comprising two or more layers

Industry

CPC
H01L28/75

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor

Current Industry

H01L28/75comprising two or more layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structures having deep trench capacitor and methods f...
- Patent number 12,183,778
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Szu-Yu Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage capacitor with multiple dielectrics
- Patent number 12,176,386
- Issue date Dec 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Kai-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with semiconductor layer on isolation structure
- Patent number 12,178,048
- Issue date Dec 24, 2024
- Kioxia Corporation
- Takenori Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Titanium layer as getter layer for hydrogen in a MIM device
- Patent number 12,166,067
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance MIM device with self aligned spacer
- Patent number 12,154,939
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures having deep trench capacitor and methods f...
- Patent number 12,148,791
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Szu-Yu Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor device with 2D material layer and methods o...
- Patent number 12,148,668
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Mark I. Gardner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film capacitor and electronic circuit substrate having the same
- Patent number 12,132,078
- Issue date Oct 29, 2024
- TDK Corporation
- Yoshihiko Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for capacitor structure, capacitor structure a...
- Patent number 12,127,415
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xingsong Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor trench capacitor structure and manufacturing method t...
- Patent number 12,119,414
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,120,863
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kang You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supercapacitors and integrated assemblies containing supercapacitors
- Patent number 12,119,176
- Issue date Oct 15, 2024
- Micron Technology, Inc.
- Pankaj Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric capacitor integrated with logic
- Patent number 12,113,097
- Issue date Oct 8, 2024
- Kepler Computing Inc.
- Gaurav Thareja
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 12,113,100
- Issue date Oct 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hongmin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FeRAM decoupling capacitor
- Patent number 12,114,509
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Yu Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Metal plate corner structure on metal insulator metal
- Patent number 12,107,041
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid thermal annealing (RTA) methodologies for integration of pero...
- Patent number 12,094,923
- Issue date Sep 17, 2024
- Kepler Computing Inc.
- Niloy Mukherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and electronic device including the same
- Patent number 12,087,810
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Jinhong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices and methods of fabricating the same
- Patent number 12,082,395
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Kyooho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, semiconductor device including the same, and method of f...
- Patent number 12,068,360
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Jeonggyu Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal insulator metal capacitor structure having high capacitance
- Patent number 12,068,364
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric materials, capacitors and memory arrays
- Patent number 12,062,688
- Issue date Aug 13, 2024
- Micron Technology, Inc.
- Richard Beeler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having porous region embedded structure and me...
- Patent number 12,054,838
- Issue date Aug 6, 2024
- Murata Manufacturing Co., Ltd.
- Frédéric Voiron
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor devices
- Patent number 12,057,470
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Jungmin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitors with continuous dielectric layer and methods of f...
- Patent number 12,034,086
- Issue date Jul 9, 2024
- Somilkumar J. Rathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor module with dielectric sidewa...
- Patent number 12,021,115
- Issue date Jun 25, 2024
- Microchip Technology Incorporated
- Yaojian Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated components which have both horizontally-oriented transis...
- Patent number 12,022,663
- Issue date Jun 25, 2024
- Micron Technology, Inc.
- Scott J. Derner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,016,173
- Issue date Jun 18, 2024
- Winbond Electronics Corp.
- Te-Hsuan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 12,009,387
- Issue date Jun 11, 2024
- Samsung Electronics, Co. Ltd.
- Jun-goo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back-end-of-line passive device structure
- Patent number 11,990,401
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20250008726
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Kang Lib KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS
- Publication number 20250006781
- Publication date Jan 2, 2025
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429268
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Taekyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...
- Publication number 20240421068
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Myoungsoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...
- Publication number 20240413193
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Tzu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240405062
- Publication date Dec 5, 2024
- PICO SEMICONDUCTOR INC.
- Yong Kuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING
- Publication number 20240387614
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...
- Publication number 20240387353
- Publication date Nov 21, 2024
- Intel Corporation
- Michael Langenbuch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20240387612
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Kyooho Jung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATION THEREOF
- Publication number 20240387615
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Po LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20240387611
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jinhong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE WITH SELF ALIGNED SPACER
- Publication number 20240387613
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL
- Publication number 20240379529
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yuan-Yang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROELECTRIC CAPACITOR INTEGRATED WITH A LOGIC DEVICE
- Publication number 20240379733
- Publication date Nov 14, 2024
- Kepler Computing Inc.
- Gaurav Thareja
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240379734
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND PREPARATION METHOD TH...
- Publication number 20240379736
- Publication date Nov 14, 2024
- CANSEMI TECHNOLOGY INC.
- Xiang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE
- Publication number 20240379531
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20240373620
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- KYOOHO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERAM DECOUPLING CAPACITOR
- Publication number 20240373645
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Yu Chen
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20240372014
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-CHIANG KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240363678
- Publication date Oct 31, 2024
- Samsung Electronics Co., Ltd.
- Jungmin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR STRUCTURE AND METHODS OF FORMATION
- Publication number 20240363652
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Hsuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS F...
- Publication number 20240355871
- Publication date Oct 24, 2024
- NANYA TECHNOLOGY CORPORATION
- SZU-YU HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE INCLUDING A BUFFER LAYER AND METHODS OF FORMATION
- Publication number 20240355870
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan NIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW LEAKAGE CAPACITORS, AND RELATED STRUCTURES, METHODS, AND SYSTEMS
- Publication number 20240339493
- Publication date Oct 10, 2024
- ASM IP HOLDING B.V.
- Alessandra Leonhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR STRUCTURE HAVING HIGH CAPACITANCE
- Publication number 20240339491
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manfacturing Company, Ltd.
- Chen-Yin HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING A CONTAINER-SHAPED ELECTRODE
- Publication number 20240332348
- Publication date Oct 3, 2024
- NANYA TECHNOLOGY CORPORATION
- YAO-HSIUNG KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS F...
- Publication number 20240332347
- Publication date Oct 3, 2024
- NANYA TECHNOLOGY CORPORATION
- SZU-YU HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE HAVING A CONTAINER-SHAPED ELECTRODE AND METHOD FOR FA...
- Publication number 20240332349
- Publication date Oct 3, 2024
- NANYA TECHNOLOGY CORPORATION
- YAO-HSIUNG KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240321943
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jungmin PARK
- H01 - BASIC ELECTRIC ELEMENTS

comprising two or more layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structures having deep trench capacitor and methods f...

Storage capacitor with multiple dielectrics

Memory device with semiconductor layer on isolation structure

Titanium layer as getter layer for hydrogen in a MIM device

High capacitance MIM device with self aligned spacer

Semiconductor structures having deep trench capacitor and methods f...

Stackable semiconductor device with 2D material layer and methods o...

Thin film capacitor and electronic circuit substrate having the same

Manufacturing method for capacitor structure, capacitor structure a...

Semiconductor trench capacitor structure and manufacturing method t...

Semiconductor structure and manufacturing method thereof

Supercapacitors and integrated assemblies containing supercapacitors

Ferroelectric capacitor integrated with logic

Semiconductor structure and method for manufacturing semiconductor...

FeRAM decoupling capacitor

Metal plate corner structure on metal insulator metal

Rapid thermal annealing (RTA) methodologies for integration of pero...

Capacitor and electronic device including the same

Semiconductor memory devices and methods of fabricating the same

Capacitor, semiconductor device including the same, and method of f...

Metal insulator metal capacitor structure having high capacitance

Dielectric materials, capacitors and memory arrays

Semiconductor device having porous region embedded structure and me...

Semiconductor devices

Trench capacitors with continuous dielectric layer and methods of f...

Metal-insulator-metal (MIM) capacitor module with dielectric sidewa...

Integrated components which have both horizontally-oriented transis...

Semiconductor device and manufacturing method thereof

Integrated circuit device and method of manufacturing the same

Back-end-of-line passive device structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES HAVING CAPACITOR STRUCTURES AND SEMICONDUCTOR...

SEMICONDUCTOR DEVICE STRUCTURE WITH ELECTRODE LAYER AND METHOD FOR...

SEMICONDUCTOR DEVICE

METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING

METHODS AND APPARATUS FOR IMPLEMENTING CAPACITORS IN SEMICONDUCTOR...

CAPACITOR AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATION THEREOF

CAPACITOR AND ELECTRONIC DEVICE INCLUDING THE SAME

CAPACITOR DEVICE WITH SELF ALIGNED SPACER

METAL PLATE CORNER STRUCTURE ON METAL INSULATOR METAL

FERROELECTRIC CAPACITOR INTEGRATED WITH A LOGIC DEVICE

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICE

METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND PREPARATION METHOD TH...

BACK-END-OF-LINE PASSIVE DEVICE STRUCTURE

SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME

FERAM DECOUPLING CAPACITOR

SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...

SEMICONDUCTOR DEVICES

DEEP TRENCH CAPACITOR STRUCTURE AND METHODS OF FORMATION

SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS F...

CAPACITOR STRUCTURE INCLUDING A BUFFER LAYER AND METHODS OF FORMATION

LOW LEAKAGE CAPACITORS, AND RELATED STRUCTURES, METHODS, AND SYSTEMS

METAL INSULATOR METAL CAPACITOR STRUCTURE HAVING HIGH CAPACITANCE

MEMORY DEVICE HAVING A CONTAINER-SHAPED ELECTRODE

SEMICONDUCTOR STRUCTURES HAVING DEEP TRENCH CAPACITOR AND METHODS F...

MEMORY DEVICE HAVING A CONTAINER-SHAPED ELECTRODE AND METHOD FOR FA...

SEMICONDUCTOR MEMORY DEVICE