comprising fuses

Industry

CPC
H01L23/5256

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5256comprising fuses

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electrical fuse (e-fuse) one-time programmable (OTP) device and man...
- Patent number 12,255,133
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Alexander Kalnitsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
One-time-programmable memory devices having first transistor, secon...
- Patent number 12,256,539
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Programmable inductor and methods of manufacture
- Patent number 12,243,681
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure havbing an enhanced E-fuse and a method mak...
- Patent number 12,243,816
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Jiao Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fusible structures
- Patent number 12,237,264
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM eFuse memory devices and memory array
- Patent number 12,224,238
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,049
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,211,757
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Haruka Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-fuse memory cell circuit and method
- Patent number 12,211,568
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Meng-Sheng Chang
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods of manufacturing fusible structures
- Patent number 12,205,891
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-type fuse
- Patent number 12,199,035
- Issue date Jan 14, 2025
- Matsuo Electric CO., LTD.
- Yusuke Takafuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fuse with multi-bond wire
- Patent number 12,191,252
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with fuse structure
- Patent number 12,191,253
- Issue date Jan 7, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse circuits
- Patent number 12,183,673
- Issue date Dec 31, 2024
- Skyworks Solutions, Inc.
- Bo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fail-open isolator
- Patent number 12,183,672
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Ujwal Radhakrishna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
One-time programmable fuse using thin film resistor layer, and rela...
- Patent number 12,176,048
- Issue date Dec 24, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Siow Lee Chwa
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic fuses with a silicide layer having multiple thicknesses
- Patent number 12,154,854
- Issue date Nov 26, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Shyue Seng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
eFUSE programming feedback circuits and methods
- Patent number 12,150,298
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Anand Seshadri
- G11 - INFORMATION STORAGE
Information Patent Grant
Fuse structure and manufacturing method thereof
- Patent number 12,148,695
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xiong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure having multiple fuse elements
- Patent number 12,137,552
- Issue date Nov 5, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,136,609
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Haohua Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 12,119,299
- Issue date Oct 15, 2024
- Fuji Electric Co., Ltd.
- Sho Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fuse
- Patent number 12,119,310
- Issue date Oct 15, 2024
- STMicroelectronics (Rousset) SAS
- Pascal Fornara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having smart power stage and E-fuse solution
- Patent number 12,113,016
- Issue date Oct 8, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Prabal Upadhyaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical transistor fuse latches
- Patent number 12,113,015
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor die including fuse structure and methods for forming...
- Patent number 12,107,078
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistance tunable fuse structure formed by embedded thin metal layers
- Patent number 12,100,653
- Issue date Sep 24, 2024
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin-based antifuse structure having gate stacks biased at different...
- Patent number 12,094,818
- Issue date Sep 17, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xiong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical fuse bit cell in integrated circuit having backside cond...
- Patent number 12,080,641
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Ying Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
On-die heater devices for memory devices and memory modules
- Patent number 12,073,908
- Issue date Aug 27, 2024
- Micron Technology, Inc.
- William A. Lendvay
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR ENABLING A FEATURE OF A SEMICONDUCTOR DEVICE
- Publication number 20250110525
- Publication date Apr 3, 2025
- ADVANCED MICRO DEVICES, INC.
- Paul Blinzer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT
- Publication number 20250096127
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK
- Publication number 20250096126
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Dan Moy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAIL-OPEN ISOLATOR
- Publication number 20250087583
- Publication date Mar 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Ujwal RADHAKRISHNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING ACCESS FOR STACKED SEMICONDUCTOR DEVICES AND ASSOCIATED SYS...
- Publication number 20250087537
- Publication date Mar 13, 2025
- Micron Technology, Inc.
- Lingming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFUSE CELLS WITH BACKSIDE POWER RAILS
- Publication number 20250071984
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Li-Chin Yu
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT INCLUDING ELECTRONIC FUSE BIT CELL
- Publication number 20250070019
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Minjeung Kang
- G11 - INFORMATION STORAGE
Information Patent Application
TRENCH LINER FUSE
- Publication number 20250062225
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250054859
- Publication date Feb 13, 2025
- NANYA TECHNOLOGY CORPORATION
- YING-CHENG CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC FUSES WITH A SILICIDE LAYER HAVING MULTIPLE THICKNESSES
- Publication number 20250046706
- Publication date Feb 6, 2025
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Shyue Seng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPACT EFUSE STRUCTURE
- Publication number 20250048624
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui-Lin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FUSE STRUCTURE EMBEDDED IN...
- Publication number 20250017002
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FUSE STRUCTURE EMBEDDED IN...
- Publication number 20250017000
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240421075
- Publication date Dec 19, 2024
- LAPIS Semiconductor Co., Ltd.
- Reiji YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240395776
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Haohua Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE PATTERN METAL FUSE MANUFACTURING METHOD
- Publication number 20240389311
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Wei LIU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH FUSE AND RESISTOR AND METHOD FO...
- Publication number 20240371856
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-DIE HEATER DEVICES FOR MEMORY DEVICES AND MEMORY MODULES
- Publication number 20240371414
- Publication date Nov 7, 2024
- Micron Technology, Inc.
- William A. Lendvay
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH FUSE AND RESISTOR AND METHOD FO...
- Publication number 20240371857
- Publication date Nov 7, 2024
- NANYA TECHNOLOGY CORPORATION
- CHIN-LING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL FUSE BIT CELL IN INTEGRATED CIRCUIT HAVING BACKSIDE COND...
- Publication number 20240363530
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ying CHEN
- G11 - INFORMATION STORAGE
Information Patent Application
ACTIVE REGION ELECTRICALLY PROGRAMMABLE FUSE WITH GATE STRUCTURE AS...
- Publication number 20240355731
- Publication date Oct 24, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Thanh Hoa Phung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILM BASED ONE-TIME PROGRAMMABLE (OTP) MEMORY CELL
- Publication number 20240321369
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Abhijeet PAUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM MEMORY CELL WITH BACKSIDE INTERCONNECT STRUCTURES
- Publication number 20240315014
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- Meng-Sheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSE STRUCTURE
- Publication number 20240313770
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tun-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH ELECTRICAL FUSES AND METHODS OF FABRICAT...
- Publication number 20240297115
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chung Chen
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT WITH PROTECTIVE ELEMENT
- Publication number 20240274595
- Publication date Aug 15, 2024
- Renesas Electronics America Inc.
- Edgardo LABER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING FUSE ELEMENTS
- Publication number 20240260259
- Publication date Aug 1, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der YANG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240258232
- Publication date Aug 1, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICALLY PROGRAMMABLE FUSE WITH HEATING TRANSISTORS
- Publication number 20240234305
- Publication date Jul 11, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Shesh M. Pandey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ONE-TIME PROGRAMMABLE FUSE USING THIN FILM RESISTOR LAYER, AND RELA...
- Publication number 20240212770
- Publication date Jun 27, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Siow Lee Chwa
- G11 - INFORMATION STORAGE

