comprising inorganic layers

Industry

CPC
H01L21/033

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/033comprising inorganic layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and methods of manufacturing
- Patent number 12,368,060
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhon Jhy Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive feature formation
- Patent number 12,369,293
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure of cut end with self-aligned double patterning
- Patent number 12,368,046
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsi-Wen Tien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure and semiconductor s...
- Patent number 12,369,296
- Issue date Jul 22, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jun Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor device
- Patent number 12,369,314
- Issue date Jul 22, 2025
- Samsung Electronics Co., Ltd.
- Seung-Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure of wafer and method of manufacturing test structure...
- Patent number 12,362,242
- Issue date Jul 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hongcheng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self aligned contact scheme
- Patent number 12,362,239
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for coating photo resist over a substrate
- Patent number 12,362,179
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Hung Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming thermally stable carbon film
- Patent number 12,362,181
- Issue date Jul 15, 2025
- Applied Materials, Inc.
- Eswaranand Venkatasubramanian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,363,895
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of etching metals in semiconductor devices
- Patent number 12,354,881
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and pattern formation...
- Patent number 12,354,874
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- An-Ren Zi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device structure including bevel...
- Patent number 12,353,129
- Issue date Jul 8, 2025
- NANYA TECHNOLOGY CORPORATION
- Sheng-Hui Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating same
- Patent number 12,347,685
- Issue date Jul 1, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yexiao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,347,683
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing Hong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for cutting dense line patterns using self-ali...
- Patent number 12,347,684
- Issue date Jul 1, 2025
- Yangtze Memory Technologies Co., Ltd.
- Lu Ming Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench plug hardmask for advanced integrated circuit structure fabr...
- Patent number 12,349,450
- Issue date Jul 1, 2025
- Intel Corporation
- Anthony St. Amour
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for preparing the same
- Patent number 12,347,686
- Issue date Jul 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up fill dielectric materials for semiconductor structure fab...
- Patent number 12,341,061
- Issue date Jun 24, 2025
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming and using mask
- Patent number 12,341,011
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning underlying structure
- Patent number 12,341,007
- Issue date Jun 24, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Yun-An Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation method for semiconductor structure and same
- Patent number 12,341,010
- Issue date Jun 24, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Longyang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterns for a semicondu...
- Patent number 12,341,095
- Issue date Jun 24, 2025
- SK hynix Inc.
- Dae Sung Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor structure
- Patent number 12,342,552
- Issue date Jun 24, 2025
- NANYA TECHNOLOGY CORPORATION
- Ya-Chin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable hardness amorphous carbon mask
- Patent number 12,341,009
- Issue date Jun 24, 2025
- Tokyo Electron Limited
- Shihsheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 12,341,022
- Issue date Jun 24, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic random access memory device with active regions of differen...
- Patent number 12,334,345
- Issue date Jun 17, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yaoguang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern fidelity enhancement
- Patent number 12,334,342
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Tien Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing system
- Patent number 12,334,343
- Issue date Jun 17, 2025
- Tokyo Electron Limited
- Toru Hisamatsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Formation of an array of nanostructures
- Patent number 12,334,344
- Issue date Jun 17, 2025
- ALIXLABS AB
- Dmitry Suyatin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCHING GAS MIXTURE AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT...
- Publication number 20250239461
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Changgil SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ASPECT RATIO CARBON LAYER ETCH WITH IMPROVED THROUGHPUT AND PR...
- Publication number 20250232981
- Publication date Jul 17, 2025
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compound For Forming Metal-Containing Film, Composition For Forming...
- Publication number 20250231485
- Publication date Jul 17, 2025
- Shin-Etsu Chemical Co., Ltd.
- Nobuhiro NAGAMACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING T...
- Publication number 20250234754
- Publication date Jul 17, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jin-Kwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250226222
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Sho KUMAKURA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
TIN OXIDE AND TIN CARBIDE MATERIALS FOR SEMICONDUCTOR PATTERNING AP...
- Publication number 20250226235
- Publication date Jul 10, 2025
- Applied Materials, Inc.
- Yung-chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF CARBON ON PHOTORESIST LAYER FOR LITHOGRAPHY...
- Publication number 20250226221
- Publication date Jul 10, 2025
- Applied Materials, Inc.
- NANCY FUNG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
- Publication number 20250226177
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Kazuhide HASEBE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250226223
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Sho KUMAKURA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
HIGH ENERGY ATOMIC LAYER ETCH OF A CARBON CONTAINING LAYER
- Publication number 20250218774
- Publication date Jul 3, 2025
- LAM RESEARCH CORPORATION
- Wenbing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20250218765
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIH-WEI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20250218776
- Publication date Jul 3, 2025
- WINBOND ELECTRONICS CORP.
- Pei-Hsiu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMORPHOUS CARBON FILM AND DEPOSITION METHOD THEREOF
- Publication number 20250218773
- Publication date Jul 3, 2025
- TES CO., LTD.
- Seung Hwan JEON
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MATERIALS AND METHODS FOR FORMING PATTERNED MASK ON SUBSTRATE
- Publication number 20250218775
- Publication date Jul 3, 2025
- TOKYO ELECTRON LIMITED
- Phillip D. Hustad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...
- Publication number 20250212505
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Cheng CHING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR IMPROVING ETCH PROFILE OF METALLIC LAYER
- Publication number 20250210374
- Publication date Jun 26, 2025
- TOKYO ELECTRON LIMITED
- Christopher CATANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compound For Forming Metal-Containing Film, Composition For Forming...
- Publication number 20250208506
- Publication date Jun 26, 2025
- Shin-Etsu Chemical Co., Ltd.
- Naoki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MAKING EUV PATTERNABLE HARD MASKS
- Publication number 20250201553
- Publication date Jun 19, 2025
- LAM RESEARCH CORPORATION
- Chenghao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective EMI Shielding Using Preformed Mask with Fang Design
- Publication number 20250201729
- Publication date Jun 19, 2025
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A BILAYER HARDMASK AND ASSOCIATED DEPOSITION MET...
- Publication number 20250201557
- Publication date Jun 19, 2025
- ASM IP HOLDING B.V.
- Devika Choudhury
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF MANUFACTURING LOGIC DEVICES AND MEMORY DEVICES
- Publication number 20250201558
- Publication date Jun 19, 2025
- Applied Materials, Inc.
- Andrea Leoncini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PATTERNED MASK LAYER
- Publication number 20250201562
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PATTERN STRUCTURE PRESERVATION
- Publication number 20250201559
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Dario Goldfarb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES
- Publication number 20250201560
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Byunghoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PATTERN FORMING M...
- Publication number 20250201561
- Publication date Jun 19, 2025
- KIOXIA Corporation
- Kazuhiro TAKAHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA
- Publication number 20250201626
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Zhen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...
- Publication number 20250194201
- Publication date Jun 12, 2025
- Intel Corporation
- Subhash M. JOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TOTAL THICKNESS VARIATION USING MASKLESS IMPLANT
- Publication number 20250191917
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Qintao ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY SELF-ALIGNED VIAS USING A HARDMASK AND ANTISPACERS
- Publication number 20250191970
- Publication date Jun 12, 2025
- TOKYO ELECTRON LIMITED
- David Power
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST UNDERLAYER FILM FORMATION COMPOSITION
- Publication number 20250189896
- Publication date Jun 12, 2025
- NISSAN CHEMICAL CORPORATION
- Yuki MITSUTAKE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

