comprising protrusions or indentations

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CPC
H01L2224/16056

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16056comprising protrusions or indentations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor package and related methods
- Patent number 10,748,864
- Issue date Aug 18, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar design for conductive bump
- Patent number 9,953,948
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods
- Patent number 9,935,038
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structures, semiconductor device and semiconductor device pack...
- Patent number 9,741,675
- Issue date Aug 22, 2017
- Advanced Semiconductor Engineering, Inc.
- Dao-Long Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with solder pads including projections
- Patent number 9,583,470
- Issue date Feb 28, 2017
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar design for conductive bump
- Patent number 9,496,235
- Issue date Nov 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar design for conductive bump
- Patent number 8,816,498
- Issue date Aug 26, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES FOR IMPROVED...
- Publication number 20240213127
- Publication date Jun 27, 2024
- GAN SYSTEMS INC.
- Abhinandan DIXIT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200350271
- Publication date Nov 5, 2020
- Semiconductor Components Industries, LLC
- Thomas Fairfax LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PILLARS FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20150187745
- Publication date Jul 2, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PAD DEVICE AND METHOD
- Publication number 20150179622
- Publication date Jun 25, 2015
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Design for Conductive Bump
- Publication number 20140361432
- Publication date Dec 11, 2014
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages and Methods
- Publication number 20130270705
- Publication date Oct 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Design for Conductive Bump
- Publication number 20130020698
- Publication date Jan 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

comprising protrusions or indentations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bump structure having a side recess and semiconductor structure inc...

Bonded semiconductor package and related methods

Pillar design for conductive bump

Semiconductor device packages and methods

Bump structures, semiconductor device and semiconductor device pack...

Electronic device with solder pads including projections

Pillar design for conductive bump

Pillar design for conductive bump

Patents Applicationslast 30 patents

EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES FOR IMPROVED...

BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

SOLDER PILLARS FOR EMBEDDING SEMICONDUCTOR DIE

SOLDER PAD DEVICE AND METHOD

Pillar Design for Conductive Bump

Semiconductor Device Packages and Methods

Pillar Design for Conductive Bump