comprising anti-fuses

Industry

CPC
H01L23/5252

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5252comprising anti-fuses

Industries

Patents Grantslast 30 patents

Information Patent Grant
Low resistance MTJ antifuse circuitry designs and methods of operation
- Patent number 12,142,309
- Issue date Nov 12, 2024
- EVERSPIN TECHNOLOGIES, INC.
- Syed M. Alam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
One time programmable bitcell with select device in isolated well
- Patent number 12,082,403
- Issue date Sep 3, 2024
- Synopsys, Inc.
- Andrew Edward Horch
- G11 - INFORMATION STORAGE
Information Patent Grant
Anti-fuse array
- Patent number 12,073,169
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Sheng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with fuse component
- Patent number 12,057,393
- Issue date Aug 6, 2024
- NANYA TECHNOLOGY CORPORATION
- Kai-Po Shang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-fuse unit and anti-fuse array
- Patent number 12,046,552
- Issue date Jul 23, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ChihCheng Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Fuse cell structure
- Patent number 12,041,767
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jhon Jhy Liaw
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structures of anti-fuse devices and core devices with...
- Patent number 12,033,938
- Issue date Jul 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xianlei Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,033,884
- Issue date Jul 9, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and structure for reduce OTP cell area and leakage
- Patent number 12,010,833
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Sheng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing a fuse component
- Patent number 12,002,752
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Kai-Po Shang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout method by buried rail for centralized anti-fuse read current
- Patent number 11,985,819
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Sheng Chang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming electrical fuse matrix
- Patent number 11,955,427
- Issue date Apr 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device including an electronic f...
- Patent number 11,935,605
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure
- Patent number 11,923,373
- Issue date Mar 5, 2024
- United Microelectronics Corp.
- Bo Tao
- G11 - INFORMATION STORAGE
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Anti-fuse device and manufacturing method thereof
- Patent number 11,916,016
- Issue date Feb 27, 2024
- Winbond Electronics Corp.
- Hung-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with programmable unit
- Patent number 11,916,019
- Issue date Feb 27, 2024
- NANYA TECHNOLOGY CORPORATION
- Te-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse component, semiconductor device, and method for manufacturing...
- Patent number 11,916,015
- Issue date Feb 27, 2024
- NANYA TECHNOLOGY CORPORATION
- Kai-Po Shang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-fuse memory and control method thereof
- Patent number 11,894,082
- Issue date Feb 6, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Rumin Ji
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertical field effect transistor including integrated antifuse
- Patent number 11,882,695
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Kangguo Cheng
- G11 - INFORMATION STORAGE
Information Patent Grant
Anti-fuse with laterally extended liner
- Patent number 11,881,431
- Issue date Jan 23, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,876,011
- Issue date Jan 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Anti-fuse unit and anti-fuse array
- Patent number 11,869,608
- Issue date Jan 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ChihCheng Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing a 3D semiconductor device and structure with m...
- Patent number 11,862,503
- Issue date Jan 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices and methods of manufacturing thereof
- Patent number 11,856,762
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ONE-TIME-PROGRAMMABLE DEVICE STRUCTURE
- Publication number 20240387365
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FUSE STRUCTURE BY VIA LANDING
- Publication number 20240389312
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSE DEVICE
- Publication number 20240370622
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Sheng CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
FUSE CELL STRUCTURE
- Publication number 20240349495
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jhon Jhy Liaw
- G11 - INFORMATION STORAGE
Information Patent Application
SECURE ANTI-FUSE ONE TIME PROGRAMMABLE BIT CELL DESIGN
- Publication number 20240321370
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Abhijeet PAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240312907
- Publication date Sep 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Xianlei CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240306382
- Publication date Sep 12, 2024
- RENESAS ELECTRONICS CORPORATION
- Eiji HIRAIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR REDUCE OTP CELL AREA AND LEAKAGE
- Publication number 20240292609
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Sheng Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PROTECTING ANTI-FUSE CELL
- Publication number 20240260258
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Sheng Chang
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF FORMING ELECTRICAL FUSE MATRIX
- Publication number 20240250022
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECT...
- Publication number 20240222270
- Publication date Jul 4, 2024
- Intel Corporation
- Yao-Feng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...
- Publication number 20240213073
- Publication date Jun 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
TWO-TRANSISTOR CHIP AND THREE-TRANSISTOR CHIP IDENTIFICATION BIT CELLS
- Publication number 20240202305
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Kangguo Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANTIFUSE DEVICES AND METHODS OF MAKING THEREOF
- Publication number 20240203873
- Publication date Jun 20, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- SHU HUI LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240178040
- Publication date May 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240170490
- Publication date May 23, 2024
- UNITED MICROELECTRONICS CORP.
- BO TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240170319
- Publication date May 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240145289
- Publication date May 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240128116
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS
- Publication number 20240112942
- Publication date Apr 4, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240105490
- Publication date Mar 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
MODIFIED FUSE STRUCTURE AND METHOD OF USE
- Publication number 20240096789
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Sheng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240090209
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTIFUSES USING A FINFET ARCHITECTURE
- Publication number 20240063114
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING
- Publication number 20240055291
- Publication date Feb 15, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
ANTI-FUSE ARRAY AND MEMORY
- Publication number 20240049461
- Publication date Feb 8, 2024
- Changxin Memory Technologies, Inc.
- Dongbo ZHU
- G11 - INFORMATION STORAGE
Information Patent Application
EFUSE
- Publication number 20240049459
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING FUSE COMPONENT
- Publication number 20240014127
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- WEI-ZHONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240008269
- Publication date Jan 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Chin-Piao CHANG
- G11 - INFORMATION STORAGE

