comprising an eutectic alloy

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CPC
H01L2224/16506

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16506comprising an eutectic alloy

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing display panel, display panel, and display...
- Patent number 11,776,942
- Issue date Oct 3, 2023
- Shanghai Tianma Micro-Electronics Co., Ltd.
- Canyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free column interconnect
- Patent number 10,950,573
- Issue date Mar 16, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,811,379
- Issue date Oct 20, 2020
- Samsung Electronics Co., Ltd.
- Doo Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump stretching method
- Patent number 10,163,835
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump stretching method for forming a solder bump joint in a...
- Patent number 9,978,709
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump stretching method and device for performing the same
- Patent number 9,842,817
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radiation detector element
- Patent number 9,748,300
- Issue date Aug 29, 2017
- Koninklijke Philips N.V.
- Nicolaas Johannes Anthonius Van Veen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump joint in a device including lamellar structures
- Patent number 9,475,145
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, electronic device, and semiconductor device m...
- Patent number 9,412,715
- Issue date Aug 9, 2016
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and method of manufacturing the same
- Patent number 9,230,935
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding wafers and structure of bonding part
- Patent number 9,136,232
- Issue date Sep 15, 2015
- Omron Corporation
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device, electronic device, and semiconductor device m...
- Patent number 8,901,751
- Issue date Dec 2, 2014
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic apparatus, electronic component-...
- Patent number 8,740,047
- Issue date Jun 3, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder, soldering method, and semiconductor device
- Patent number 8,673,762
- Issue date Mar 18, 2014
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electronic apparatus, electronic component-...
- Patent number 8,556,157
- Issue date Oct 15, 2013
- Fujitsu Limited
- Seiki Sakuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device provided with tin diffusion inhibiting layer,...
- Patent number 8,237,277
- Issue date Aug 7, 2012
- Casio Computer Co., Ltd.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device having flip-chip connection with circu...
- Patent number 6,764,938
- Issue date Jul 20, 2004
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electronic device having flip-chip connection with circu...
- Patent number 6,608,381
- Issue date Aug 19, 2003
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electronic device having flip-chip connection with circu...
- Patent number 5,977,637
- Issue date Nov 2, 1999
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electronic device having flip-chip connection with circu...
- Patent number 5,611,481
- Issue date Mar 18, 1997
- Fujitsu Limited
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230402442
- Publication date Dec 14, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...
- Publication number 20230117132
- Publication date Apr 20, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Canyuan ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE COLUMN INTERCONNECT
- Publication number 20200303339
- Publication date Sep 24, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20200013743
- Publication date Jan 9, 2020
- Samsung Electronics Co., Ltd.
- Doo Il KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRETCHING METHOD
- Publication number 20180108632
- Publication date Apr 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIATION DETECTOR ELEMENT
- Publication number 20160276387
- Publication date Sep 22, 2016
- Koninklijke Philips N.V.
- NICOLAAS JOHANNES ANTHONIUS VAN VEEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package on Package Structure and Method of Manufacturing the Same
- Publication number 20150108638
- Publication date Apr 23, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
- Publication number 20140339710
- Publication date Nov 20, 2014
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140159233
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...
- Publication number 20140008114
- Publication date Jan 9, 2014
- Fujitsu Limited
- Seiki Sakuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES
- Publication number 20130341785
- Publication date Dec 26, 2013
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-SOLDER METHOD FOR SELF-ALIGNING SOLDER BUMPS IN SEMICONDUCTOR A...
- Publication number 20130228916
- Publication date Sep 5, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Kazuaki Mawatari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A...
- Publication number 20130221521
- Publication date Aug 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...
- Publication number 20130087912
- Publication date Apr 11, 2013
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE
- Publication number 20120193800
- Publication date Aug 2, 2012
- FUJITSU LIMITED
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PROVIDED WITH TIN DIFFUSION INHIBITING LAYER,...
- Publication number 20110233769
- Publication date Sep 29, 2011
- CASIO COMPUTER CO., LTD.
- Hiroyasu Jobetto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...
- Publication number 20110220398
- Publication date Sep 15, 2011
- Fujitsu Limited
- Seiki Sakuyama
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated electronic device having flip-chip connection with circu...
- Publication number 20040209453
- Publication date Oct 21, 2004
- FUJITSU LIMITED
- Toshiya Akamatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED ELECTRONIC DEVICE HAVING FLIP-CHIP CONNECTION WITH CIRCU...
- Publication number 20020050404
- Publication date May 2, 2002
- TOSHIYA AKAMATSU
- H01 - BASIC ELECTRIC ELEMENTS

comprising an eutectic alloy

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Method for manufacturing display panel, display panel, and display...

Lead-free column interconnect

Semiconductor package

Solder bump stretching method

Solder bump stretching method for forming a solder bump joint in a...

Solder bump stretching method and device for performing the same

Radiation detector element

Solder bump joint in a device including lamellar structures

Semiconductor device, electronic device, and semiconductor device m...

Package on package structure and method of manufacturing the same

Method for bonding wafers and structure of bonding part

Semiconductor device, electronic device, and semiconductor device m...

Method of manufacturing electronic apparatus, electronic component-...

Solder, soldering method, and semiconductor device

Method of manufacturing electronic apparatus, electronic component-...

Semiconductor device provided with tin diffusion inhibiting layer,...

Integrated electronic device having flip-chip connection with circu...

Integrated electronic device having flip-chip connection with circu...

Integrated electronic device having flip-chip connection with circu...

Integrated electronic device having flip-chip connection with circu...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

METHOD FOR MANUFACTURING DISPLAY PANEL, DISPLAY PANEL, AND DISPLAY...

LEAD-FREE COLUMN INTERCONNECT

Semiconductor Package

SOLDER BUMP STRETCHING METHOD

RADIATION DETECTOR ELEMENT

Package on Package Structure and Method of Manufacturing the Same

METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART

PACKAGE ON PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...

SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES

TWO-SOLDER METHOD FOR SELF-ALIGNING SOLDER BUMPS IN SEMICONDUCTOR A...

SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A...

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND SEMICONDUCTOR DEVICE M...

SOLDER, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PROVIDED WITH TIN DIFFUSION INHIBITING LAYER,...

METHOD OF MANUFACTURING ELECTRONIC APPARATUS, ELECTRONIC COMPONENT-...

Integrated electronic device having flip-chip connection with circu...

INTEGRATED ELECTRONIC DEVICE HAVING FLIP-CHIP CONNECTION WITH CIRCU...