Membership
Tour
Register
Log in
comprising protrusions
Follow
Industry
CPC
H01L2224/77316
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/77316
comprising protrusions
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Ultrasonic bonding systems and methods of using the same
Patent number
8,746,537
Issue date
Jun 10, 2014
Orthodyne Electronics Corporation
Christoph B. Luechinger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
ULTRASONIC BONDING SYSTEMS AND METHODS OF USING THE SAME
Publication number
20140048584
Publication date
Feb 20, 2014
Orthodyne Electronics Corporation
Christoph B. Luechinger
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR