comprising an intermetallic compound

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H01L2224/48507

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48507comprising an intermetallic compound

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,270,971
- Issue date Mar 8, 2022
- Renesas Electronics Corporation
- Kenji Ikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical contact and method of forming a chi...
- Patent number 10,978,418
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for forming a semiconductor device
- Patent number 10,867,893
- Issue date Dec 15, 2020
- Infineon Technologies AG
- Sergey Ananiev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having insulating metal oxide layer covering...
- Patent number 10,770,384
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Soo-jae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,672,733
- Issue date Jun 2, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding systems and related methods
- Patent number 10,535,623
- Issue date Jan 14, 2020
- Semiconductor Components Industries, LLC
- Wentao Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,497,663
- Issue date Dec 3, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,461,055
- Issue date Oct 29, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming a chip package with a metal cont...
- Patent number 10,461,056
- Issue date Oct 29, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu alloy core bonding wire with Pd coating for semiconductor device
- Patent number 10,236,272
- Issue date Mar 19, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with sacrificial anode and method for forming
- Patent number 10,199,339
- Issue date Feb 5, 2019
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,121,758
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Wire bonding systems and related methods
- Patent number 10,109,610
- Issue date Oct 23, 2018
- Semiconductor Components Industries, LLC
- Wentao Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a protective material with a first pH f...
- Patent number 10,037,965
- Issue date Jul 31, 2018
- NXP USA, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable interconnect
- Patent number 9,960,130
- Issue date May 1, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,887,172
- Issue date Feb 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Methods for forming semiconductor devices with stepped bond pads
- Patent number 9,780,051
- Issue date Oct 3, 2017
- NXP USA, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,780,069
- Issue date Oct 3, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method of fabricating an electronic device
- Patent number 9,756,726
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corrosion-resistant copper bonds to aluminum
- Patent number 9,646,950
- Issue date May 9, 2017
- Texas Instruments Incorporated
- Kejun Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating same
- Patent number 9,536,855
- Issue date Jan 3, 2017
- Mitsubishi Electric Corporation
- Koji Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for protecting copper wire bonds on aluminum pads of a semic...
- Patent number 9,508,622
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Leo M. Higgins
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
- Publication number 20210082861
- Publication date Mar 18, 2021
- INFINEON TECHNOLOGIES AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200135687
- Publication date Apr 30, 2020
- RENESAS ELECTRONICS CORPORATION
- Kenji IKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20200013747
- Publication date Jan 9, 2020
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE
- Publication number 20190164927
- Publication date May 30, 2019
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip, Method for Producing a Power Semiconducto...
- Publication number 20190148318
- Publication date May 16, 2019
- SEMIKRON Elektronik GmbH & Co., KG
- Wolfgang-Michael SCHULZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEMS AND RELATED METHODS
- Publication number 20190013290
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Wentao QIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20180374816
- Publication date Dec 27, 2018
- Nippon Micrometal Corporation
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20180247887
- Publication date Aug 30, 2018
- Samsung Electronics Co., Ltd.
- Soo-jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170194280
- Publication date Jul 6, 2017
- Nippon Micrometal Corporation
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure With Sacrificial Anode and Method for Forming
- Publication number 20160329288
- Publication date Nov 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- SHEILA F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20160035691
- Publication date Feb 4, 2016
- MITSUBISHI ELECTRIC CORPORATION
- Koji YAMAZAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
TIN-BASED WIREBOND STRUCTURES
- Publication number 20140367859
- Publication date Dec 18, 2014
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20140349475
- Publication date Nov 27, 2014
- LSI Corporation
- John M. DeLucca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140191393
- Publication date Jul 10, 2014
- Siliconware Precision Industries Co., Ltd.
- Lung-Tang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT FOR A SEMICONDUCTOR DEVICE
- Publication number 20140145339
- Publication date May 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATE PAD STRUCTURES/PASSIVATION INTEGRATION SCHEMES TO REDUCE...
- Publication number 20140030541
- Publication date Jan 30, 2014
- LSI Corporation
- Hemanshu Bhatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBONDED SEMICONDUCTOR PACKAGE
- Publication number 20130264712
- Publication date Oct 10, 2013
- Advanced Semiconductor Engineering, Inc.
- Ta-Chun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE RECEIVING PAD
- Publication number 20130001777
- Publication date Jan 3, 2013
- STMicroelectronics (Grenoble 2) SAS
- Damien Veychard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120306077
- Publication date Dec 6, 2012
- RENESAS ELECTRONICS CORPORATION
- Takekazu Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE FOR SEMICONDUCTOR AND BONDING STRUCTURE THEREOF
- Publication number 20120299182
- Publication date Nov 29, 2012
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE MATERIAL AND METHOD FOR ENCAPS...
- Publication number 20120273954
- Publication date Nov 1, 2012
- LEO M. HIGGINS, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ag-Au-Pd TERNARY ALLOY BONDING WIRE
- Publication number 20120263624
- Publication date Oct 18, 2012
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MOISTURE BARRIER FOR A WIRE BOND
- Publication number 20120223432
- Publication date Sep 6, 2012
- LSI Corporation
- JOHN M. DELUCCA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY
- Publication number 20120153464
- Publication date Jun 21, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY
- Publication number 20120111927
- Publication date May 10, 2012
- LSI Corporation
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS

comprising an intermetallic compound

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip package, method of forming a chip package and method of formin...

Power semiconductor chip, method for producing a power semiconducto...

Bonding wire for semiconductor devices

Semiconductor device and method of manufacturing the same

Method of forming an electrical contact and method of forming a chi...

Semiconductor devices and methods for forming a semiconductor device

Bonding wire for semiconductor device

Semiconductor integrated circuit device

Printed circuit board having insulating metal oxide layer covering...

Cu alloy core bonding wire with Pd coating for semiconductor device

Wire bonding systems and related methods

Cu alloy core bonding wire with Pd coating for semiconductor device

Bonding wire for semiconductor device

Cu alloy core bonding wire with Pd coating for semiconductor device

Chip package and method of forming a chip package with a metal cont...

Silver bonding wire for semiconductor device containing indium, gal...

Cu alloy core bonding wire with Pd coating for semiconductor device

Semiconductor structure with sacrificial anode and method for forming

Semiconductor device

Bonding wire for semiconductor device

Wire bonding systems and related methods

Semiconductor device having a protective material with a first pH f...

Reliable interconnect

Bonding wire for semiconductor device

Methods for forming semiconductor devices with stepped bond pads

Semiconductor device

Electronic device and method of fabricating an electronic device

Corrosion-resistant copper bonds to aluminum

Semiconductor device and method of fabricating same

Method for protecting copper wire bonds on aluminum pads of a semic...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

BONDING WIRE FOR SEMICONDUCTOR DEVICES

CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

Cu ALLOY CORE BONDING WIRE WITH Pd COATING FOR SEMICONDUCTOR DEVICE

Power Semiconductor Chip, Method for Producing a Power Semiconducto...

WIRE BONDING SYSTEMS AND RELATED METHODS

BONDING WIRE FOR SEMICONDUCTOR DEVICES

PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

BONDING WIRE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

Semiconductor Structure With Sacrificial Anode and Method for Forming

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME

TIN-BASED WIREBOND STRUCTURES

MOISTURE BARRIER FOR A WIRE BOND

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

ENCAPSULANT FOR A SEMICONDUCTOR DEVICE

ALTERNATE PAD STRUCTURES/PASSIVATION INTEGRATION SCHEMES TO REDUCE...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

WIREBONDED SEMICONDUCTOR PACKAGE

COPPER WIRE RECEIVING PAD

SEMICONDUCTOR DEVICE

COPPER BONDING WIRE FOR SEMICONDUCTOR AND BONDING STRUCTURE THEREOF

SEMICONDUCTOR DEVICE WITH PROTECTIVE MATERIAL AND METHOD FOR ENCAPS...

Ag-Au-Pd TERNARY ALLOY BONDING WIRE

MOISTURE BARRIER FOR A WIRE BOND

LOCALIZED ALLOYING FOR IMPROVED BOND RELIABILITY

ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY