comprising combinations of capacitors and resistors

Industry

CPC
H01L27/0682

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0682comprising combinations of capacitors and resistors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated component including a capacitor and discrete varistor
- Patent number 12,148,575
- Issue date Nov 19, 2024
- KYOCERA AVX Components Corporation
- Michael W. Kirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor structure
- Patent number 12,027,574
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor structure
- Patent number 11,791,371
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including MIM capacitor and resistor
- Patent number 11,756,955
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated thin film resistor and metal-insulator-metal capacitor
- Patent number 11,545,486
- Issue date Jan 3, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Chengang Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CR snubber element
- Patent number 11,303,201
- Issue date Apr 12, 2022
- Murata Manufacturing Co., Ltd.
- Tomoyuki Ashimine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed RC termination
- Patent number 11,164,862
- Issue date Nov 2, 2021
- Murata Manufacturing Co., Ltd.
- Nicolas Normand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having overlapping resistance element and capa...
- Patent number 10,930,638
- Issue date Feb 23, 2021
- Lapis Semiconductor Co., Ltd.
- Chikashi Fuchigami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge devices
- Patent number 10,446,537
- Issue date Oct 15, 2019
- Texas Instruments Incorporated
- Gianluca Boselli
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Frequency-variable terahertz oscillator and method for manufacturin...
- Patent number 10,270,390
- Issue date Apr 23, 2019
- Tokyo Institute of Technology
- Safumi Suzuki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for making semiconductor device with stacked analog componen...
- Patent number 10,249,568
- Issue date Apr 2, 2019
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,157,975
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Ma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuits with resistor structures formed from MIM capaci...
- Patent number 10,115,719
- Issue date Oct 30, 2018
- GLOBALFOUNDRIES, INC.
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench metal-insulator-metal capacitors
- Patent number 10,083,958
- Issue date Sep 25, 2018
- GLOBALFOUNDRIES Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor and method for producing the same
- Patent number 9,917,146
- Issue date Mar 13, 2018
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Anton Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with refractory metal alignment marker...
- Patent number 9,806,032
- Issue date Oct 31, 2017
- GLOBALFOUNDRIES Inc.
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated inductor structure and method for manufacturing the same
- Patent number 9,748,325
- Issue date Aug 29, 2017
- Realtek Semiconductor Corporation
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making semiconductor device with stacked analog componen...
- Patent number 9,660,015
- Issue date May 23, 2017
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,640,530
- Issue date May 2, 2017
- Mitsubishi Electric Corporation
- Yoshinobu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, layout design and method for manufacturing a...
- Patent number 9,640,605
- Issue date May 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,508,787
- Issue date Nov 29, 2016
- Mitsubishi Electric Corporation
- Takaaki Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitor and method for producing the same
- Patent number 9,455,151
- Issue date Sep 27, 2016
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Anton Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed mode RC clamps
- Patent number 9,406,627
- Issue date Aug 2, 2016
- QUALCOMM Incorporated
- Eugene Robert Worley
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Variable capacitance devices
- Patent number 9,312,221
- Issue date Apr 12, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of electrical components on a semiconductor substrate by...
- Patent number 9,275,992
- Issue date Mar 1, 2016
- Cirrus Logic, Inc.
- Marc L. Tarabbia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a passive electronic component, method for pro...
- Patent number 9,257,492
- Issue date Feb 9, 2016
- OSRAM OLED GmbH
- Andrew Ingle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor
- Patent number 9,029,983
- Issue date May 12, 2015
- QUALCOMM Incorporated
- Xiangdong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switching circuit and semiconductor module
- Patent number 8,916,882
- Issue date Dec 23, 2014
- Nissan Motor Co., Ltd.
- Yusuke Zushi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integration of precision MIM capacitor and precision thin film resi...
- Patent number 8,754,501
- Issue date Jun 17, 2014
- Texas Instruments Incorporated
- Imran Mahmood Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual contact trench resistor and capacitor in shallow trench isolat...
- Patent number 8,741,729
- Issue date Jun 3, 2014
- International Business Machines Corporation
- Timothy W. Kemerer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT
- Publication number 20240332289
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Tatsuro SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR-CAPACITOR COMPONENT FOR HIGH-VOLTAGE APPLICATIONS AND METH...
- Publication number 20240321782
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Sébastien IOCHEM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE
- Publication number 20240162138
- Publication date May 16, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xiyuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Assembly
- Publication number 20240145529
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-On-Interposer Assembly Containing A Decoupling Capacitor
- Publication number 20240145528
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING MIM CAPACITOR AND RESISTOR
- Publication number 20230395595
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hsiang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resistor Structure
- Publication number 20230387183
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230223401
- Publication date Jul 13, 2023
- Fuji Electric Co., Ltd.
- Masaharu Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHORT CIRCUIT DETECTION APPARATUS
- Publication number 20230126872
- Publication date Apr 27, 2023
- Mitsubishi Electric Corporation
- Chiharu MORISAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES IN RC-NETWORK COMPONENTS
- Publication number 20230017133
- Publication date Jan 19, 2023
- Murata Manufacturing Co., Ltd.
- Yohei YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUALITY FACTOR OF A PARASITIC CAPACITANCE
- Publication number 20220209750
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Swaminathan Sankaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED THIN FILM RESISTOR AND METAL-INSULATOR-METAL CAPACITOR
- Publication number 20220108980
- Publication date Apr 7, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Chengang FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING MIM CAPACITOR AND RESISTOR
- Publication number 20220045049
- Publication date Feb 10, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CR SNUBBER ELEMENT
- Publication number 20210006151
- Publication date Jan 7, 2021
- Murata Manufacturing Co., Ltd.
- Tomoyuki Ashimine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Component Including a Capacitor and Discrete Varistor
- Publication number 20200343051
- Publication date Oct 29, 2020
- AVX CORPORATION
- Michael W. Kirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTED RC TERMINATION
- Publication number 20200152625
- Publication date May 14, 2020
- Murata Manufacturing Co., Ltd.
- Nicolas Normand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE DEVICES
- Publication number 20180366460
- Publication date Dec 20, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Gianluca BOSELLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH STACKED ANALOG COMPONEN...
- Publication number 20180315701
- Publication date Nov 1, 2018
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH METAL-INSULATOR-METAL CAPACITORS
- Publication number 20180108651
- Publication date Apr 19, 2018
- GLOBALFOUNDRIES INC.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20170207295
- Publication date Jul 20, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu MA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE, LAYOUT DESIGN AND METHOD FOR MANUFACTURING A...
- Publication number 20160293689
- Publication date Oct 6, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu MA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160247798
- Publication date Aug 25, 2016
- Mitsubishi Electric Corporation
- Yoshinobu Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED INDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160218169
- Publication date Jul 28, 2016
- REALTEK SEMICONDUCTOR CORPORATION
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160218170
- Publication date Jul 28, 2016
- Mitsubishi Electric Corporation
- Takaaki YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH RESISTOR STRUCTURES FORMED FROM MIM CAPACI...
- Publication number 20160126239
- Publication date May 5, 2016
- GLOBALFOUNDRIES, Inc.
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A PASSIVE ELECTRONIC COMPONENT, METHOD FOR PRO...
- Publication number 20150255521
- Publication date Sep 10, 2015
- OSRAM OLED GmbH
- Andrew Ingle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20150162327
- Publication date Jun 11, 2015
- ROHM CO., LTD.
- Masashi NIIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED MODE RC CLAMPS
- Publication number 20150084161
- Publication date Mar 26, 2015
- QUALCOMM Incorporated
- Eugene Robert WORLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE CAPACITANCE DEVICES
- Publication number 20140367831
- Publication date Dec 18, 2014
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR
- Publication number 20140264751
- Publication date Sep 18, 2014
- QUALCOMM Incorporated
- Xiangdong Chen
- H01 - BASIC ELECTRIC ELEMENTS

