comprising components formed on opposite sides of a semiconductor substrate

Industry

CPC
H01L27/0694

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0694comprising components formed on opposite sides of a semiconductor substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 11,961,865
- Issue date Apr 16, 2024
- Sony Group Corporation
- Hideaki Togashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon buried power rail implemented backside power distri...
- Patent number 11,881,455
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for producing the same
- Patent number 11,854,890
- Issue date Dec 26, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Florian Krach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,842,997
- Issue date Dec 12, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,817,388
- Issue date Nov 14, 2023
- INNOLUX CORPORATION
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,769,768
- Issue date Sep 26, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 11,769,728
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional blocks implemented by integrated circuit
- Patent number 11,764,212
- Issue date Sep 19, 2023
- Micron Technology, Inc.
- Tony M. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amphi-FET structure, method of making and method of designing
- Patent number 11,764,213
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tank circuit structure and method of making the same
- Patent number 11,699,656
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked integrated circuits having functional blocks configured...
- Patent number 11,688,734
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Tony M. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,646,310
- Issue date May 9, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor structure and method of fabricating the same
- Patent number 11,605,631
- Issue date Mar 14, 2023
- United Microelectronics Corp.
- Yung-Chen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a thermal shield in a monolithic 3-d integrated c...
- Patent number 11,605,574
- Issue date Mar 14, 2023
- Samsung Electronics Co., Ltd.
- Wei-E Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chips comprising interconnects
- Patent number 11,594,521
- Issue date Feb 28, 2023
- Kioxia Corporation
- Masaru Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses with vertical strings of memory cells and s...
- Patent number 11,430,798
- Issue date Aug 30, 2022
- Micron Technology, Inc.
- Takehiro Hasegawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic apparatus and manufacturing method thereof
- Patent number 11,302,635
- Issue date Apr 12, 2022
- Innolux Corporation
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory in three-dimensional integrated circuit
- Patent number 11,270,998
- Issue date Mar 8, 2022
- Intel Corporation
- Yih Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit (IC) structure for high performance and function...
- Patent number 11,222,814
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) structure for high performance and function...
- Patent number 11,217,478
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double sided NMOS/PMOS structure and methods of forming the same
- Patent number 11,205,598
- Issue date Dec 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jam-Wem Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor structure and method of fabricating the same
- Patent number 11,195,831
- Issue date Dec 7, 2021
- United Microelectronics Corp.
- Yung-Chen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for downsizing and reducing resistance and ind...
- Patent number 11,189,612
- Issue date Nov 30, 2021
- Rohm Co., Ltd.
- Kenta Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic electronic device and method of manufacture
- Patent number 11,164,861
- Issue date Nov 2, 2021
- King Abdullah University of Science and Technology
- Muhammad Mustafa Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with components on both sides of a selected sub...
- Patent number 11,164,891
- Issue date Nov 2, 2021
- pSemi Corporation
- James S. Cable
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate with integrated inductive component
- Patent number 11,133,375
- Issue date Sep 28, 2021
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, circuit board with integrated circuit, and disp...
- Patent number 11,114,372
- Issue date Sep 7, 2021
- LG Display Co., Ltd.
- Jungjae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tank circuit structure and method of making the same
- Patent number 11,088,071
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating integrated light-emitting pixel arrays for displays
- Patent number 11,011,555
- Issue date May 18, 2021
- Shaoher Pan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Double-sided capacitor and method for fabricating the same
- Patent number 10,991,793
- Issue date Apr 27, 2021
- SHENZHEN WEITONGBO TECHNOLOGY CO., LTD.
- Bin Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...
- Publication number 20240063123
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH BACK SIDE TRANSISTOR DEVICES
- Publication number 20240063217
- Publication date Feb 22, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AMPHI-FET STRUCTURE AND METHOD OF DESIGNING
- Publication number 20240021606
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...
- Publication number 20230411294
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JUNCTION FIELD EFFECT TRANSISTORS FOR LOW VOLTAGE AND LOW TEMPERATU...
- Publication number 20230317718
- Publication date Oct 5, 2023
- Intel Corporation
- Abhishek Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL BIPOLAR-CMOS-DMOS (BCD) STRUCTURE WITH INTEGRATED...
- Publication number 20230317719
- Publication date Oct 5, 2023
- SHANGHAI BRIGHT POWER SEMICONDUCTOR CO., LTD.
- Luyao Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFA...
- Publication number 20230131382
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE (GAN) EPITAXY ON PATTERNED SUBSTRATE FOR INTEGRATED...
- Publication number 20230066336
- Publication date Mar 2, 2023
- Intel Corporation
- Pratik KOIRALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...
- Publication number 20220384345
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20220328405
- Publication date Oct 13, 2022
- InnoLux Corporation
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC WAVE ADJUSTMENT APPARATUS
- Publication number 20220328406
- Publication date Oct 13, 2022
- InnoLux Corporation
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPHI-FET STRUCTURE, METHOD OF MAKING AND METHOD OF DESIGNING
- Publication number 20220310591
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER DECOUPLING METAL-INSULATOR-METAL CAPACITOR
- Publication number 20220293513
- Publication date Sep 15, 2022
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Contact Trenches Extending from Opposit...
- Publication number 20220285550
- Publication date Sep 8, 2022
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...
- Publication number 20220208758
- Publication date Jun 30, 2022
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20220181257
- Publication date Jun 9, 2022
- InnoLux Corporation
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...
- Publication number 20220157723
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220059528
- Publication date Feb 24, 2022
- UNITED MICROELECTRONICS CORP.
- Yung-Chen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...
- Publication number 20210375856
- Publication date Dec 2, 2021
- Cree, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TANK CIRCUIT STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20210327809
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES WITH VERTICAL STRINGS OF MEMORY CELLS AND S...
- Publication number 20210265370
- Publication date Aug 26, 2021
- Micron Technology, Inc.
- Takehiro Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD FOR PRODUCING THE SAME
- Publication number 20210210386
- Publication date Jul 8, 2021
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Florian KRACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A THERMAL SHIELD IN A MONOLITHIC 3-D INTEGRATED C...
- Publication number 20210183729
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Wei-E Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC ELECTRONIC DEVICE AND METHOD OF MANUFACTURE
- Publication number 20210183853
- Publication date Jun 17, 2021
- King Abdullah University of Science and Technology
- Muhammad Mustafa HUSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED INTEGRATED CIRCUITS HAVING FUNCTIONAL BLOCKS CONFIGURED...
- Publication number 20210151431
- Publication date May 20, 2021
- Micron Technology, Inc.
- Tony M. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210082911
- Publication date Mar 18, 2021
- UNITED MICROELECTRONICS CORP.
- Yung-Chen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT
- Publication number 20210057264
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL BLOCKS IMPLEMENTED BY INTEGRATED CIRCUIT
- Publication number 20210050347
- Publication date Feb 18, 2021
- Micron Technology, Inc.
- Tony M. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20200365463
- Publication date Nov 19, 2020
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE
- Publication number 20200335399
- Publication date Oct 22, 2020
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

comprising components formed on opposite sides of a semiconductor substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device, method of manufacturing a semiconductor devic...

Through silicon buried power rail implemented backside power distri...

Capacitor and method for producing the same

Methods for pillar connection on frontside and passive device integ...

Electronic apparatus

Methods for pillar connection on frontside and passive device integ...

Backside power distribution network semiconductor package and metho...

Functional blocks implemented by integrated circuit

Amphi-FET structure, method of making and method of designing

Tank circuit structure and method of making the same

3D stacked integrated circuits having functional blocks configured...

Methods for pillar connection on frontside and passive device integ...

3D semiconductor structure and method of fabricating the same

Method of forming a thermal shield in a monolithic 3-d integrated c...

Stacked chips comprising interconnects

Methods and apparatuses with vertical strings of memory cells and s...

Electronic apparatus and manufacturing method thereof

Embedded memory in three-dimensional integrated circuit

Integrated circuit (IC) structure for high performance and function...

Integrated circuit (IC) structure for high performance and function...

Double sided NMOS/PMOS structure and methods of forming the same

3D semiconductor structure and method of fabricating the same

Semiconductor device for downsizing and reducing resistance and ind...

Monolithic electronic device and method of manufacture

Integrated circuits with components on both sides of a selected sub...

Semiconductor substrate with integrated inductive component

Integrated circuit, circuit board with integrated circuit, and disp...

Tank circuit structure and method of making the same

Fabricating integrated light-emitting pixel arrays for displays

Double-sided capacitor and method for fabricating the same

Patents Applicationslast 30 patents

THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...

SEMICONDUCTOR STRUCTURES WITH BACK SIDE TRANSISTOR DEVICES

METHOD OF MAKING AMPHI-FET STRUCTURE AND METHOD OF DESIGNING

BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...

JUNCTION FIELD EFFECT TRANSISTORS FOR LOW VOLTAGE AND LOW TEMPERATU...

THREE-DIMENSIONAL BIPOLAR-CMOS-DMOS (BCD) STRUCTURE WITH INTEGRATED...

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFA...

GALLIUM NITRIDE (GAN) EPITAXY ON PATTERNED SUBSTRATE FOR INTEGRATED...

THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...

ELECTRONIC APPARATUS

ELECTROMAGNETIC WAVE ADJUSTMENT APPARATUS

AMPHI-FET STRUCTURE, METHOD OF MAKING AND METHOD OF DESIGNING

POWER DECOUPLING METAL-INSULATOR-METAL CAPACITOR

Semiconductor Device Having Contact Trenches Extending from Opposit...

METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...

3D SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...

TANK CIRCUIT STRUCTURE AND METHOD OF MAKING THE SAME

METHODS AND APPARATUSES WITH VERTICAL STRINGS OF MEMORY CELLS AND S...

CAPACITOR AND METHOD FOR PRODUCING THE SAME

METHOD OF FORMING A THERMAL SHIELD IN A MONOLITHIC 3-D INTEGRATED C...

MONOLITHIC ELECTRONIC DEVICE AND METHOD OF MANUFACTURE

3D STACKED INTEGRATED CIRCUITS HAVING FUNCTIONAL BLOCKS CONFIGURED...

3D SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT

FUNCTIONAL BLOCKS IMPLEMENTED BY INTEGRATED CIRCUIT

3D SEMICONDUCTOR DEVICE AND STRUCTURE

3D SEMICONDUCTOR DEVICE AND STRUCTURE