Condensers

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CPC
H05K7/20318

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20318Condensers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Device for thermal regulation of an electronic component
- Patent number 12,224,420
- Issue date Feb 11, 2025
- Valeo Systemes Thermiques
- Kamel Azzouz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Server rack using a passive internal return loop for two-phase flui...
- Patent number 12,219,741
- Issue date Feb 4, 2025
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flow rate sensing system for liquid coolant flow management of an i...
- Patent number 12,219,738
- Issue date Feb 4, 2025
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air transportable modular shipping container for data centers
- Patent number 12,213,275
- Issue date Jan 28, 2025
- Switch, LTD.
- Rob Roy
- E04 - BUILDING
Information Patent Grant
Method for manufacturing vapor chamber
- Patent number 12,213,284
- Issue date Jan 28, 2025
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for an ion emitter-assisted heatpipe
- Patent number 12,204,385
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Housing comprising a composite wall integrating at least one coolin...
- Patent number 12,207,442
- Issue date Jan 21, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Muriel Sabah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and communication device
- Patent number 12,207,447
- Issue date Jan 21, 2025
- Huawei Technologies Co., Ltd.
- Yuping Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for centralized and scalable vapor management s...
- Patent number 12,200,907
- Issue date Jan 14, 2025
- Microsoft Technology Licensing, LLC
- Ioannis Manousakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersion cooling system
- Patent number 12,193,188
- Issue date Jan 7, 2025
- Delta Electronics, Inc.
- Chia-Yi Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor cycle cooling system for high powered devices
- Patent number 12,181,193
- Issue date Dec 31, 2024
- Honeywell International Inc.
- Andrew Zug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular, two-phase cooling systems
- Patent number 12,185,498
- Issue date Dec 31, 2024
- Coolit Systems, Inc.
- Mohammad Reza Najjari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Side fluid cooling apparatus for server racks
- Patent number 12,178,020
- Issue date Dec 24, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation device for electronic element
- Patent number 12,178,015
- Issue date Dec 24, 2024
- KMW Inc.
- Duk Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,173,968
- Issue date Dec 24, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management device for circuit breakers
- Patent number 12,171,086
- Issue date Dec 17, 2024
- EATON INTELLIGENT POWER LIMITED
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Immersion cooling system
- Patent number 12,156,377
- Issue date Nov 26, 2024
- Delta Electronics, Inc.
- Li-Kuang Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible vapor chamber with shape memory material
- Patent number 12,146,476
- Issue date Nov 19, 2024
- Intel Corporation
- Jeff Ku
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
Information Patent Grant
Immersion cooling system and cooling method thereof
- Patent number 12,150,275
- Issue date Nov 19, 2024
- Delta Electronics, Inc.
- Li-Hsiu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-phase cold plate
- Patent number 12,146,506
- Issue date Nov 19, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chien-Yu Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Hybrid heat sink
- Patent number 12,150,277
- Issue date Nov 19, 2024
- SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
- Viacheslav Stetsyuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling apparatus for electronic element
- Patent number 12,144,149
- Issue date Nov 12, 2024
- KMW Inc.
- Duk Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for vapor-compressed cooling
- Patent number 12,144,151
- Issue date Nov 12, 2024
- Quanta Computer Inc.
- Chao-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for transferring heat between a first module and a second mo...
- Patent number 12,136,937
- Issue date Nov 5, 2024
- Huawei Technologies Co., Ltd.
- Fredrik Ohlsson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Device for regulating the temperature of an electronic component
- Patent number 12,132,185
- Issue date Oct 29, 2024
- Valeo Systemes Thermiques
- Kamel Azzouz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Active/passive cooling system
- Patent number 12,127,380
- Issue date Oct 22, 2024
- Munters Corporation
- Michael Boucher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Pump drive device
- Patent number 12,127,375
- Issue date Oct 22, 2024
- BEEHE ( TAICANG ) ELECTRIC CO., LTD.
- Ronghua Liu
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,117,244
- Issue date Oct 15, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Conversion of immersion cooling systems for use with single-phase o...
- Patent number 12,114,465
- Issue date Oct 8, 2024
- Marathon Digital Holdings, Inc.
- Frederick G. Thiel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling of power semiconductors
- Patent number 12,107,032
- Issue date Oct 1, 2024
- ABB Schweiz AG
- Colin Tschida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COOLING DEVICE AND COOLING SYSTEM
- Publication number 20250056765
- Publication date Feb 13, 2025
- Fujitsu Limited
- Hideo Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFRIGERATION DEVICE AND DATA CENTER
- Publication number 20250048602
- Publication date Feb 6, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Vapor Chamber
- Publication number 20250048593
- Publication date Feb 6, 2025
- Razer (Asia-Pacific) Pte Ltd
- ChengYu CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM
- Publication number 20250040085
- Publication date Jan 30, 2025
- AEWIN TECHNOLOGIES CO., LTD.
- Cheng-En LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conversion of Immersion Cooling Systems for Use with Single-Phase O...
- Publication number 20250040089
- Publication date Jan 30, 2025
- MARA Holdings, Inc.
- Frederick G. Thiel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATER-COOLED HEAT DISSIPATION DEVICE
- Publication number 20250040091
- Publication date Jan 30, 2025
- YUNG SHEN SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID IMMERSION COOLING SYSTEM
- Publication number 20250040090
- Publication date Jan 30, 2025
- Bitmain Technologies Inc.
- Yinchuang YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROWETTING AND THERMOELECTRICS ASSISTED TWO PHASE COOLING OF PO...
- Publication number 20250024641
- Publication date Jan 16, 2025
- HAMILTON SUNDSTRAND CORPORATION
- Debabrata Pal
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID COOLING SYSTEMS TO COOL MULTI-CHIP MODULES
- Publication number 20250024640
- Publication date Jan 16, 2025
- COOLIT SYSTEMS, INC.
- Mohammad Reza Najjari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM
- Publication number 20250024642
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Li-Kuang Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL GROUND PLANE WITH VARIABLE IONIZED FLUID FLOW CONTROL FROM...
- Publication number 20250024643
- Publication date Jan 16, 2025
- Intel Corporation
- Jeff Ku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-PHASE IMMERSION COOLING SYSTEM
- Publication number 20250024638
- Publication date Jan 16, 2025
- Vertiv Corporation
- Russell Tipton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coolant Flow Enhancement
- Publication number 20250008690
- Publication date Jan 2, 2025
- GREEN REVOLUTION COOLING, INC.
- John H. BEAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS
- Publication number 20250008700
- Publication date Jan 2, 2025
- JJ COOLING INNOVATION SÀRL
- John R. Thome
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250003693
- Publication date Jan 2, 2025
- Cooler Master Co., Ltd.
- Chi-Lung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CHASSIS, ELECTRONIC APPARATUS AND CHASSIS EXHAUST METHOD
- Publication number 20240431073
- Publication date Dec 26, 2024
- Bitmain Technologies Inc.
- Ketuan ZHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EXCHANGER
- Publication number 20240414882
- Publication date Dec 12, 2024
- Rolls-Royce plc
- Daniele M GORLA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES WITH A LOOPED THERMAL MODULE HAVING A UNIDIRECTI...
- Publication number 20240397665
- Publication date Nov 28, 2024
- Apple Inc.
- Jifang TIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING APPARATUS AND ELECTRONIC DEVICE
- Publication number 20240389267
- Publication date Nov 21, 2024
- Bitmain Technologies Inc.
- Ketuan ZHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SYSTEM, POWER SUPPLY SYSTEM, AND CHARGING PILE
- Publication number 20240389283
- Publication date Nov 21, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Zhisheng LIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES
- Publication number 20240389277
- Publication date Nov 21, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Danny J. Lohan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA CENTER COOLING SYSTEM, CONTROL METHOD, AND DATA CENTER
- Publication number 20240381589
- Publication date Nov 14, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS COOLING LOOP FOR REFRIGERANT COMPRESSOR
- Publication number 20240381595
- Publication date Nov 14, 2024
- Myongsok SONG
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
SYSTEM AND METHOD FOR TESTING TWO-PHASE LIQUID COOLING
- Publication number 20240377284
- Publication date Nov 14, 2024
- ZTE Corporation
- Cheng TAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING DEVICE
- Publication number 20240381587
- Publication date Nov 14, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- TSUNG-LIN LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS AND COOLING SYSTEM FOR HEAT DISSIPATION OF HEA...
- Publication number 20240381575
- Publication date Nov 14, 2024
- Wiwynn Corporation
- Chun-Wei Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION ELECTRON MICROSCOPE
- Publication number 20240373591
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Daesung Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Conditioner for Sealed Enclosures
- Publication number 20240365501
- Publication date Oct 31, 2024
- Hoffman Enclosures Inc.
- Michael Koehler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS, COOLING SYSTEM AND LIQUID AMOUNT ADJUSTING MO...
- Publication number 20240349452
- Publication date Oct 17, 2024
- Wiwynn Corporation
- Chun-Wei Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EXCHANGE DEVICE AND HEAT EXCHANGE SYSTEM
- Publication number 20240349463
- Publication date Oct 17, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Yongqi QIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device for thermal regulation of an electronic component

Server rack using a passive internal return loop for two-phase flui...

Flow rate sensing system for liquid coolant flow management of an i...

Air transportable modular shipping container for data centers

Method for manufacturing vapor chamber

Method and apparatus for an ion emitter-assisted heatpipe

Housing comprising a composite wall integrating at least one coolin...

Heat sink and communication device

Systems and methods for centralized and scalable vapor management s...

Immersion cooling system

Vapor cycle cooling system for high powered devices

Modular, two-phase cooling systems

Side fluid cooling apparatus for server racks

Heat dissipation device for electronic element

Vapor chamber and manufacturing method of the same

Thermal management device for circuit breakers

Immersion cooling system

Flexible vapor chamber with shape memory material

Immersion cooling system and cooling method thereof

Two-phase cold plate

Hybrid heat sink

Cooling apparatus for electronic element

Systems and methods for vapor-compressed cooling

Device for transferring heat between a first module and a second mo...

Device for regulating the temperature of an electronic component

Active/passive cooling system

Pump drive device

Vapor chamber and manufacturing method of the same

Conversion of immersion cooling systems for use with single-phase o...

Cooling of power semiconductors

Patents Applicationslast 30 patents

COOLING DEVICE AND COOLING SYSTEM

REFRIGERATION DEVICE AND DATA CENTER

Vapor Chamber

IMMERSION COOLING SYSTEM

Conversion of Immersion Cooling Systems for Use with Single-Phase O...

WATER-COOLED HEAT DISSIPATION DEVICE

FLUID IMMERSION COOLING SYSTEM

ELECTROWETTING AND THERMOELECTRICS ASSISTED TWO PHASE COOLING OF PO...

HYBRID COOLING SYSTEMS TO COOL MULTI-CHIP MODULES

IMMERSION COOLING SYSTEM

THERMAL GROUND PLANE WITH VARIABLE IONIZED FLUID FLOW CONTROL FROM...

TWO-PHASE IMMERSION COOLING SYSTEM

Coolant Flow Enhancement

COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS

VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME

CHASSIS, ELECTRONIC APPARATUS AND CHASSIS EXHAUST METHOD

HEAT EXCHANGER

ELECTRONIC DEVICES WITH A LOOPED THERMAL MODULE HAVING A UNIDIRECTI...

COOLING APPARATUS AND ELECTRONIC DEVICE

HEAT DISSIPATION SYSTEM, POWER SUPPLY SYSTEM, AND CHARGING PILE

SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES

DATA CENTER COOLING SYSTEM, CONTROL METHOD, AND DATA CENTER

POWER ELECTRONICS COOLING LOOP FOR REFRIGERANT COMPRESSOR

SYSTEM AND METHOD FOR TESTING TWO-PHASE LIQUID COOLING

IMMERSION COOLING DEVICE

ELECTRONIC APPARATUS AND COOLING SYSTEM FOR HEAT DISSIPATION OF HEA...

TRANSMISSION ELECTRON MICROSCOPE

Air Conditioner for Sealed Enclosures

ELECTRONIC APPARATUS, COOLING SYSTEM AND LIQUID AMOUNT ADJUSTING MO...

HEAT EXCHANGE DEVICE AND HEAT EXCHANGE SYSTEM