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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/08059comprising protrusions or indentations

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,237,285
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,088
- Issue date Feb 4, 2025
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,913
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package and method of manufactu...
- Patent number 12,199,056
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Jumyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with built-in electronic components and electronic device
- Patent number 12,148,724
- Issue date Nov 19, 2024
- Fujitsu Limited
- Yukiko Oshikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding method and semiconductor chip structure
- Patent number 12,119,315
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method thereof
- Patent number 12,015,001
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Chuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,810,837
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,769,743
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 11,760,059
- Issue date Sep 19, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid bonding structure and hybrid bonding method
- Patent number 11,756,922
- Issue date Sep 12, 2023
- Huawei Technologies Co., Ltd.
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,462,496
- Issue date Oct 4, 2022
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 10,434,749
- Issue date Oct 8, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-strike process for bonding packages and the packages thereof
- Patent number 10,068,868
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having a redistribution area
- Patent number 9,799,619
- Issue date Oct 24, 2017
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an anti-pad peeling structure and associa...
- Patent number 9,711,478
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Kai Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-strike process for bonding
- Patent number 9,576,929
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond pad having a trench and method for forming
- Patent number 9,515,034
- Issue date Dec 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sohrab Safai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit system with recessed through silicon via pads an...
- Patent number 8,202,797
- Issue date Jun 19, 2012
- Stats Chippac Ltd.
- HeeJo Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 8,163,373
- Issue date Apr 24, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 7,862,885
- Issue date Jan 4, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 7,335,996
- Issue date Feb 26, 2008
- Ziptronix, Inc.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 7,109,092
- Issue date Sep 19, 2006
- Ziptronix, Inc.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20250105181
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105187
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND METH...
- Publication number 20250096170
- Publication date Mar 20, 2025
- SK HYNIX INC.
- Byung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DESIGN MODELING FOR BONDING INTEGRATED CIRCUITS
- Publication number 20250068823
- Publication date Feb 27, 2025
- TOKYO ELECTRON LIMITED
- Henry Jim Fulford
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...
- Publication number 20250046757
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR A HYBRID WAFER BONDING, SEMICONDUCTOR DEVICE...
- Publication number 20240413109
- Publication date Dec 12, 2024
- SK HYNIX INC.
- Young Su YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20240304580
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20240258292
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Sungyong MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20240234210
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF A THIN SEMICONDUCTOR DIE
- Publication number 20240170442
- Publication date May 23, 2024
- ASMPT Singapore Pte. Ltd.
- Yiu Ming CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...
- Publication number 20240170350
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240128236
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063081
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240063152
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Jyun Yang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030106
- Publication date Jan 25, 2024
- ROHM CO., LTD.
- Yosui FUTAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240030104
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING
- Publication number 20240006358
- Publication date Jan 4, 2024
- Intel Corporation
- Zhihua Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230395548
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230378110
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- MINKI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...
- Publication number 20230343733
- Publication date Oct 26, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...
- Publication number 20230343734
- Publication date Oct 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-PITCH JOINING PAD STRUCTURE
- Publication number 20230317652
- Publication date Oct 5, 2023
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD THEREOF
- Publication number 20230299028
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-CHUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230113465
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Minki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...
- Publication number 20230070532
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Jumyong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...
- Publication number 20230060594
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH BUILT-IN ELECTRONIC COMPONENTS AND ELECTRONIC DEVICE
- Publication number 20230044252
- Publication date Feb 9, 2023
- Fujitsu Limited
- Yukiko Oshikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD AND SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20230011840
- Publication date Jan 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS

comprising protrusions or indentations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Semiconductor device

Semiconductor package

Semiconductor device, semiconductor package and method of manufactu...

Package with built-in electronic components and electronic device

Chip bonding method and semiconductor chip structure

Bonding structure and method thereof

Semiconductor packages

Semiconductor package

Method of room temperature covalent bonding

Hybrid bonding structure and hybrid bonding method

Semiconductor device

Method of room temperature covalent bonding

Multi-strike process for bonding packages and the packages thereof

Electronic device having a redistribution area

Semiconductor device with an anti-pad peeling structure and associa...

Multi-strike process for bonding

Bond pad having a trench and method for forming

Integrated circuit system with recessed through silicon via pads an...

Method of room temperature covalent bonding

Method of room temperature covalent bonding

Method of room temperature covalent bonding

Method of room temperature covalent bonding

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

SEMICONDUCTOR PACKAGE

BONDING STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE SAME AND METH...

CIRCUIT DESIGN MODELING FOR BONDING INTEGRATED CIRCUITS

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POSTS AND A HEAT SPREADE...

BONDING STRUCTURE FOR A HYBRID WAFER BONDING, SEMICONDUCTOR DEVICE...

BONDING STRUCTURE AND METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MICRO LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THEREOF

INTEGRATED CIRCUIT PACKAGES AND METHODS

HYBRID BONDING OF A THIN SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

HYBRID BONDING FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES

SUBSTRATE TRENCH FOR IMPROVED HYBRID BONDING

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...

EXPANSION CONTROLLED STRUCTURE FOR DIRECT BONDING AND METHOD OF FOR...

FINE-PITCH JOINING PAD STRUCTURE

BONDING STRUCTURE AND METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTU...

CASTELLATION, HATCHING, AND OTHER SURFACE PATTERNS IN DIELECTRIC SU...

PACKAGE WITH BUILT-IN ELECTRONIC COMPONENTS AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

CHIP BONDING METHOD AND SEMICONDUCTOR CHIP STRUCTURE