comprising an eutectic alloy

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CPC
H01L2224/08502

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08502comprising an eutectic alloy

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing a connection between component parts, and comp...
- Patent number 11,961,820
- Issue date Apr 16, 2024
- OSRAM OLED GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing the same
- Patent number 11,894,335
- Issue date Feb 6, 2024
- Japan Display Inc.
- Kazuyuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joints on nickel surface finishes without gold plating
- Patent number 11,676,926
- Issue date Jun 13, 2023
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer-level semiconductor die attachment
- Patent number 10,217,718
- Issue date Feb 26, 2019
- Denselight Semiconductors Pte Ltd
- Yee Loy Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor light-emitting device and se...
- Patent number 9,905,521
- Issue date Feb 27, 2018
- Stanley Electric Co., Ltd.
- Mamoru Yuasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit structures and hybrid bonding...
- Patent number 8,809,123
- Issue date Aug 19, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...
- Publication number 20230275076
- Publication date Aug 31, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH DISSOLVABLE METAL LAYER
- Publication number 20230187390
- Publication date Jun 15, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian MEIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIERS AND METHOD OF FORMING SAME
- Publication number 20230132632
- Publication date May 4, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
- Publication number 20220059489
- Publication date Feb 24, 2022
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210398939
- Publication date Dec 23, 2021
- Japan Display Inc.
- Kazuyuki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Connection Between Component Parts, and Comp...
- Publication number 20200294962
- Publication date Sep 17, 2020
- OSRAM OLED GmbH
- Simeon Katz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE AND SE...
- Publication number 20160343927
- Publication date Nov 24, 2016
- Stanley Electric Co., Ltd
- Mamoru Yuasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Integrated Circuit Structures and Hybrid Bonding...
- Publication number 20130320556
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS

comprising an eutectic alloy

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing a connection between component parts, and comp...

Display device and method for manufacturing the same

Solder joints on nickel surface finishes without gold plating

Method for wafer-level semiconductor die attachment

Method for manufacturing semiconductor light-emitting device and se...

Three dimensional integrated circuit structures and hybrid bonding...

Patents Applicationslast 30 patents

DISPLAY BACKPLANE ASSEMBLY, LED DISPLAY MODULE, AND RELATED METHODS...

SEMICONDUCTOR DIE WITH DISSOLVABLE METAL LAYER

DIFFUSION BARRIERS AND METHOD OF FORMING SAME

SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING

DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method for Producing a Connection Between Component Parts, and Comp...

METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE AND SE...

Three Dimensional Integrated Circuit Structures and Hybrid Bonding...