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  • H01L2224/16056
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/16056comprising protrusions or indentations
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Bonding structure
    • Publication number 20250006684
    • Publication date Jan 2, 2025
    • Teknologian Tutkimuskeskus VTT Oy
    • Jae-Wung Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES FOR IMPROVED...
    • Publication number 20240213127
    • Publication date Jun 27, 2024
    • GAN SYSTEMS INC.
    • Abhinandan DIXIT
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
    • Publication number 20200350271
    • Publication date Nov 5, 2020
    • Semiconductor Components Industries, LLC
    • Thomas Fairfax LONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLDER PILLARS FOR EMBEDDING SEMICONDUCTOR DIE
    • Publication number 20150187745
    • Publication date Jul 2, 2015
    • Sandisk Semiconductor (Shanghai) Co., Ltd.
    • Chin-Tien Chiu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SOLDER PAD DEVICE AND METHOD
    • Publication number 20150179622
    • Publication date Jun 25, 2015
    • Omkar Karhade
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Pillar Design for Conductive Bump
    • Publication number 20140361432
    • Publication date Dec 11, 2014
    • Cheng-Chieh Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Device Packages and Methods
    • Publication number 20130270705
    • Publication date Oct 17, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tsung-Ding Wang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Pillar Design for Conductive Bump
    • Publication number 20130020698
    • Publication date Jan 24, 2013
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Cheng-Chieh Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS