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H01L2224/78304

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78304comprising protrusions

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 9,230,937
- Issue date Jan 5, 2016
- Renesas Electronics Corporation
- Kaori Sumitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding means and method
- Patent number 4,415,115
- Issue date Nov 15, 1983
- Motorola, Inc.
- Kristi L. James
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CAPILLARY FOR STITCH BOND
- Publication number 20240250060
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ye Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20240105672
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
- Publication number 20140374467
- Publication date Dec 25, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
- Publication number 20120286427
- Publication date Nov 15, 2012
- Renesas Electronics Corporation
- Kaori Sumitomo
- H01 - BASIC ELECTRIC ELEMENTS