comprising components formed on opposite sides of a semiconductor substrate

Industry

CPC
H01L27/0694

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0694comprising components formed on opposite sides of a semiconductor substrate

Industries

Patents Grantslast 30 patents

Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 12,142,564
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having contact trenches extending from opposit...
- Patent number 12,136,670
- Issue date Nov 5, 2024
- Infineon Technologies AG
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon buried power rail implemented backside power distri...
- Patent number 12,125,788
- Issue date Oct 22, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an integrated circuit having transistor gates ov...
- Patent number 12,062,658
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and manufacturing method thereof
- Patent number 12,034,002
- Issue date Jul 9, 2024
- INNOLUX CORPORATION
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave adjustment apparatus
- Patent number 12,015,027
- Issue date Jun 18, 2024
- INNOLUX CORPORATION
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making amphi-FET structure and method of designing
- Patent number 12,009,362
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor with through-substrate interconnect
- Patent number 11,978,656
- Issue date May 7, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing a semiconductor devic...
- Patent number 11,961,865
- Issue date Apr 16, 2024
- Sony Group Corporation
- Hideaki Togashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon buried power rail implemented backside power distri...
- Patent number 11,881,455
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for producing the same
- Patent number 11,854,890
- Issue date Dec 26, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Florian Krach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,842,997
- Issue date Dec 12, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,817,388
- Issue date Nov 14, 2023
- INNOLUX CORPORATION
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,769,768
- Issue date Sep 26, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside power distribution network semiconductor package and metho...
- Patent number 11,769,728
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Functional blocks implemented by integrated circuit
- Patent number 11,764,212
- Issue date Sep 19, 2023
- Micron Technology, Inc.
- Tony M. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amphi-FET structure, method of making and method of designing
- Patent number 11,764,213
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Tank circuit structure and method of making the same
- Patent number 11,699,656
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Tsung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D stacked integrated circuits having functional blocks configured...
- Patent number 11,688,734
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Tony M. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for pillar connection on frontside and passive device integ...
- Patent number 11,646,310
- Issue date May 9, 2023
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor structure and method of fabricating the same
- Patent number 11,605,631
- Issue date Mar 14, 2023
- United Microelectronics Corp.
- Yung-Chen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a thermal shield in a monolithic 3-d integrated c...
- Patent number 11,605,574
- Issue date Mar 14, 2023
- Samsung Electronics Co., Ltd.
- Wei-E Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chips comprising interconnects
- Patent number 11,594,521
- Issue date Feb 28, 2023
- Kioxia Corporation
- Masaru Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses with vertical strings of memory cells and s...
- Patent number 11,430,798
- Issue date Aug 30, 2022
- Micron Technology, Inc.
- Takehiro Hasegawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic apparatus and manufacturing method thereof
- Patent number 11,302,635
- Issue date Apr 12, 2022
- Innolux Corporation
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory in three-dimensional integrated circuit
- Patent number 11,270,998
- Issue date Mar 8, 2022
- Intel Corporation
- Yih Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit (IC) structure for high performance and function...
- Patent number 11,222,814
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) structure for high performance and function...
- Patent number 11,217,478
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double sided NMOS/PMOS structure and methods of forming the same
- Patent number 11,205,598
- Issue date Dec 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jam-Wem Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor structure and method of fabricating the same
- Patent number 11,195,831
- Issue date Dec 7, 2021
- United Microelectronics Corp.
- Yung-Chen Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240355820
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AMPHI-FET STRUCTURE AND METHOD OF DESIGNING
- Publication number 20240321870
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20240312983
- Publication date Sep 19, 2024
- Innolux Corporation
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240297168
- Publication date Sep 5, 2024
- Innolux Corporation
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT
- Publication number 20240282620
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...
- Publication number 20240266379
- Publication date Aug 8, 2024
- SONY GROUP CORPORATION
- Hideaki TOGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DIRECT CONTACT FORMATION
- Publication number 20240194528
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT METAL FILL
- Publication number 20240153875
- Publication date May 9, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...
- Publication number 20240063123
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH BACK SIDE TRANSISTOR DEVICES
- Publication number 20240063217
- Publication date Feb 22, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING AMPHI-FET STRUCTURE AND METHOD OF DESIGNING
- Publication number 20240021606
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...
- Publication number 20230411294
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JUNCTION FIELD EFFECT TRANSISTORS FOR LOW VOLTAGE AND LOW TEMPERATU...
- Publication number 20230317718
- Publication date Oct 5, 2023
- Intel Corporation
- Abhishek Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL BIPOLAR-CMOS-DMOS (BCD) STRUCTURE WITH INTEGRATED...
- Publication number 20230317719
- Publication date Oct 5, 2023
- SHANGHAI BRIGHT POWER SEMICONDUCTOR CO., LTD.
- Luyao Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFA...
- Publication number 20230131382
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Shaofeng DING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALLIUM NITRIDE (GAN) EPITAXY ON PATTERNED SUBSTRATE FOR INTEGRATED...
- Publication number 20230066336
- Publication date Mar 2, 2023
- Intel Corporation
- Pratik KOIRALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...
- Publication number 20220384345
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20220328405
- Publication date Oct 13, 2022
- InnoLux Corporation
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC WAVE ADJUSTMENT APPARATUS
- Publication number 20220328406
- Publication date Oct 13, 2022
- InnoLux Corporation
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPHI-FET STRUCTURE, METHOD OF MAKING AND METHOD OF DESIGNING
- Publication number 20220310591
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER DECOUPLING METAL-INSULATOR-METAL CAPACITOR
- Publication number 20220293513
- Publication date Sep 15, 2022
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Contact Trenches Extending from Opposit...
- Publication number 20220285550
- Publication date Sep 8, 2022
- Markus Zundel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...
- Publication number 20220208758
- Publication date Jun 30, 2022
- Wolfspeed, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20220181257
- Publication date Jun 9, 2022
- InnoLux Corporation
- Tang Chin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...
- Publication number 20220157723
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Saehan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220059528
- Publication date Feb 24, 2022
- UNITED MICROELECTRONICS CORP.
- Yung-Chen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...
- Publication number 20210375856
- Publication date Dec 2, 2021
- Cree, Inc.
- Terry Alcorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TANK CIRCUIT STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20210327809
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES WITH VERTICAL STRINGS OF MEMORY CELLS AND S...
- Publication number 20210265370
- Publication date Aug 26, 2021
- Micron Technology, Inc.
- Takehiro Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND METHOD FOR PRODUCING THE SAME
- Publication number 20210210386
- Publication date Jul 8, 2021
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Florian KRACH
- H01 - BASIC ELECTRIC ELEMENTS

