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H01L2224/75305

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75305comprising protrusions

Industries

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Patents Grantslast 30 patents

Information Patent Grant
LED with internally confined current injection area
- Patent number 11,978,825
- Issue date May 7, 2024
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 11,651,983
- Issue date May 16, 2023
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head and a bonding apparatus having the same
- Patent number 11,456,273
- Issue date Sep 27, 2022
- Samsung Electronics Co., Ltd.
- Jaecheol Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and related techniques for handling aligned substrate pairs
- Patent number 11,183,401
- Issue date Nov 23, 2021
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED with internally confined current injection area
- Patent number 11,101,405
- Issue date Aug 24, 2021
- Apple Inc.
- Kelly McGroddy
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Bond head assemblies including reflective optical elements, related...
- Patent number 11,031,367
- Issue date Jun 8, 2021
- Kulicke and Soffa Industries, In.
- Matthew B. Wasserman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus, system, and method for handling aligned wafer pairs
- Patent number 10,825,705
- Issue date Nov 3, 2020
- Suss MicroTec Lithography GmbH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods and systems for inhibiting bonding materials from contamina...
- Patent number 10,700,038
- Issue date Jun 30, 2020
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-device panel and manufacturing process thereof
- Patent number 10,615,136
- Issue date Apr 7, 2020
- Novatek Microelectronics Corp.
- Sheng-Tien Cho
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
LED with internally confined current injection area
- Patent number 10,593,832
- Issue date Mar 17, 2020
- Apple Inc.
- Kelly McGroddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 10,340,239
- Issue date Jul 2, 2019
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-activated electrical interconnection by micro-transfer pri...
- Patent number 10,163,735
- Issue date Dec 25, 2018
- X-CELEPRINT LIMITED
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure-activated electrical interconnection by micro-transfer pri...
- Patent number 10,103,069
- Issue date Oct 16, 2018
- X-CELEPRINT LIMITED
- Christopher Andrew Bower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor bonding with compliant resin and utilizing hydrogen i...
- Patent number 9,991,149
- Issue date Jun 5, 2018
- Skorpios Technologies, Inc.
- Damien Lambert
- G02 - OPTICS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,905,529
- Issue date Feb 27, 2018
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacking apparatus having a transport device configured to tra...
- Patent number 9,842,823
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 9,754,907
- Issue date Sep 5, 2017
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head and die bonding apparatus having the same
- Patent number 9,620,476
- Issue date Apr 11, 2017
- Semes Co., Ltd.
- Hang Lim Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting apparatus and method
- Patent number 9,603,262
- Issue date Mar 21, 2017
- Shinkawa Ltd.
- Koji Hojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tooling for coupling multiple electronic chips
- Patent number 9,324,629
- Issue date Apr 26, 2016
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact-based encapsulation
- Patent number 9,147,635
- Issue date Sep 29, 2015
- Cufer Asset Ltd. L.L.C.
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverse chip connector
- Patent number 8,846,445
- Issue date Sep 30, 2014
- Cufer Asset Ltd. L.L.C.
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method for display device
- Patent number 8,796,051
- Issue date Aug 5, 2014
- Samsung Display Co., Ltd.
- Deok-Jun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed wafer via
- Patent number 8,643,186
- Issue date Feb 4, 2014
- Cufer Asset Ltd. L.L.C.
- John Trezza
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device manufacturing apparatus and method for manufac...
- Patent number 8,617,923
- Issue date Dec 31, 2013
- Elpida Memory, Inc.
- Tadashi Koyanagi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSFER PRINTING STAMPS AND METHODS OF STAMP DELAMINATION
- Publication number 20240038570
- Publication date Feb 1, 2024
- X-CELEPRINT LIMITED
- Ken G. Purchase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230142695
- Publication date May 11, 2023
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230081723
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- JU HYUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS
- Publication number 20210013079
- Publication date Jan 14, 2021
- SUSS MICROTEC LITHOGRAPHY GMBH
- Hale Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING HEAD AND A BONDING APPARATUS HAVING THE SAME
- Publication number 20200343215
- Publication date Oct 29, 2020
- Samsung Electronics Co., Ltd.
- JAECHEOL KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20180033754
- Publication date Feb 1, 2018
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFERRING MEMBER AND PRESSURE APPLYING UNIT
- Publication number 20170069592
- Publication date Mar 9, 2017
- Shindengen Electric Manufacturing Co., Ltd.
- Ryo MATSUBAYASHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
- Publication number 20160322320
- Publication date Nov 3, 2016
- Cufer Asset Ltd. L.L.C.
- Roger Dugas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD FOR DISPLAY DEVICE
- Publication number 20140106484
- Publication date Apr 17, 2014
- SAMSUNG DISPLAY CO., LTD.
- Deok-Jun Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD
- Publication number 20130153644
- Publication date Jun 20, 2013
- SHINKAWA LTD.
- Koji Hojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD FOR MANUFAC...
- Publication number 20120252166
- Publication date Oct 4, 2012
- ELPIDA MEMORY, INC.
- Tadashi KOYANAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD
- Publication number 20120108009
- Publication date May 3, 2012
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CAPACITIVE COUPLING
- Publication number 20120034739
- Publication date Feb 9, 2012
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CONTACT
- Publication number 20110275178
- Publication date Nov 10, 2011
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERSE CHIP CONNECTOR
- Publication number 20110250722
- Publication date Oct 13, 2011
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN-TYPE CHIP TOOLING
- Publication number 20110223717
- Publication date Sep 15, 2011
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE
- Publication number 20110221075
- Publication date Sep 15, 2011
- SUMITOMO BAKELITE CO., LTD.
- Toru Meura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-BACKED, MEMBRANE-BASED CHIP TOOLING
- Publication number 20110212573
- Publication date Sep 1, 2011
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT-BASED ENCAPSULATION
- Publication number 20110147932
- Publication date Jun 23, 2011
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSION-BONDING APPARATUS
- Publication number 20100327043
- Publication date Dec 30, 2010
- FUJITSU LIMITED
- Kimio NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED WAFER VIA
- Publication number 20100304565
- Publication date Dec 2, 2010
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE CHIP ATTACHMENT
- Publication number 20100261297
- Publication date Oct 14, 2010
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CAPACITIVE COUPLING
- Publication number 20100219503
- Publication date Sep 2, 2010
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL THROUGH CHIP CONNECTION
- Publication number 20100197134
- Publication date Aug 5, 2010
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printing Semiconductor Elements by Shear-Assisted Elastomeric Stamp...
- Publication number 20100123268
- Publication date May 20, 2010
- Etienne MENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE-HEATING APPARATUS AND METHOD
- Publication number 20100024667
- Publication date Feb 4, 2010
- Fujitsu Limited
- Kazuyuki Ikura
- B30 - PRESSES
Information Patent Application
ISOLATING CHIP-TO-CHIP CONTACT
- Publication number 20090137116
- Publication date May 28, 2009
- Cufer Asset Ltd. L.L.C.
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD
- Publication number 20080171174
- Publication date Jul 17, 2008
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of wafer-to-wafer bonding
- Publication number 20080070376
- Publication date Mar 20, 2008
- Vladimir Vaganov
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ISOLATING CHIP-TO-CHIP CONTACT
- Publication number 20070228576
- Publication date Oct 4, 2007
- John Trezza
- H01 - BASIC ELECTRIC ELEMENTS

