
- Issue date Nov 21, 2023
- Samsung Display Co., Ltd.
- Jun-yong An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package semiconductor device and method of manufacture
- Patent number 11,817,360
- Issue date Nov 14, 2023
- Nexperia B.V.
- Loh Choong Keat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RFIC module, RFID tag, method for manufacturing RFIC module, and me...
- Patent number 11,621,493
- Issue date Apr 4, 2023
- Murata Manufacturing Co., Ltd.
- Noriyuki Ueki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reduced pattern-induced wafer deformation
- Patent number 11,587,889
- Issue date Feb 21, 2023
- Texas Instruments Incorporated
- Jonas Höhenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 11,508,679
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 11,476,233
- Issue date Oct 18, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel including vernier mark for aligning conductive adhesi...
- Patent number 11,437,441
- Issue date Sep 6, 2022
- Samsung Display Co., Ltd.
- Jun-yong An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and method for manufacturing semiconductor de...
- Patent number 11,398,434
- Issue date Jul 26, 2022
- Mitsubishi Electric Corporation
- Koichiro Kisu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic semiconductor component and method for producing an elec...
- Patent number 11,367,691
- Issue date Jun 21, 2022
- OSRAM OLED GmbH
- Matthias Kiessling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mark pattern in semiconductor device
- Patent number 11,296,036
- Issue date Apr 5, 2022
- United Microelectronics Corp.
- Chih-Kai Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising identifier on and/or in carrier
- Patent number 11,239,176
- Issue date Feb 1, 2022
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave device
- Patent number 11,228,297
- Issue date Jan 18, 2022
- Murata Manufacturing Co., Ltd.
- Kenichi Uesaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including identification number pattern
- Patent number 11,217,537
- Issue date Jan 4, 2022
- LG Display Co., Ltd.
- Young-Hyun Kong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Pad design for reliability enhancement in packages
- Patent number 11,177,200
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Indicia for light emitting diode chips
- Patent number 11,145,689
- Issue date Oct 12, 2021
- CreeLED, Inc.
- Nikolas Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for selectively forming identification mark on semiconducto...
- Patent number 11,121,093
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yue-Lin Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 11,107,772
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test line letter for embedded non-volatile memory technology
- Patent number 11,069,419
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jui-Tsung Lien
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package authentication feature
- Patent number 11,063,000
- Issue date Jul 13, 2021
- Infineon Technologies AG
- Stefan Dankowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical chip ID definition using nanoimprint lithography
- Patent number 11,056,439
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Daniel Piper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, chip on film, and alignment method
- Patent number 10,964,644
- Issue date Mar 30, 2021
- Kunshan Go-Visionox Opto-Electronics Co., Ltd.
- Renjie Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molding compound including a carbon nano-tube dispersion
- Patent number 10,953,593
- Issue date Mar 23, 2021
- Micron Technology, Inc.
- Myung Jin Yim
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor package using a coreless signal distribution structure
- Patent number 10,903,190
- Issue date Jan 26, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE EQUIPPED WITH...
- Publication number 20240395565
- Publication date Nov 28, 2024
- LX Semicon Co., Ltd.
- Min Yup JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROLED DEFECT MANAGEMENT
- Publication number 20240347398
- Publication date Oct 17, 2024
- VueReal Inc.
- Gholamreza CHAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND LASER MARKING METHOD
- Publication number 20240332205
- Publication date Oct 3, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kosuke MASUZAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERABLE AND WIRE BONDABLE PART MARKING
- Publication number 20240312926
- Publication date Sep 19, 2024
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240194612
- Publication date Jun 13, 2024
- SAMSUNG DISPLAY CO., LTD.
- Sun Kwun SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Using A Coreless Signal Distribution Structure
- Publication number 20240186292
- Publication date Jun 6, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Do Hyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE,...
- Publication number 20240178152
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE
- Publication number 20230352422
- Publication date Nov 2, 2023
- Infineon Technologies Austria AG
- Hwee Yin Low
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS
- Publication number 20230345685
- Publication date Oct 26, 2023
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDED INTEGRATED DEVICE PACKAGE
- Publication number 20230345684
- Publication date Oct 26, 2023
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230317590
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layout Design Method and Structure with Enhanced Process Window
- Publication number 20230260927
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Tse Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR REDUCING PATTERN-INDUCED WAFER DEFORMATION
- Publication number 20230170314
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jonas Höhenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING A METAL LAYER COMPRISING A MARKING
- Publication number 20230104665
- Publication date Apr 6, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS
- Publication number 20230095931
- Publication date Mar 30, 2023
- DESIGNER MOLECULES, INC.
- Farhad Mizori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230048228
- Publication date Feb 16, 2023
- SK HYNIX INC.
- Ki Yong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND ALUMINUM-DIAMON...
- Publication number 20230042932
- Publication date Feb 9, 2023
- DENKA COMPANY LIMITED
- Daisuke GOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
INTEGRATED CHIP AND MANUFACTURING METHOD THEREFOR, AND FULL-COLOR I...
- Publication number 20230029972
- Publication date Feb 2, 2023
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE AND WIRE BONDABLE PART MARKING
- Publication number 20220399280
- Publication date Dec 15, 2022
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD...
- Publication number 20220367578
- Publication date Nov 17, 2022
- SAMSUNG DISPLAY CO., LTD.
- Jun-yong AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20210358857
- Publication date Nov 18, 2021
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Linfeng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING AN ELEC...
- Publication number 20210249358
- Publication date Aug 12, 2021
- OSRAM OLED GmbH
- Matthias KIESSLING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFIC MODULE, RFID TAG, METHOD FOR MANUFACTURING RFIC MODULE, AND ME...
- Publication number 20210159601
- Publication date May 27, 2021
- Murata Manufacturing Co., Ltd.
- Noriyuki Ueki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Reduced pattern-induced wafer deformation
- Publication number 20210091013
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jonas Höhenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210066201
- Publication date Mar 4, 2021
- SAMSUNG DISPLAY CO., LTD.
- Sun Kwun SON
- G02 - OPTICS
Information Patent Application
POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE
- Publication number 20210028133
- Publication date Jan 28, 2021
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER ALIGNER
- Publication number 20200388523
- Publication date Dec 10, 2020
- Brooks Automation, Inc.
- Anthony C. BONORA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING INTEGRATION SCHEME WITH TRENCH ALIGNMENT MARKS
- Publication number 20200350257
- Publication date Nov 5, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING IDENTIFIER ON AND/OR IN CARRIER
- Publication number 20200335451
- Publication date Oct 22, 2020
- INFINEON TECHNOLOGIES AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, PRODUCT AND METHOD FOR MANUFACTURI...
- Publication number 20200312730
- Publication date Oct 1, 2020
- Advanced Semiconductor Engineering, Inc.
- Yu-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS

comprising alphanumeric information

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated chip and manufacturing method therefor, and full-color i...

Solderable and wire bondable part marking

Ceramic circuit board, heat-dissipating member, and aluminum-diamon...

Semiconductor packages

Method of manufacturing semiconductor package

Display device having information code on a lateral side of display...

Semiconductor package using a coreless signal distribution structure

Display panel including vernier mark for aligning conductive adhesi...

Chip scale package semiconductor device and method of manufacture

RFIC module, RFID tag, method for manufacturing RFIC module, and me...

Reduced pattern-induced wafer deformation

Polymer resin and compression mold chip scale package

Semiconductor package using a coreless signal distribution structure

Display panel including vernier mark for aligning conductive adhesi...

Semiconductor device, and method for manufacturing semiconductor de...

Electronic semiconductor component and method for producing an elec...

Mark pattern in semiconductor device

Package comprising identifier on and/or in carrier

Elastic wave device

Display device including identification number pattern

Pad design for reliability enhancement in packages

Indicia for light emitting diode chips

Methods for selectively forming identification mark on semiconducto...

Semiconductor package and method of manufacturing semiconductor pac...

Test line letter for embedded non-volatile memory technology

Semiconductor package authentication feature

Optical chip ID definition using nanoimprint lithography

Array substrate, chip on film, and alignment method

Molding compound including a carbon nano-tube dispersion

Semiconductor package using a coreless signal distribution structure

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE EQUIPPED WITH...

MICROLED DEFECT MANAGEMENT

SEMICONDUCTOR DEVICE AND LASER MARKING METHOD

SOLDERABLE AND WIRE BONDABLE PART MARKING

DISPLAY DEVICE

Semiconductor Package Using A Coreless Signal Distribution Structure

METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE

INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS

ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDED INTEGRATED DEVICE PACKAGE

SEMICONDUCTOR PACKAGE

Layout Design Method and Structure with Enhanced Process Window

PROCESS FOR REDUCING PATTERN-INDUCED WAFER DEFORMATION

SUBSTRATE HAVING A METAL LAYER COMPRISING A MARKING

UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS

SEMICONDUCTOR PACKAGES

CERAMIC CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND ALUMINUM-DIAMON...

INTEGRATED CHIP AND MANUFACTURING METHOD THEREFOR, AND FULL-COLOR I...

SOLDERABLE AND WIRE BONDABLE PART MARKING

DISPLAY PANEL, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD...

DISPLAY PANEL AND DISPLAY DEVICE

ELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING AN ELEC...

RFIC MODULE, RFID TAG, METHOD FOR MANUFACTURING RFIC MODULE, AND ME...

Reduced pattern-induced wafer deformation

DISPLAY DEVICE

POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE

WAFER ALIGNER

PATTERNING INTEGRATION SCHEME WITH TRENCH ALIGNMENT MARKS

PACKAGE COMPRISING IDENTIFIER ON AND/OR IN CARRIER

SEMICONDUCTOR PACKAGE STRUCTURE, PRODUCT AND METHOD FOR MANUFACTURI...