comprising inorganic layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices and methods of manufacturing

Conductive feature formation

Method and structure of cut end with self-aligned double patterning

Manufacturing method of semiconductor structure and semiconductor s...

Methods of fabricating semiconductor device

Test structure of wafer and method of manufacturing test structure...

Self aligned contact scheme

Method and apparatus for coating photo resist over a substrate

Methods of forming thermally stable carbon film

Integrated assemblies and methods of forming integrated assemblies

Methods of etching metals in semiconductor devices

Method of manufacturing semiconductor devices and pattern formation...

Method for preparing semiconductor device structure including bevel...

Semiconductor structure and method for fabricating same

Method of manufacturing a semiconductor device

Method and structure for cutting dense line patterns using self-ali...

Trench plug hardmask for advanced integrated circuit structure fabr...

Semiconductor device structure and method for preparing the same

Bottom-up fill dielectric materials for semiconductor structure fab...

Method for forming and using mask

Method of patterning underlying structure

Preparation method for semiconductor structure and same

Semiconductor device and method of forming patterns for a semicondu...

Method of forming semiconductor structure

Variable hardness amorphous carbon mask

Semiconductor device and fabrication method thereof

Dynamic random access memory device with active regions of differen...

Pattern fidelity enhancement

Substrate processing method and substrate processing system

Formation of an array of nanostructures

Patents Applicationslast 30 patents

ETCHING GAS MIXTURE AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT...

HIGH ASPECT RATIO CARBON LAYER ETCH WITH IMPROVED THROUGHPUT AND PR...

Compound For Forming Metal-Containing Film, Composition For Forming...

ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING T...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

TIN OXIDE AND TIN CARBIDE MATERIALS FOR SEMICONDUCTOR PATTERNING AP...

SELECTIVE DEPOSITION OF CARBON ON PHOTORESIST LAYER FOR LITHOGRAPHY...

FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

HIGH ENERGY ATOMIC LAYER ETCH OF A CARBON CONTAINING LAYER

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

AMORPHOUS CARBON FILM AND DEPOSITION METHOD THEREOF

MATERIALS AND METHODS FOR FORMING PATTERNED MASK ON SUBSTRATE

SEMICONDUCTOR DEVICE WITH HELMET STRUCTURE BETWEEN TWO SEMICONDUCTO...

METHODS AND STRUCTURES FOR IMPROVING ETCH PROFILE OF METALLIC LAYER

Compound For Forming Metal-Containing Film, Composition For Forming...

METHODS FOR MAKING EUV PATTERNABLE HARD MASKS

Selective EMI Shielding Using Preformed Mask with Fang Design

METHODS OF FORMING A BILAYER HARDMASK AND ASSOCIATED DEPOSITION MET...

METHODS OF MANUFACTURING LOGIC DEVICES AND MEMORY DEVICES

METHOD FOR FORMING PATTERNED MASK LAYER

SEMICONDUCTOR PATTERN STRUCTURE PRESERVATION

METHODS OF FABRICATING SEMICONDUCTOR DEVICES

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PATTERN FORMING M...

ENLARGING CONTACT AREA AND PROCESS WINDOW FOR A CONTACT VIA

TRENCH CONTACT STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE...

WAFER TOTAL THICKNESS VARIATION USING MASKLESS IMPLANT

FULLY SELF-ALIGNED VIAS USING A HARDMASK AND ANTISPACERS

RESIST UNDERLAYER FILM FORMATION COMPOSITION