Details relating to semiconductor or other solid state devices covered by the group H01L23/00

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

H01L2223/544Marks applied to semiconductor devices or parts H01L2223/54406comprising alphanumeric information H01L2223/54413comprising digital information H01L2223/5442comprising non digital, non alphanumeric information H01L2223/54426for alignment H01L2223/54433containing identification or tracking information H01L2223/5444for electrical read out H01L2223/54446Wireless electrical read out H01L2223/54453for use prior to dicing H01L2223/5446Located in scribe lines H01L2223/54466Located in a dummy or reference die H01L2223/54473for use after dicing H01L2223/5448Located on chip prior to dicing and remaining on chip after dicing H01L2223/54486Located on package parts H01L2223/54493Peripheral marks on wafers H01L2223/58Structural electrical arrangements for semiconductor devices not otherwise provided for H01L2223/64Impedance arrangements H01L2223/66High-frequency adaptations H01L2223/6605High-frequency electrical connections H01L2223/6611Wire connections H01L2223/6616Vertical connections H01L2223/6622Coaxial feed-throughs in active or passive substrates H01L2223/6627Waveguides H01L2223/6633Transition between different waveguide types H01L2223/6638Differential pair signal lines H01L2223/6644Packaging aspects of high-frequency amplifiers H01L2223/665Bias feed arrangements H01L2223/6655Matching arrangements H01L2223/6661for passive devices H01L2223/6666for decoupling H01L2223/6672for integrated passive components H01L2223/6677for antenna H01L2223/6683for monolithic microwave integrated circuit [MMIC] H01L2223/6688Mixed frequency adaptations H01L2223/6694Optical signal interface included within high-frequency semiconductor device housing