comprising protrusions

Industry

CPC
H01L2224/78316

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78316comprising protrusions

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for bonding insulated coating wire, connection structure, me...
- Patent number 11,791,304
- Issue date Oct 17, 2023
- Kaijo Corporation
- Akio Sugito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding tools, and methods of designing ribbon bonding tools
- Patent number 10,562,127
- Issue date Feb 18, 2020
- Kulicke and Soffa Industries, Inc.
- Bernard Poncelet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon bonding tools and methods of using the same
- Patent number 9,929,122
- Issue date Mar 27, 2018
- Orthodyne Electronics Corporation
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding systems and methods of using the same
- Patent number 8,746,537
- Issue date Jun 10, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 8,685,789
- Issue date Apr 1, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 8,685,791
- Issue date Apr 1, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ribbon bonding in an electronic package
- Patent number 7,745,253
- Issue date Jun 29, 2010
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiface wire bonding method and tool
- Patent number 3,934,783
- Issue date Jan 27, 1976
- John E. Larrison
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...
- Publication number 20210358881
- Publication date Nov 18, 2021
- KAIJO CORPORATION
- Akio SUGITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING TOOLS AND METHODS OF USING THE SAME
- Publication number 20150235983
- Publication date Aug 20, 2015
- ORTHODYNE ELECTRONICS CORPORATION
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC WIRE BONDING WEDGE WITH MULTIPLE BONDING WIRE SLOTS
- Publication number 20140326778
- Publication date Nov 6, 2014
- Shang-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20140048584
- Publication date Feb 20, 2014
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20130134577
- Publication date May 30, 2013
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20100214754
- Publication date Aug 26, 2010
- Orthodyne Electronics Corporation
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING IN AN ELECTRONIC PACKAGE
- Publication number 20070141755
- Publication date Jun 21, 2007
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ribbon bonding in an electronic package
- Publication number 20050269694
- Publication date Dec 8, 2005
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ribbon bonding
- Publication number 20040217488
- Publication date Nov 4, 2004
- Christoph B. Luechinger
- H01 - BASIC ELECTRIC ELEMENTS

comprising protrusions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for bonding insulated coating wire, connection structure, me...

Ribbon bonding tools, and methods of designing ribbon bonding tools

Ribbon bonding tools and methods of using the same

Ultrasonic bonding systems and methods of using the same

Ribbon bonding in an electronic package

Ribbon bonding in an electronic package

Ribbon bonding in an electronic package

Multiface wire bonding method and tool

Patents Applicationslast 30 patents

METHOD FOR BONDING INSULATED COATING WIRE, CONNECTION STRUCTURE, ME...

RIBBON BONDING TOOLS AND METHODS OF USING THE SAME

ULTRASONIC WIRE BONDING WEDGE WITH MULTIPLE BONDING WIRE SLOTS

ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME

RIBBON BONDING IN AN ELECTRONIC PACKAGE

RIBBON BONDING IN AN ELECTRONIC PACKAGE

RIBBON BONDING IN AN ELECTRONIC PACKAGE

Ribbon bonding in an electronic package

Ribbon bonding