comprising an intermetallic compound

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H01L2224/08503

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/08503comprising an intermetallic compound

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,984,417
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip, method for producing a power semiconducto...
- Patent number 11,664,335
- Issue date May 30, 2023
- Semikron Elektronik GmbH & Co., KG
- Wolfgang-Michael Schulz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
- Patent number 11,387,202
- Issue date Jul 12, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,270,971
- Issue date Mar 8, 2022
- Renesas Electronics Corporation
- Kenji Ikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for assembly of semiconductor structures in...
- Patent number 10,396,269
- Issue date Aug 27, 2019
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Interconnect structure and semiconductor structures for assembly of...
- Patent number 10,242,968
- Issue date Mar 26, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interconnect structures and methods for fabricating interconnect st...
- Patent number 10,121,754
- Issue date Nov 6, 2018
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming solder bump, and solder bump
- Patent number 10,090,268
- Issue date Oct 2, 2018
- MURATA MANUFACTURING CO., LTD.
- Yasuyuki Sekimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-strike process for bonding packages and the packages thereof
- Patent number 10,068,868
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming post-passivation interconnect structure
- Patent number 9,953,891
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-strike process for bonding
- Patent number 9,576,929
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with multi-layer contact
- Patent number 9,490,193
- Issue date Nov 8, 2016
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for inhibiting growth of intermetallic compounds
- Patent number 8,835,300
- Issue date Sep 16, 2014
- National Chiao Tung University
- Chih Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
IC devices having TSVS including protruding tips having IMC blockin...
- Patent number 8,299,612
- Issue date Oct 30, 2012
- Texas Instruments Incorporated
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC devices having TSVS including protruding tips having IMC blockin...
- Patent number 8,039,385
- Issue date Oct 18, 2011
- Texas Instruments Incorporated
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240063159
- Publication date Feb 22, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROL FOR BONDING
- Publication number 20230299029
- Publication date Sep 21, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Jeremy Alfred Theil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20230105341
- Publication date Apr 6, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230005849
- Publication date Jan 5, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20200279821
- Publication date Sep 3, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200135687
- Publication date Apr 30, 2020
- RENESAS ELECTRONICS CORPORATION
- Kenji IKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip, Method for Producing a Power Semiconducto...
- Publication number 20190148318
- Publication date May 16, 2019
- SEMIKRON Elektronik GmbH & Co., KG
- Wolfgang-Michael SCHULZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ZN DOPED SOLDERS ON CU SURFACE FINISH FOR THIN FLI APPLICATION
- Publication number 20180047689
- Publication date Feb 15, 2018
- Intel Corporation
- Fay HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING POST-PASSIVATION INTERCONNECT STRUCTURE
- Publication number 20150325539
- Publication date Nov 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and a Method for Fabricating an Electronic Device
- Publication number 20130140685
- Publication date Jun 6, 2013
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-PASSIVATION INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20130113094
- Publication date May 9, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS
- Publication number 20130037940
- Publication date Feb 14, 2013
- NATIONAL CHIAO-TUNG UNIVERSITY
- Chih CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRIC JOINT STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20130000967
- Publication date Jan 3, 2013
- Samsung Electro-Mechanics CO., LTD.
- Dong Jun LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IC DEVICES HAVING TSVS INCLUDING PROTRUDING TIPS HAVING IMC BLOCKIN...
- Publication number 20120235296
- Publication date Sep 20, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS

comprising an intermetallic compound

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Electronic device with multi-layer contact and system

Power semiconductor chip, method for producing a power semiconducto...

Nanowire bonding interconnect for fine-pitch microelectronics

Semiconductor device and method of manufacturing the same

Bonded structure and method of manufacturing the same

Method for producing electronic device with multi-layer contact

Interconnect structures for assembly of semiconductor structures in...

Interconnect structure and semiconductor structures for assembly of...

Interconnect structures and methods for fabricating interconnect st...

Method of forming solder bump, and solder bump

Multi-strike process for bonding packages and the packages thereof

Method of forming post-passivation interconnect structure

Multi-strike process for bonding

Electronic device with multi-layer contact

Method for inhibiting growth of intermetallic compounds

IC devices having TSVS including protruding tips having IMC blockin...

IC devices having TSVS including protruding tips having IMC blockin...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME

EXPANSION CONTROL FOR BONDING

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic Device with Multi-Layer Contact and System

Power Semiconductor Chip, Method for Producing a Power Semiconducto...

Method for Producing Electronic Device With Multi-Layer Contact

ZN DOPED SOLDERS ON CU SURFACE FINISH FOR THIN FLI APPLICATION

METHOD OF FORMING POST-PASSIVATION INTERCONNECT STRUCTURE

Electronic Device and a Method for Fabricating an Electronic Device

POST-PASSIVATION INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS

ELECTRIC JOINT STRUCTURE AND METHOD FOR PREPARING THE SAME

IC DEVICES HAVING TSVS INCLUDING PROTRUDING TIPS HAVING IMC BLOCKIN...