comprising combinations of capacitors and resistors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated component including a capacitor and discrete varistor

Resistor structure

Resistor structure

Device including MIM capacitor and resistor

Integrated thin film resistor and metal-insulator-metal capacitor

CR snubber element

Distributed RC termination

Semiconductor device having overlapping resistance element and capa...

Electrostatic discharge devices

Frequency-variable terahertz oscillator and method for manufacturin...

Method for making semiconductor device with stacked analog componen...

Method of manufacturing a semiconductor device

Integrated circuits with resistor structures formed from MIM capaci...

Deep trench metal-insulator-metal capacitors

Integrated capacitor and method for producing the same

Integrated circuit structure with refractory metal alignment marker...

Integrated inductor structure and method for manufacturing the same

Method for making semiconductor device with stacked analog componen...

Semiconductor device

Semiconductor device, layout design and method for manufacturing a...

Semiconductor device

Integrated capacitor and method for producing the same

Mixed mode RC clamps

Variable capacitance devices

Formation of electrical components on a semiconductor substrate by...

Method for producing a passive electronic component, method for pro...

Metal-insulator-metal (MIM) capacitor

Switching circuit and semiconductor module

Integration of precision MIM capacitor and precision thin film resi...

Dual contact trench resistor and capacitor in shallow trench isolat...

Patents Applicationslast 30 patents

SEMICONDUCTOR INTEGRATED CIRCUIT

RESISTOR-CAPACITOR COMPONENT FOR HIGH-VOLTAGE APPLICATIONS AND METH...

METHOD FOR FORMING CONDUCTIVE VIA, CONDUCTIVE VIA AND PASSIVE DEVICE

Semiconductor Package Assembly

Chip-On-Interposer Assembly Containing A Decoupling Capacitor

DEVICE INCLUDING MIM CAPACITOR AND RESISTOR

Resistor Structure

SEMICONDUCTOR DEVICE

SHORT CIRCUIT DETECTION APPARATUS

CONTACT STRUCTURES IN RC-NETWORK COMPONENTS

QUALITY FACTOR OF A PARASITIC CAPACITANCE

INTEGRATED THIN FILM RESISTOR AND METAL-INSULATOR-METAL CAPACITOR

DEVICE INCLUDING MIM CAPACITOR AND RESISTOR

CR SNUBBER ELEMENT

Integrated Component Including a Capacitor and Discrete Varistor

DISTRIBUTED RC TERMINATION

ELECTROSTATIC DISCHARGE DEVICES

METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH STACKED ANALOG COMPONEN...

DEEP TRENCH METAL-INSULATOR-METAL CAPACITORS

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, LAYOUT DESIGN AND METHOD FOR MANUFACTURING A...

SEMICONDUCTOR DEVICE

INTEGRATED INDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUITS WITH RESISTOR STRUCTURES FORMED FROM MIM CAPACI...

METHOD FOR PRODUCING A PASSIVE ELECTRONIC COMPONENT, METHOD FOR PRO...

SEMICONDUCTOR MODULE

MIXED MODE RC CLAMPS

VARIABLE CAPACITANCE DEVICES

METAL-INSULATOR-METAL (MIM) CAPACITOR