comprising protrusions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

LED with internally confined current injection area

Apparatus, system, and method for handling aligned wafer pairs

Bonding head and a bonding apparatus having the same

System and related techniques for handling aligned substrate pairs

LED with internally confined current injection area

Bond head assemblies including reflective optical elements, related...

Bonding apparatus, bonding system, bonding method and storage medium

Apparatus, system, and method for handling aligned wafer pairs

Bonding apparatus, bonding system, bonding method and storage medium

Methods and systems for inhibiting bonding materials from contamina...

Micro-device panel and manufacturing process thereof

LED with internally confined current injection area

Method for bonding substrates together, and substrate bonding device

Bonding apparatus, bonding system, bonding method and storage medium

Tooling for coupling multiple electronic chips

Pressure-activated electrical interconnection by micro-transfer pri...

Pressure-activated electrical interconnection by micro-transfer pri...

Method for manufacturing semiconductor device, heat insulating load...

Semiconductor bonding with compliant resin and utilizing hydrogen i...

Method for manufacturing semiconductor device

Chip-stacking apparatus having a transport device configured to tra...

Tooling for coupling multiple electronic chips

Bonding head and die bonding apparatus having the same

Electronic component mounting apparatus and method

Tooling for coupling multiple electronic chips

Contact-based encapsulation

Inverse chip connector

Bonding apparatus and method for display device

Processed wafer via

Semiconductor device manufacturing apparatus and method for manufac...

Patents Applicationslast 30 patents

TRANSFER PRINTING STAMPS AND METHODS OF STAMP DELAMINATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

APPARATUS, SYSTEM, AND METHOD FOR HANDLING ALIGNED WAFER PAIRS

BONDING HEAD AND A BONDING APPARATUS HAVING THE SAME

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

TRANSFERRING MEMBER AND PRESSURE APPLYING UNIT

TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS

BONDING APPARATUS AND METHOD FOR DISPLAY DEVICE

ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD

SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD FOR MANUFAC...

ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD

CHIP CAPACITIVE COUPLING

PATTERNED CONTACT

INVERSE CHIP CONNECTOR

PIN-TYPE CHIP TOOLING

METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

RIGID-BACKED, MEMBRANE-BASED CHIP TOOLING

CONTACT-BASED ENCAPSULATION

COMPRESSION-BONDING APPARATUS

PROCESSED WAFER VIA

REMOTE CHIP ATTACHMENT

CHIP CAPACITIVE COUPLING

COAXIAL THROUGH CHIP CONNECTION

Printing Semiconductor Elements by Shear-Assisted Elastomeric Stamp...

PRESSURE-HEATING APPARATUS AND METHOD

ISOLATING CHIP-TO-CHIP CONTACT

ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD

Method of wafer-to-wafer bonding

ISOLATING CHIP-TO-CHIP CONTACT