comprising an eutectic alloy

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H01L2224/48506

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48506comprising an eutectic alloy

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solder joints on nickel surface finishes without gold plating
- Patent number 11,676,926
- Issue date Jun 13, 2023
- Schlumberger Technology Corporation
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 11,393,967
- Issue date Jul 19, 2022
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 10,916,688
- Issue date Feb 9, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wire bonding machine cleaning device and method
- Patent number 10,361,169
- Issue date Jul 23, 2019
- International Test Solutions, Inc.
- Alan E. Humphrey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free soldering method and soldered article
- Patent number 10,002,845
- Issue date Jun 19, 2018
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20230088776
- Publication date Mar 23, 2023
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING
- Publication number 20220059489
- Publication date Feb 24, 2022
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Mark Alex Kostinovsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20210126176
- Publication date Apr 29, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20200313059
- Publication date Oct 1, 2020
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE, WIRE BONDING METHOD USING THE BONDING WIRE, AND ELECT...
- Publication number 20180026004
- Publication date Jan 25, 2018
- Samsung Electronics Co., Ltd.
- WON-GIL HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE
- Publication number 20170012018
- Publication date Jan 12, 2017
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

comprising an eutectic alloy

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder joints on nickel surface finishes without gold plating

Power semiconductor chip, method for producing a power semiconducto...

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Semiconductor wire bonding machine cleaning device and method

Lead-free soldering method and soldered article

Patents Applicationslast 30 patents

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

SOLDER JOINTS ON NICKEL SURFACE FINISHES WITHOUT GOLD PLATING

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

BONDING WIRE, WIRE BONDING METHOD USING THE BONDING WIRE, AND ELECT...

LEAD-FREE SOLDERING METHOD AND SOLDERED ARTICLE