comprising an intermetallic compound

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CPC
H01L2224/32507

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32507comprising an intermetallic compound

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch soldering of different elements in power module
- Patent number 11,798,924
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 11,688,670
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced solder alloys for electronic interconnects
- Patent number 11,411,150
- Issue date Aug 9, 2022
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low thermal resistance hanging die package
- Patent number 10,347,558
- Issue date Jul 9, 2019
- Intel IP Corporation
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Strong, heat stable junction
- Patent number 10,026,708
- Issue date Jul 17, 2018
- The United States of America as represented by the Secretary of the Army
- Patrick J Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 10,010,980
- Issue date Jul 3, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free soldering method and soldered article
- Patent number 10,002,845
- Issue date Jun 19, 2018
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Paste for joining components of electronic modules, system and meth...
- Patent number 9,815,146
- Issue date Nov 14, 2017
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Hermann Oppermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating same
- Patent number 9,536,855
- Issue date Jan 3, 2017
- Mitsubishi Electric Corporation
- Koji Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package including bonding layer having Ag3Sn
- Patent number 9,520,377
- Issue date Dec 13, 2016
- Samsung Electronics Co., Ltd.
- Jeong-Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with multi-layer contact
- Patent number 9,490,193
- Issue date Nov 8, 2016
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module
- Patent number 9,426,915
- Issue date Aug 23, 2016
- Mitsubishi Materials Corporation
- Touyou Ohashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method, method for producing electronic device and electron...
- Patent number 9,409,247
- Issue date Aug 9, 2016
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder, solder joint structure and method of forming solder joint s...
- Patent number 9,308,603
- Issue date Apr 12, 2016
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and bonding material for semiconductor device
- Patent number 9,217,192
- Issue date Dec 22, 2015
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection arrangement of an electric and/or electronic component
- Patent number 9,177,934
- Issue date Nov 3, 2015
- Robert Bosch GmbH
- Christiane Frueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and the method to manufacture thereof
- Patent number 9,171,818
- Issue date Oct 27, 2015
- Cyntec Co., Ltd.
- Da-Jung Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Junction and electrical connection
- Patent number 9,142,518
- Issue date Sep 22, 2015
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 9,044,816
- Issue date Jun 2, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device using diffusion soldering
- Patent number 8,975,117
- Issue date Mar 10, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submicron connection layer and method for using the same to connect...
- Patent number 8,951,837
- Issue date Feb 10, 2015
- National Chiao Tung University
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and substrate bonding method
- Patent number 8,916,449
- Issue date Dec 23, 2014
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Soldering of Different Elements in Power Module
- Publication number 20240047439
- Publication date Feb 8, 2024
- INFINEON TECHNOLOGIES AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20230290709
- Publication date Sep 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CE...
- Publication number 20230027669
- Publication date Jan 26, 2023
- INFINEON TECHNOLOGIES AG
- Chee Yang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Soldering of Different Elements in Power Module
- Publication number 20210391310
- Publication date Dec 16, 2021
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Device and Method for Fabricating a Power Semic...
- Publication number 20210225795
- Publication date Jul 22, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20210134708
- Publication date May 6, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW THERMAL RESISTANCE HANGING DIE PACKAGE
- Publication number 20180218962
- Publication date Aug 2, 2018
- Intel IP Corporation
- Christian GEISSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE AND ELECTRON...
- Publication number 20140345939
- Publication date Nov 27, 2014
- Kosuke Nakano
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
DIE BONDING METHOD AND DIE BONDING STRUCTURE OF LIGHT EMITTING DIOD...
- Publication number 20140175495
- Publication date Jun 26, 2014
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...
- Publication number 20140134459
- Publication date May 15, 2014
- Industrial Technology Research Institute
- Kuo-Shu Kao
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM ADHESIVE
- Publication number 20140120356
- Publication date May 1, 2014
- ORMET CIRCUITS, INC.
- Catherine Shearer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...
- Publication number 20140111956
- Publication date Apr 24, 2014
- Fuji Electric Co., Ltd.
- Katsumi TANIGUCHI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
STRONG, HEAT STABLE JUNCTION
- Publication number 20140110848
- Publication date Apr 24, 2014
- U.S. ARMY RESEARCH LABORATORY ATTN: RDRL-LOC-I
- Patrick J. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURE
- Publication number 20140103531
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Taichi Nakamura
- B32 - LAYERED PRODUCTS
Information Patent Application
PASTE FOR JOINING COMPONENTS OF ELECTRONIC MODULES, SYSTEM AND METH...
- Publication number 20140079472
- Publication date Mar 20, 2014
- Fraunhofer Gesellschaft zur Foederung der Angewandten Forschung e.V.
- Hermann Oppermann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTED STRUCTURE
- Publication number 20140048942
- Publication date Feb 20, 2014
- Taichi Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBMICRON CONNECTION LAYER AND METHOD FOR USING THE SAME TO CONNECT...
- Publication number 20140008801
- Publication date Jan 9, 2014
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
IMPROVEMENTS OF LONG TERM BONDLINE RELIABILITY OF POWER ELECTRONICS...
- Publication number 20130270327
- Publication date Oct 17, 2013
- Toyota Motor Engineering & Manufacturing North America
- Sang Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...
- Publication number 20130228905
- Publication date Sep 5, 2013
- Infineon Technologies Austria AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Using Diffusion Soldering
- Publication number 20130200532
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF
- Publication number 20130146341
- Publication date Jun 13, 2013
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and a Method for Fabricating an Electronic Device
- Publication number 20130140685
- Publication date Jun 6, 2013
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20130010446
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ewe Henrik
- H01 - BASIC ELECTRIC ELEMENTS

comprising an intermetallic compound

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic device with multi-layer contact and system

Batch soldering of different elements in power module

Semiconductor package and method for fabricating a semiconductor pa...

Soldering a conductor to an aluminum layer

Advanced solder alloys for electronic interconnects

Method and apparatus for creating a bond between objects based on f...

Method for producing electronic device with multi-layer contact

Method for applying a bonding layer

Low thermal resistance hanging die package

Metallic particle paste, cured product using same, and semiconducto...

Strong, heat stable junction

Solder paste, joining method using the same and joined structure

Lead-free soldering method and soldered article

Paste for joining components of electronic modules, system and meth...

Method for applying a bonding layer

Semiconductor packaging containing sintering die-attach material

Semiconductor device and method of fabricating same

Semiconductor device package including bonding layer having Ag3Sn

Electronic device with multi-layer contact

Power module

Joining method, method for producing electronic device and electron...

Solder, solder joint structure and method of forming solder joint s...

Semiconductor device and bonding material for semiconductor device

Connection arrangement of an electric and/or electronic component

Package structure and the method to manufacture thereof

Junction and electrical connection

Solder paste, joining method using the same and joined structure

Semiconductor device using diffusion soldering

Submicron connection layer and method for using the same to connect...

Package structure and substrate bonding method

Patents Applicationslast 30 patents

Method for Fabricating a Power Semiconductor Device

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

Batch Soldering of Different Elements in Power Module

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CE...

Batch Soldering of Different Elements in Power Module

Power Semiconductor Device and Method for Fabricating a Power Semic...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

Electronic Device with Multi-Layer Contact and System

Method for Producing Electronic Device With Multi-Layer Contact

LOW THERMAL RESISTANCE HANGING DIE PACKAGE

JOINING METHOD, METHOD FOR PRODUCING ELECTRONIC DEVICE AND ELECTRON...

DIE BONDING METHOD AND DIE BONDING STRUCTURE OF LIGHT EMITTING DIOD...

SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT S...

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

CONDUCTIVE FILM ADHESIVE

JOINING METHOD USING METAL FOAM, METHOD OF MANUFACTURING SEMICONDUC...

STRONG, HEAT STABLE JUNCTION

BONDED STRUCTURE

PASTE FOR JOINING COMPONENTS OF ELECTRONIC MODULES, SYSTEM AND METH...

MOUNTED STRUCTURE

SUBMICRON CONNECTION LAYER AND METHOD FOR USING THE SAME TO CONNECT...

Package Structure and Substrate Bonding Method

IMPROVEMENTS OF LONG TERM BONDLINE RELIABILITY OF POWER ELECTRONICS...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBST...

Semiconductor Device Using Diffusion Soldering

PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF

Electronic Device and a Method for Fabricating an Electronic Device

LAMINATE ELECTRONIC DEVICE