comprising anti-fuses

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Low resistance MTJ antifuse circuitry designs and methods of operation

3D semiconductor device and structure with single-crystal layers

3D semiconductor device and structure with metal layers and memory...

Methods for producing a 3D semiconductor device and structure with...

One time programmable bitcell with select device in isolated well

Anti-fuse array

3D semiconductor device and structure with bonding and DRAM memory...

Semiconductor device with fuse component

Anti-fuse unit and anti-fuse array

Fuse cell structure

Semiconductor structures of anti-fuse devices and core devices with...

Methods for producing a 3D semiconductor device and structure with...

Method and structure for reduce OTP cell area and leakage

Method for manufacturing a fuse component

Layout method by buried rail for centralized anti-fuse read current

Method of forming electrical fuse matrix

Method for preparing semiconductor device including an electronic f...

Semiconductor structure

3D semiconductor device and structure with bonding

Anti-fuse device and manufacturing method thereof

Method for fabricating semiconductor device with programmable unit

Fuse component, semiconductor device, and method for manufacturing...

3D semiconductor device and structure with memory

Anti-fuse memory and control method thereof

Vertical field effect transistor including integrated antifuse

Anti-fuse with laterally extended liner

3D semiconductor device and structure with single-crystal layers

Anti-fuse unit and anti-fuse array

Method for producing a 3D semiconductor device and structure with m...

Memory devices and methods of manufacturing thereof

Patents Applicationslast 30 patents

ONE-TIME-PROGRAMMABLE DEVICE STRUCTURE

METAL FUSE STRUCTURE BY VIA LANDING

ANTI-FUSE DEVICE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

FUSE CELL STRUCTURE

SECURE ANTI-FUSE ONE TIME PROGRAMMABLE BIT CELL DESIGN

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD AND STRUCTURE FOR REDUCE OTP CELL AREA AND LEAKAGE

METHOD FOR PROTECTING ANTI-FUSE CELL

METHOD OF FORMING ELECTRICAL FUSE MATRIX

VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECT...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...

TWO-TRANSISTOR CHIP AND THREE-TRANSISTOR CHIP IDENTIFICATION BIT CELLS

ANTIFUSE DEVICES AND METHODS OF MAKING THEREOF

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

SEMICONDUCTOR STRUCTURE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH SINGLE-CRYSTAL LAYERS

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

MODIFIED FUSE STRUCTURE AND METHOD OF USE

MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF

ANTIFUSES USING A FINFET ARCHITECTURE

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING

ANTI-FUSE ARRAY AND MEMORY

EFUSE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING FUSE COMPONENT

MEMORY DEVICE AND METHOD OF FORMING THE SAME