comprising alternated and repeated etching and passivation steps

Industry

CPC
H01L21/30655

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/30655comprising alternated and repeated etching and passivation steps

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method having a through substrate via and...
- Patent number 12,148,664
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing residual contamination in singulated semiconduct...
- Patent number 12,100,622
- Issue date Sep 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for source-down vertical semiconductor device
- Patent number 12,094,967
- Issue date Sep 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a trench in a first semiconductor layer of a mul...
- Patent number 12,094,717
- Issue date Sep 17, 2024
- Robert Bosch GmbH
- Christof Schwenk
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,068,394
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film crystalline structure with surfaces having selected plane...
- Patent number 12,057,147
- Issue date Aug 6, 2024
- Seagate Technology LLC
- Tong Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,046,478
- Issue date Jul 23, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching
- Patent number 12,040,195
- Issue date Jul 16, 2024
- ASM IP Holding B.V.
- Charles Dezelah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for selectively depositing a metallic film on a substrate
- Patent number 12,033,861
- Issue date Jul 9, 2024
- ASM IP Holding B.V.
- Delphine Longrie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method
- Patent number 12,020,942
- Issue date Jun 25, 2024
- ULVAC, Inc.
- Taichi Suzuki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate processing method
- Patent number 12,009,219
- Issue date Jun 11, 2024
- Tokyo Electron Limited
- Yusuke Takino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cryogenic atomic layer etch with noble gases
- Patent number 11,996,294
- Issue date May 28, 2024
- Applied Materials, Inc.
- Alvaro Garcia De Gorordo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device chip manufacturing method
- Patent number 11,990,371
- Issue date May 21, 2024
- Disco Corporation
- Kazuki Higashiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,961,746
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Sho Kumakura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and devices related to radio frequency devices
- Patent number 11,948,802
- Issue date Apr 2, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming stacked layers and devices formed thereof
- Patent number 11,942,363
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature with non-uniform critical dimension and method o...
- Patent number 11,935,816
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure and semiconductor s...
- Patent number 11,917,806
- Issue date Feb 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xiaoling Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing a pre-etch protective layer
- Patent number 11,915,940
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Zhi Gang Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Recessed portion in a substrate and method of forming the same
- Patent number 11,886,015
- Issue date Jan 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask-integrated surface protective tape, and method of producing a...
- Patent number 11,862,504
- Issue date Jan 2, 2024
- Furukawa Electric Co., Ltd.
- Akira Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for deep trench capacitor with scalloped profile
- Patent number 11,854,817
- Issue date Dec 26, 2023
- KEY FOUNDRY CO., LTD.
- Seung Mo Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming high aspect ratio features
- Patent number 11,854,869
- Issue date Dec 26, 2023
- Ken Tokashiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating etch and passivation process
- Patent number 11,848,212
- Issue date Dec 19, 2023
- Lam Research Corporation
- Seongjun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching techniques
- Patent number 11,837,467
- Issue date Dec 5, 2023
- Toyko Electron Limited
- Pingshan Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and element chip manufacturing method
- Patent number 11,817,323
- Issue date Nov 14, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shogo Okita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 11,810,758
- Issue date Nov 7, 2023
- Tokyo Electron Limited
- Satoshi Itou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of reducing residual contamination in singulated semiconduct...
- Patent number 11,784,093
- Issue date Oct 10, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 11,776,792
- Issue date Oct 3, 2023
- HITACHI HIGH-TECH CORPORATION
- Shunsuke Tashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water soluble organic-inorganic hybrid mask formulations and their...
- Patent number 11,764,061
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Wenguang Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH ASPECT RATIO BOSCH DEEP ETCH
- Publication number 20240379373
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsing Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240379439
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363730
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM CRYSTALLINE STRUCTURE WITH SURFACES HAVING SELECTED PLANE...
- Publication number 20240339125
- Publication date Oct 10, 2024
- SEAGATE TECHNOLOGY LLC
- Tong Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ETCHING METHOD
- Publication number 20240304453
- Publication date Sep 12, 2024
- Ulvac, Inc.
- Taichi SUZUKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LOOP TIME VARYING BOSCH PROCESS FOR 2-DIMENSIONAL SMALL CD HI...
- Publication number 20240258112
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Chao Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Stacked Layers and Devices Formed Thereof
- Publication number 20240243011
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Removal via Multiple Flash Steps during Plasma Etch
- Publication number 20240234157
- Publication date Jul 11, 2024
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Etching Features in a Layer in a Substrate
- Publication number 20240234158
- Publication date Jul 11, 2024
- TOKYO ELECTRON LIMITED
- Indroneil Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS
- Publication number 20240213001
- Publication date Jun 27, 2024
- SEMES CO., LTD.
- Young Jo JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DEPOSITING PHOSPHORUS CONTAINING SILICON LAYER
- Publication number 20240213022
- Publication date Jun 27, 2024
- ASM IP HOLDING B.V.
- Brendan Marozas
- C30 - CRYSTAL GROWTH
Information Patent Application
RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20240168238
- Publication date May 23, 2024
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHODS WITH ALTERNATING NON-PLASMA AND PLASMA ETCHING PROC...
- Publication number 20240162042
- Publication date May 16, 2024
- American Air Liquide, Inc.
- Xiangyu GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sidewall Inorganic Passivation for Dielectric Etching Via Surface M...
- Publication number 20240162043
- Publication date May 16, 2024
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES
- Publication number 20240145253
- Publication date May 2, 2024
- Infineon Technologies Dresden GmbH & Co., KG
- Hans Taddiken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Removal via Multiple Flash Steps during Plasma Etch
- Publication number 20240136195
- Publication date Apr 25, 2024
- TOKYO ELECTRON LIMITED
- Alec Dorfner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120207
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung-Kai Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING HIGH ASPECT RATIO FEATURES
- Publication number 20240120237
- Publication date Apr 11, 2024
- Lodestar Licensing Group LLC
- Ken Tokashiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIPS
- Publication number 20240112955
- Publication date Apr 4, 2024
- Disco Corporation
- Yu ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING ETCH AND PASSIVATION PROCESS
- Publication number 20240087904
- Publication date Mar 14, 2024
- LAM RESEARCH CORPORATION
- Seongjun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCT...
- Publication number 20230402325
- Publication date Dec 14, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Gordon M. Grivna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20230378252
- Publication date Nov 23, 2023
- LAPIS SEMICONDUCTOR CO., LTD.
- Hiroshi SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20230343647
- Publication date Oct 26, 2023
- Plasma-Therm LLC
- Russell Westerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-BASED LINER PROTECTION FOR HIGH ASPECT RATIO PLASMA ETCH
- Publication number 20230298896
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Gregory Clinton Veber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230298897
- Publication date Sep 21, 2023
- HAMAMATSU PHOTONICS K. K.
- Wei DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRON EXTRACTION TYPE FREE-WHEELING DIODE DEVICE AND PREPARATION...
- Publication number 20230290890
- Publication date Sep 14, 2023
- JSAB Technologies (Shenzhen) Ltd.
- Hao FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING
- Publication number 20230268187
- Publication date Aug 24, 2023
- ASM IP HOLDING B.V.
- Charles Dezelah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALTERNATING ETCH AND PASSIVATION PROCESS
- Publication number 20230197459
- Publication date Jun 22, 2023
- LAM RESEARCH CORPORATION
- Seongjun Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS
- Publication number 20230107264
- Publication date Apr 6, 2023
- TOKYO ELECTRON LIMITED
- Fumiya TAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANING METHOD OF ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF...
- Publication number 20230102635
- Publication date Mar 30, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- SHOGO OKITA
- H01 - BASIC ELECTRIC ELEMENTS

