comprising carbon particles as main constituent

Industry

CPC
H05K3/249

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/249comprising carbon particles as main constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Surface-treated glass cloth, prepreg, and printed wiring board
- Patent number 12,041,727
- Issue date Jul 16, 2024
- Nitto Boseki Co., LTD
- Kazutaka Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite transparent conductors and methods of forming the same
- Patent number 11,224,130
- Issue date Jan 11, 2022
- Cambrios Film Solutions Corporation
- David Jones
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Nanowire-based transparent conductors and applications thereof
- Patent number 10,749,048
- Issue date Aug 18, 2020
- Cambrios Film Solutions Corporation
- Pierre-Marc Allemand
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Windows with invisible patterned conductive layers
- Patent number 10,453,580
- Issue date Oct 22, 2019
- Apple Inc.
- James R. Wilson
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Composite transparent conductors and methods of forming the same
- Patent number 10,244,637
- Issue date Mar 26, 2019
- Cambrios Film Solutions Corporation
- David Jones
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanowire-based transparent conductors and applications thereof
- Patent number 8,760,606
- Issue date Jun 24, 2014
- Cambrios Technologies Corporation
- Pierre-Marc Allemand
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Circuit board with kneaded conductive paste
- Patent number 8,314,339
- Issue date Nov 20, 2012
- Fujitsu Limited
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldermask-less printed wiring board
- Patent number 8,168,892
- Issue date May 1, 2012
- Nokia Corporation
- Esa H. Kauppinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pad structure with a nano-structured coating film
- Patent number 8,102,063
- Issue date Jan 24, 2012
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanowire-based transparent conductors and applications thereof
- Patent number 8,094,247
- Issue date Jan 10, 2012
- Cambrios Technologies Corporation
- Pierre-Marc Allemand
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Composite transparent conductors and methods of forming the same
- Patent number 8,018,563
- Issue date Sep 13, 2011
- Cambrios Technologies Corporation
- David Jones
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Co-processable photoimageable silver and corbon nanotube compositio...
- Patent number 8,002,603
- Issue date Aug 23, 2011
- E. I. Du Pont de Nemours and Company
- Haixin Yang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electrically conductive substrate with high heat conductivity
- Patent number 7,655,292
- Issue date Feb 2, 2010
- Kaylu Industrial Corporation
- Li-Wei Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density interconnections with nanowiring
- Patent number 7,504,014
- Issue date Mar 17, 2009
- Fujitsu Limited
- Michael G. Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 7,381,902
- Issue date Jun 3, 2008
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an electronic pressure sensitive transducer on a...
- Patent number 7,213,323
- Issue date May 8, 2007
- Interlink Electronics, Inc.
- Jeffrey R. Baker
- G01 - MEASURING TESTING
Information Patent Grant
Self-assembled nanometer conductive bumps and method for fabricating
- Patent number 6,989,325
- Issue date Jan 24, 2006
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic pressure sensitive transducer apparatus and method for m...
- Patent number 6,909,354
- Issue date Jun 21, 2005
- Interlink Electronics, Inc.
- Jeffrey R. Baker
- G01 - MEASURING TESTING
Information Patent Grant
Edge connectors for printed circuit boards comprising conductive ink
- Patent number 6,821,555
- Issue date Nov 23, 2004
- 3 Com Corporation
- Denis Jean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board incorporating enhanced conductive ink
- Patent number 6,683,259
- Issue date Jan 27, 2004
- Siemens VDO Automotive Corporation
- Qi Tao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sliding connector interface with non-metallic contacts
- Patent number 6,439,900
- Issue date Aug 27, 2002
- 3COM Corporation
- Douglas Alan Sward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge connectors for printed circuit boards comprising conductive ink
- Patent number 6,265,051
- Issue date Jul 24, 2001
- 3COM Corporation
- Denis Jean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 5,291,179
- Issue date Mar 1, 1994
- West Electric Company, Ltd.
- Isao Ooe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with contact positions, as used for telecommunication...
- Patent number 4,647,729
- Issue date Mar 3, 1987
- Northern Telecom Limited
- Geoffrey A. Collar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of soldering circuit boards with solder-repellent contacts
- Patent number 4,511,076
- Issue date Apr 16, 1985
- Braun Aktiengesellschaft
- Johann Roth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SURFACE-TREATED GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD
- Publication number 20230071895
- Publication date Mar 9, 2023
- NITTO BOSEKI CO., LTD.
- Kazutaka ADACHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF
- Publication number 20210028321
- Publication date Jan 28, 2021
- Cambrios Film Solutions Corporation
- Pierre-Marc Allemand
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPOSITE TRANSPARENT CONDUCTORS AND METHODS OF FORMING THE SAME
