comprising protrusions or indentations

Industry

CPC
H01L2224/13552

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13552comprising protrusions or indentations

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip having stepped conductive pillars
- Patent number 11,955,447
- Issue date Apr 9, 2024
- Advanced Micro Devices, Inc.
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with L-shaped non-metal sidewall protection structure
- Patent number 10,163,837
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump structure for use in driver IC and method for forming th...
- Patent number 10,128,348
- Issue date Nov 13, 2018
- Himax Technologies Limited
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu pillar bump with L-shaped non-metal sidewall protection structure
- Patent number 9,524,945
- Issue date Dec 20, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump structure for use in driver IC and method for forming th...
- Patent number 9,450,061
- Issue date Sep 20, 2016
- Himax Technologies Limited
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of contact structure
- Patent number 7,871,918
- Issue date Jan 18, 2011
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact structure having a compliant bump and a test pad
- Patent number 7,834,453
- Issue date Nov 16, 2010
- Taiwan TFT LCD Association
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe for semiconductor devices
- Patent number 7,084,656
- Issue date Aug 1, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS
- Publication number 20240250051
- Publication date Jul 25, 2024
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014158
- Publication date Jan 11, 2024
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harvested Reconstitution Bumping
- Publication number 20230245988
- Publication date Aug 3, 2023
- Kwan-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS
- Publication number 20230154878
- Publication date May 18, 2023
- ADVANCED MICRO DEVICES, INC.
- SUMING HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230034654
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURE FOR USE IN DRIVER IC AND METHOD FOR FORMING TH...
- Publication number 20140327133
- Publication date Nov 6, 2014
- HIMAX TECHNOLOGIES LIMITED
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURE FOR USE IN DRIVER IC AND METHOD FOR FORMING TH...
- Publication number 20140327134
- Publication date Nov 6, 2014
- HIMAX TECHNOLOGIES LIMITED
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE
- Publication number 20110285011
- Publication date Nov 24, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CONTACT STRUCTURE
- Publication number 20090149015
- Publication date Jun 11, 2009
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20080023832
- Publication date Jan 31, 2008
- TAIWAN TFT LCD ASSOCIATION
- Shyh-Ming Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

comprising protrusions or indentations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip having stepped conductive pillars

Cu pillar bump with L-shaped non-metal sidewall protection structure

Metal bump structure for use in driver IC and method for forming th...

Cu pillar bump with L-shaped non-metal sidewall protection structure

Metal bump structure for use in driver IC and method for forming th...

Manufacturing method of contact structure

Contact structure having a compliant bump and a test pad

Probe for semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Harvested Reconstitution Bumping

SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

SEMICONDUCTOR PACKAGE

METAL BUMP STRUCTURE FOR USE IN DRIVER IC AND METHOD FOR FORMING TH...

METAL BUMP STRUCTURE FOR USE IN DRIVER IC AND METHOD FOR FORMING TH...

CU PILLAR BUMP WITH L-SHAPED NON-METAL SIDEWALL PROTECTION STRUCTURE

MANUFACTURING METHOD OF CONTACT STRUCTURE

CONTACT STRUCTURE AND MANUFACTURING METHOD THEREOF