comprising protrusions or indentations

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H01L2224/29552

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29552comprising protrusions or indentations

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, mechanical quantity measuring device, and sem...
- Patent number 10,247,630
- Issue date Apr 2, 2019
- Hitachi Automotive Systems, Ltd.
- Hanae Shimokawa
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATIO...
- Publication number 20240128221
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Minsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MECHANICAL QUANTITY MEASURING DEVICE, AND SEM...
- Publication number 20180202883
- Publication date Jul 19, 2018
- Hitachi Automotive Systems, Ltd.
- Hanae SHIMOKAWA
- H01 - BASIC ELECTRIC ELEMENTS