- Publication number 20190191569
- Publication date Jun 20, 2019
- Cambrios Film Solutions Corporation
- David Jones
- B82 - NANO-TECHNOLOGY
Information Patent Application
NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF
- Publication number 20140338735
- Publication date Nov 20, 2014
- CAMBRIOS TECHNOLOGIES CORPORATION
- Pierre-Marc Allemand
- B82 - NANO-TECHNOLOGY
Information Patent Application
IMPEDANCE BIOSENSOR FOR ELECTRICAL IMPEDANCE BIOLOGICAL SENSING AND...
- Publication number 20140147336
- Publication date May 29, 2014
- National Chi Nan University
- Tak-Sing CHING
- G01 - MEASURING TESTING
Information Patent Application
COMPOSITE TRANSPARENT CONDUCTORS AND METHODS OF FORMING THE SAME
- Publication number 20120033367
- Publication date Feb 9, 2012
- CAMBRIOS TECHNOLOGIES CORPORATION
- David Jones
- G02 - OPTICS
Information Patent Application
METHOD FOR PREVENTING OR REDUCING SILVER MIGRATION IN THE CROSSOVER...
- Publication number 20110281024
- Publication date Nov 17, 2011
- E.I. du Pont de Nemours and Company
- John C. Crumpton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PAD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20110108876
- Publication date May 12, 2011
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF
- Publication number 20110088770
- Publication date Apr 21, 2011
- CAMBRIOS TECHNOLOGIES CORPORATION
- Pierre-Marc Allemand
- G02 - OPTICS
Information Patent Application
Manufacturing method of a flexible printed circuit board
- Publication number 20100251544
- Publication date Oct 7, 2010
- Po-Ju Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100230146
- Publication date Sep 16, 2010
- Eung Suek LEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CARBON NANOTUBE STRUCTURE AND THIN FILM TRANSISTOR
- Publication number 20100224862
- Publication date Sep 9, 2010
- Hiroyuki Endoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldermask-less printed wiring board
- Publication number 20100212940
- Publication date Aug 26, 2010
- Nokia Corporation
- Esa H. Kauppinen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contact System
- Publication number 20100190387
- Publication date Jul 29, 2010
- GIGASET COMMUNICATIONS GMBH
- Georg Busch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of a flexible printed circuit board and a stru...
- Publication number 20100084168
- Publication date Apr 8, 2010
- Po-Ju Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND FUEL CELL
- Publication number 20100047653
- Publication date Feb 25, 2010
- Nitto Denko Corporation
- Hiroshi YAMAZAKI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20100006325
- Publication date Jan 14, 2010
- FUJITSU LIMITED
- Masayuki KITAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FILTERING NANOWIRES
- Publication number 20090321364
- Publication date Dec 31, 2009
- Cambrios Technologies Corporation
- Michael A. Spaid
- G02 - OPTICS
Information Patent Application
Co-processable Photoimageable Silver and Corbon Nanotube Compositio...
- Publication number 20090284122
- Publication date Nov 19, 2009
- E.I. du Pont de Nemours and Company
- HAIXIN YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board, method of forming wiring pattern, and method of manu...
- Publication number 20090044972
- Publication date Feb 19, 2009
- FUJITSU LIMITED OF Kawasaki, Japan
- Masayuki Kitajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat-releasing printed circuit board and manufacturing method thereof
- Publication number 20090017275
- Publication date Jan 15, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Eung-Suek Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND FUEL CELL
- Publication number 20080298036
- Publication date Dec 4, 2008
- Nitto Denko Corporation
- Hiroshi YAMAZAKI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
COMPOSITE TRANSPARENT CONDUCTORS AND METHODS OF FORMING THE SAME
- Publication number 20080259262
- Publication date Oct 23, 2008
- Cambrios Technologies Corporation
- David Jones
- G02 - OPTICS
Information Patent Application
ELECTRICALLY CONDUCTIVE SUBSTRATE WITH HIGH HEAT CONDUCTIVITY
- Publication number 20080254207
- Publication date Oct 16, 2008
- KAYLU INDUSTRIAL CORPORATION
- Li-Wei KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF
- Publication number 20080143906
- Publication date Jun 19, 2008
- Cambrios Technologies Corporation
- Pierre-Marc Allemand
- G02 - OPTICS
Information Patent Application
High density interconnections with nanowiring
- Publication number 20060211327
- Publication date Sep 21, 2006
- Michael G. Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Electronic pressure sensitive transducer apparatus and method for m...
- Publication number 20050156705
- Publication date Jul 21, 2005
- Interlink Electronics, Inc.
- Jeffrey R. Baker
- G01 - MEASURING TESTING
Information Patent Application
Wiring board and method of manufacturing the same
- Publication number 20050087363
- Publication date Apr 28, 2005
- Norihito Tsukahara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Self-assembled nanometer conductive bumps and method for fabricating
- Publication number 20050048697
- Publication date Mar 3, 2005
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Ruoh-Huey Uang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board incorporating enchanced conductive ink
- Publication number 20030138610
- Publication date Jul 24, 2003
- Siemens VDO Automotive Corporation
- Qi Tao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

comprising carbon particles as main constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Surface-treated glass cloth, prepreg, and printed wiring board

Composite transparent conductors and methods of forming the same

Nanowire-based transparent conductors and applications thereof

Windows with invisible patterned conductive layers

Composite transparent conductors and methods of forming the same

Nanowire-based transparent conductors and applications thereof

Circuit board with kneaded conductive paste

Soldermask-less printed wiring board

Pad structure with a nano-structured coating film

Nanowire-based transparent conductors and applications thereof

Composite transparent conductors and methods of forming the same

Co-processable photoimageable silver and corbon nanotube compositio...

Electrically conductive substrate with high heat conductivity

High density interconnections with nanowiring

Wiring board and method of manufacturing the same

Method of forming an electronic pressure sensitive transducer on a...

Self-assembled nanometer conductive bumps and method for fabricating

Electronic pressure sensitive transducer apparatus and method for m...

Edge connectors for printed circuit boards comprising conductive ink

Printed circuit board incorporating enhanced conductive ink

Sliding connector interface with non-metallic contacts

Edge connectors for printed circuit boards comprising conductive ink

Printed circuit board

Circuit board with contact positions, as used for telecommunication...

Method of soldering circuit boards with solder-repellent contacts

Patents Applicationslast 30 patents

SURFACE-TREATED GLASS CLOTH, PREPREG, AND PRINTED WIRING BOARD

NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF

COMPOSITE TRANSPARENT CONDUCTORS AND METHODS OF FORMING THE SAME

NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF

IMPEDANCE BIOSENSOR FOR ELECTRICAL IMPEDANCE BIOLOGICAL SENSING AND...

COMPOSITE TRANSPARENT CONDUCTORS AND METHODS OF FORMING THE SAME

METHOD FOR PREVENTING OR REDUCING SILVER MIGRATION IN THE CROSSOVER...

PAD STRUCTURE AND MANUFACTURING METHOD THEREOF

NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF

Manufacturing method of a flexible printed circuit board

CIRCUIT LAYER COMPRISING CNTS AND METHOD OF MANUFACTURING THE SAME

CARBON NANOTUBE STRUCTURE AND THIN FILM TRANSISTOR

Soldermask-less printed wiring board

Contact System

Manufacturing method of a flexible printed circuit board and a stru...

PRINTED CIRCUIT BOARD AND FUEL CELL

PRINTED WIRING BOARD

SYSTEMS AND METHODS FOR FILTERING NANOWIRES

Co-processable Photoimageable Silver and Corbon Nanotube Compositio...

Circuit board, method of forming wiring pattern, and method of manu...

Heat-releasing printed circuit board and manufacturing method thereof

PRINTED CIRCUIT BOARD AND FUEL CELL

COMPOSITE TRANSPARENT CONDUCTORS AND METHODS OF FORMING THE SAME

ELECTRICALLY CONDUCTIVE SUBSTRATE WITH HIGH HEAT CONDUCTIVITY

NANOWIRE-BASED TRANSPARENT CONDUCTORS AND APPLICATIONS THEREOF

High density interconnections with nanowiring

Electronic pressure sensitive transducer apparatus and method for m...

Wiring board and method of manufacturing the same

Self-assembled nanometer conductive bumps and method for fabricating

Printed circuit board incorporating enchanced conductive ink