comprising components formed on opposite sides of a semiconductor substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Backside power distribution network semiconductor package and metho...

Semiconductor device having contact trenches extending from opposit...

Through silicon buried power rail implemented backside power distri...

Method for forming an integrated circuit having transistor gates ov...

Electronic apparatus and manufacturing method thereof

Electromagnetic wave adjustment apparatus

Method of making amphi-FET structure and method of designing

Semiconductor with through-substrate interconnect

Semiconductor device, method of manufacturing a semiconductor devic...

Through silicon buried power rail implemented backside power distri...

Capacitor and method for producing the same

Methods for pillar connection on frontside and passive device integ...

Electronic apparatus

Methods for pillar connection on frontside and passive device integ...

Backside power distribution network semiconductor package and metho...

Functional blocks implemented by integrated circuit

Amphi-FET structure, method of making and method of designing

Tank circuit structure and method of making the same

3D stacked integrated circuits having functional blocks configured...

Methods for pillar connection on frontside and passive device integ...

3D semiconductor structure and method of fabricating the same

Method of forming a thermal shield in a monolithic 3-d integrated c...

Stacked chips comprising interconnects

Methods and apparatuses with vertical strings of memory cells and s...

Electronic apparatus and manufacturing method thereof

Embedded memory in three-dimensional integrated circuit

Integrated circuit (IC) structure for high performance and function...

Integrated circuit (IC) structure for high performance and function...

Double sided NMOS/PMOS structure and methods of forming the same

3D semiconductor structure and method of fabricating the same

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MAKING AMPHI-FET STRUCTURE AND METHOD OF DESIGNING

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

ELECTRONIC APPARATUS

SEMICONDUCTOR WITH THROUGH-SUBSTRATE INTERCONNECT

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVIC...

BACKSIDE DIRECT CONTACT FORMATION

BACKSIDE CONTACT METAL FILL

THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...

SEMICONDUCTOR STRUCTURES WITH BACK SIDE TRANSISTOR DEVICES

METHOD OF MAKING AMPHI-FET STRUCTURE AND METHOD OF DESIGNING

BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...

JUNCTION FIELD EFFECT TRANSISTORS FOR LOW VOLTAGE AND LOW TEMPERATU...

THREE-DIMENSIONAL BIPOLAR-CMOS-DMOS (BCD) STRUCTURE WITH INTEGRATED...

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE AND METHOD OF MANUFA...

GALLIUM NITRIDE (GAN) EPITAXY ON PATTERNED SUBSTRATE FOR INTEGRATED...

THROUGH SILICON BURIED POWER RAIL IMPLEMENTED BACKSIDE POWER DISTRI...

ELECTRONIC APPARATUS

ELECTROMAGNETIC WAVE ADJUSTMENT APPARATUS

AMPHI-FET STRUCTURE, METHOD OF MAKING AND METHOD OF DESIGNING

POWER DECOUPLING METAL-INSULATOR-METAL CAPACITOR

Semiconductor Device Having Contact Trenches Extending from Opposit...

METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

BACKSIDE POWER DISTRIBUTION NETWORK SEMICONDUCTOR PACKAGE AND METHO...

3D SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

METHODS FOR PILLAR CONNECTION ON FRONTSIDE AND PASSIVE DEVICE INTEG...

TANK CIRCUIT STRUCTURE AND METHOD OF MAKING THE SAME

METHODS AND APPARATUSES WITH VERTICAL STRINGS OF MEMORY CELLS AND S...

CAPACITOR AND METHOD FOR PRODUCING THE SAME