comprising fuses

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrical fuse (e-fuse) one-time programmable (OTP) device and man...

One-time-programmable memory devices having first transistor, secon...

Programmable inductor and methods of manufacture

Semiconductor structure havbing an enhanced E-fuse and a method mak...

Fusible structures

MIM eFuse memory devices and memory array

Semiconductor structure and method for forming the same

Semiconductor device and method of forming the same

Multi-fuse memory cell circuit and method

Methods of manufacturing fusible structures

Chip-type fuse

Semiconductor fuse with multi-bond wire

Semiconductor device with fuse structure

Fuse circuits

Fail-open isolator

One-time programmable fuse using thin film resistor layer, and rela...

Electronic fuses with a silicide layer having multiple thicknesses

eFUSE programming feedback circuits and methods

Fuse structure and manufacturing method thereof

Semiconductor device structure having multiple fuse elements

Semiconductor device and method of manufacture

Semiconductor device and manufacturing method for the same

Integrated fuse

Semiconductor package having smart power stage and E-fuse solution

Vertical transistor fuse latches

Semiconductor die including fuse structure and methods for forming...

Resistance tunable fuse structure formed by embedded thin metal layers

Fin-based antifuse structure having gate stacks biased at different...

Electrical fuse bit cell in integrated circuit having backside cond...

On-die heater devices for memory devices and memory modules

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR ENABLING A FEATURE OF A SEMICONDUCTOR DEVICE

BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT

BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK

FAIL-OPEN ISOLATOR

TESTING ACCESS FOR STACKED SEMICONDUCTOR DEVICES AND ASSOCIATED SYS...

EFUSE CELLS WITH BACKSIDE POWER RAILS

INTEGRATED CIRCUIT INCLUDING ELECTRONIC FUSE BIT CELL

TRENCH LINER FUSE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

ELECTRONIC FUSES WITH A SILICIDE LAYER HAVING MULTIPLE THICKNESSES

COMPACT EFUSE STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FUSE STRUCTURE EMBEDDED IN...

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FUSE STRUCTURE EMBEDDED IN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

MULTIPLE PATTERN METAL FUSE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE STRUCTURE WITH FUSE AND RESISTOR AND METHOD FO...

ON-DIE HEATER DEVICES FOR MEMORY DEVICES AND MEMORY MODULES

SEMICONDUCTOR DEVICE STRUCTURE WITH FUSE AND RESISTOR AND METHOD FO...

ELECTRICAL FUSE BIT CELL IN INTEGRATED CIRCUIT HAVING BACKSIDE COND...

ACTIVE REGION ELECTRICALLY PROGRAMMABLE FUSE WITH GATE STRUCTURE AS...

DIELECTRIC FILM BASED ONE-TIME PROGRAMMABLE (OTP) MEMORY CELL

MIM MEMORY CELL WITH BACKSIDE INTERCONNECT STRUCTURES

FUSE STRUCTURE

SEMICONDUCTOR DEVICES WITH ELECTRICAL FUSES AND METHODS OF FABRICAT...

INTEGRATED CIRCUIT WITH PROTECTIVE ELEMENT

SEMICONDUCTOR DEVICE STRUCTURE HAVING FUSE ELEMENTS

SEMICONDUCTOR STRUCTURE

ELECTRONICALLY PROGRAMMABLE FUSE WITH HEATING TRANSISTORS

ONE-TIME PROGRAMMABLE FUSE USING THIN FILM RESISTOR LAYER, AND RELA...