comprising alternated and repeated etching and passivation steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method having a through substrate via and...

Method of reducing residual contamination in singulated semiconduct...

Structures and methods for source-down vertical semiconductor device

Method for forming a trench in a first semiconductor layer of a mul...

Semiconductor device and manufacturing method thereof

Thin-film crystalline structure with surfaces having selected plane...

Semiconductor structure and method for manufacturing semiconductor...

Atomic layer etching

Method for selectively depositing a metallic film on a substrate

Etching method

Substrate processing method

Cryogenic atomic layer etch with noble gases

Device chip manufacturing method

Substrate processing method and substrate processing apparatus

Methods and devices related to radio frequency devices

Methods for forming stacked layers and devices formed thereof

Conductive feature with non-uniform critical dimension and method o...

Method of manufacturing semiconductor structure and semiconductor s...

Method of depositing a pre-etch protective layer

Recessed portion in a substrate and method of forming the same

Mask-integrated surface protective tape, and method of producing a...

Manufacturing method for deep trench capacitor with scalloped profile

Methods of forming high aspect ratio features

Alternating etch and passivation process

Plasma etching techniques

Etching method and element chip manufacturing method

Plasma processing apparatus

Method of reducing residual contamination in singulated semiconduct...

Plasma processing apparatus and plasma processing method

Water soluble organic-inorganic hybrid mask formulations and their...

Patents Applicationslast 30 patents

HIGH ASPECT RATIO BOSCH DEEP ETCH

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

THIN-FILM CRYSTALLINE STRUCTURE WITH SURFACES HAVING SELECTED PLANE...

ETCHING METHOD

MULTI-LOOP TIME VARYING BOSCH PROCESS FOR 2-DIMENSIONAL SMALL CD HI...

Methods for Forming Stacked Layers and Devices Formed Thereof

Polymer Removal via Multiple Flash Steps during Plasma Etch

Method for Etching Features in a Layer in a Substrate

SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS

METHOD FOR DEPOSITING PHOSPHORUS CONTAINING SILICON LAYER

RECESSED PORTION IN A SUBSTRATE AND METHOD OF FORMING THE SAME

ETCHING METHODS WITH ALTERNATING NON-PLASMA AND PLASMA ETCHING PROC...

Sidewall Inorganic Passivation for Dielectric Etching Via Surface M...

METHODS AND DEVICES RELATED TO RADIO FREQUENCY DEVICES

Polymer Removal via Multiple Flash Steps during Plasma Etch

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

MICROELECTRONIC DEVICES INCLUDING HIGH ASPECT RATIO FEATURES

MANUFACTURING METHOD OF CHIPS

ALTERNATING ETCH AND PASSIVATION PROCESS

METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

METAL-BASED LINER PROTECTION FOR HIGH ASPECT RATIO PLASMA ETCH

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTRON EXTRACTION TYPE FREE-WHEELING DIODE DEVICE AND PREPARATION...

ATOMIC LAYER ETCHING

ALTERNATING ETCH AND PASSIVATION PROCESS

ETCHING METHOD AND ETCHING APPARATUS

CLEANING METHOD OF ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF...