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H05K7/20318

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20318Condensers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Immersion cooling system
- Patent number 12,193,188
- Issue date Jan 7, 2025
- Delta Electronics, Inc.
- Chia-Yi Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor cycle cooling system for high powered devices
- Patent number 12,181,193
- Issue date Dec 31, 2024
- Honeywell International Inc.
- Andrew Zug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular, two-phase cooling systems
- Patent number 12,185,498
- Issue date Dec 31, 2024
- Coolit Systems, Inc.
- Mohammad Reza Najjari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Side fluid cooling apparatus for server racks
- Patent number 12,178,020
- Issue date Dec 24, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation device for electronic element
- Patent number 12,178,015
- Issue date Dec 24, 2024
- KMW Inc.
- Duk Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,173,968
- Issue date Dec 24, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal management device for circuit breakers
- Patent number 12,171,086
- Issue date Dec 17, 2024
- EATON INTELLIGENT POWER LIMITED
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Immersion cooling system
- Patent number 12,156,377
- Issue date Nov 26, 2024
- Delta Electronics, Inc.
- Li-Kuang Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersion cooling system and cooling method thereof
- Patent number 12,150,275
- Issue date Nov 19, 2024
- Delta Electronics, Inc.
- Li-Hsiu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible vapor chamber with shape memory material
- Patent number 12,146,476
- Issue date Nov 19, 2024
- Intel Corporation
- Jeff Ku
- F03 - MACHINES OR ENGINES FOR LIQUIDS WIND, SPRING WEIGHT AND MISCELLANEOUS M...
Information Patent Grant
Two-phase cold plate
- Patent number 12,146,506
- Issue date Nov 19, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chien-Yu Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Hybrid heat sink
- Patent number 12,150,277
- Issue date Nov 19, 2024
- SHENZHEN ENVICOOL TECHNOLOGY CO., LTD
- Viacheslav Stetsyuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling apparatus for electronic element
- Patent number 12,144,149
- Issue date Nov 12, 2024
- KMW Inc.
- Duk Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for vapor-compressed cooling
- Patent number 12,144,151
- Issue date Nov 12, 2024
- Quanta Computer Inc.
- Chao-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for transferring heat between a first module and a second mo...
- Patent number 12,136,937
- Issue date Nov 5, 2024
- Huawei Technologies Co., Ltd.
- Fredrik Ohlsson
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Device for regulating the temperature of an electronic component
- Patent number 12,132,185
- Issue date Oct 29, 2024
- Valeo Systemes Thermiques
- Kamel Azzouz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Active/passive cooling system
- Patent number 12,127,380
- Issue date Oct 22, 2024
- Munters Corporation
- Michael Boucher
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Pump drive device
- Patent number 12,127,375
- Issue date Oct 22, 2024
- BEEHE ( TAICANG ) ELECTRIC CO., LTD.
- Ronghua Liu
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Vapor chamber and manufacturing method of the same
- Patent number 12,117,244
- Issue date Oct 15, 2024
- Cooler Master Co., Ltd.
- Chi-Lung Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Conversion of immersion cooling systems for use with single-phase o...
- Patent number 12,114,465
- Issue date Oct 8, 2024
- Marathon Digital Holdings, Inc.
- Frederick G. Thiel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling of power semiconductors
- Patent number 12,107,032
- Issue date Oct 1, 2024
- ABB Schweiz AG
- Colin Tschida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics cabinet cooling system
- Patent number 12,108,571
- Issue date Oct 1, 2024
- Rolls-Royce North American Technologies Inc.
- Timothy Unton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooling head with a heat dissipating liquid flowing from a c...
- Patent number 12,098,732
- Issue date Sep 24, 2024
- AURAS TECHNOLOGY CO., LTD.
- Mu-Shu Fan
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
High cooling efficiency data center including different server clus...
- Patent number 12,096,604
- Issue date Sep 17, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling device for use in alternating magnetic fields, coil arrange...
- Patent number 12,095,347
- Issue date Sep 17, 2024
- Airbus (S.A.S.)
- Ludovic Ybanez
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Cooling system in electronics cabinet comprising thermally coupled...
- Patent number 12,096,602
- Issue date Sep 17, 2024
- Pfannenberg GmbH
- Russell Fuller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separate immersion cooling device and separate immersion cooling sy...
- Patent number 12,089,369
- Issue date Sep 10, 2024
- Wiwynn Corporation
- Yi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management device for high density processing unit
- Patent number 12,089,370
- Issue date Sep 10, 2024
- BAIDU USA LLC
- Tianyi Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat pipe, heat dissipation module, and terminal device
- Patent number 12,089,371
- Issue date Sep 10, 2024
- HONOR DEVICE CO., LTD.
- Yameng Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system and data center
- Patent number 12,089,377
- Issue date Sep 10, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Jian Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Coolant Flow Enhancement
- Publication number 20250008690
- Publication date Jan 2, 2025
- GREEN REVOLUTION COOLING, INC.
- John H. BEAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS
- Publication number 20250008700
- Publication date Jan 2, 2025
- JJ COOLING INNOVATION SÀRL
- John R. Thome
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250003693
- Publication date Jan 2, 2025
- Cooler Master Co., Ltd.
- Chi-Lung CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CHASSIS, ELECTRONIC APPARATUS AND CHASSIS EXHAUST METHOD
- Publication number 20240431073
- Publication date Dec 26, 2024
- Bitmain Technologies Inc.
- Ketuan ZHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EXCHANGER
- Publication number 20240414882
- Publication date Dec 12, 2024
- Rolls-Royce plc
- Daniele M GORLA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES WITH A LOOPED THERMAL MODULE HAVING A UNIDIRECTI...
- Publication number 20240397665
- Publication date Nov 28, 2024
- Apple Inc.
- Jifang TIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING APPARATUS AND ELECTRONIC DEVICE
- Publication number 20240389267
- Publication date Nov 21, 2024
- Bitmain Technologies Inc.
- Ketuan ZHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SYSTEM, POWER SUPPLY SYSTEM, AND CHARGING PILE
- Publication number 20240389283
- Publication date Nov 21, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Zhisheng LIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES
- Publication number 20240389277
- Publication date Nov 21, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Danny J. Lohan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATA CENTER COOLING SYSTEM, CONTROL METHOD, AND DATA CENTER
- Publication number 20240381589
- Publication date Nov 14, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS COOLING LOOP FOR REFRIGERANT COMPRESSOR
- Publication number 20240381595
- Publication date Nov 14, 2024
- Myongsok SONG
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
IMMERSION COOLING DEVICE
- Publication number 20240381587
- Publication date Nov 14, 2024
- Fulian Precision Electronics (Tianjin) Co., LTD.
- TSUNG-LIN LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR TESTING TWO-PHASE LIQUID COOLING
- Publication number 20240377284
- Publication date Nov 14, 2024
- ZTE Corporation
- Cheng TAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS AND COOLING SYSTEM FOR HEAT DISSIPATION OF HEA...
- Publication number 20240381575
- Publication date Nov 14, 2024
- Wiwynn Corporation
- Chun-Wei Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION ELECTRON MICROSCOPE
- Publication number 20240373591
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Daesung Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Conditioner for Sealed Enclosures
- Publication number 20240365501
- Publication date Oct 31, 2024
- Hoffman Enclosures Inc.
- Michael Koehler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS, COOLING SYSTEM AND LIQUID AMOUNT ADJUSTING MO...
- Publication number 20240349452
- Publication date Oct 17, 2024
- Wiwynn Corporation
- Chun-Wei Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EXCHANGE DEVICE AND HEAT EXCHANGE SYSTEM
- Publication number 20240349463
- Publication date Oct 17, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Yongqi QIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID BREAKDOWN DETECTION SYSTEMS AND PROCESSES USEFUL FOR LIQUID I...
- Publication number 20240349451
- Publication date Oct 17, 2024
- Modine LLC
- John David Enright
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR A PUMPED LIQUID COOLING SYSTEM USING A PHA...
- Publication number 20240349453
- Publication date Oct 17, 2024
- The Durbin Group, LLC
- Joseph Marsala
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR CHAMBER WITH INTEGRATED BUBBLE PUMP
- Publication number 20240334662
- Publication date Oct 3, 2024
- ABB Schweiz AG
- Daniele Torresin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION LIQUID COOLING DEVICE
- Publication number 20240334649
- Publication date Oct 3, 2024
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFRIGERATION CYCLE APPARATUS
- Publication number 20240334650
- Publication date Oct 3, 2024
- DAIKIN INDUSTRIES, LTD.
- Motoki TAKAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING STRUCTURE AND ELECTRONIC APPARATUS
- Publication number 20240324143
- Publication date Sep 26, 2024
- Huawei Technologies Co., Ltd
- Hui JIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Package Construction for Immersion Cooling of Integrated...
- Publication number 20240314975
- Publication date Sep 19, 2024
- MTS IP Holdings Ltd
- Brian H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID IMMERSION COOLING SYSTEM WITH MULTIPLE LAYERS OF COOLANT FLUIDS
- Publication number 20240314976
- Publication date Sep 19, 2024
- SUPER MICRO COMPUTER, INC.
- Yueh Ming LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR COOLING DATA CENTERS AND ENERGY RECOVERY
- Publication number 20240292574
- Publication date Aug 29, 2024
- Jason Todd ROTH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Modular Liquid Cooling Architecture for Liquid Cooling
- Publication number 20240284635
- Publication date Aug 22, 2024
- Google LLC
- Jerry Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS
- Publication number 20240284641
- Publication date Aug 22, 2024
- Microsoft Technology Licensing, LLC
- Eric C. PETERSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PUMP-DRIVEN TWO-PHASE LIQUID COOLING SYSTEM, AND LIQUID SUPPLEMENTA...
- Publication number 20240276678
- Publication date Aug 15, 2024
- ZTE Corporation
- Cheng TAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Immersion cooling system

Vapor cycle cooling system for high powered devices

Modular, two-phase cooling systems

Side fluid cooling apparatus for server racks

Heat dissipation device for electronic element

Vapor chamber and manufacturing method of the same

Thermal management device for circuit breakers

Immersion cooling system

Immersion cooling system and cooling method thereof

Flexible vapor chamber with shape memory material

Two-phase cold plate

Hybrid heat sink

Cooling apparatus for electronic element

Systems and methods for vapor-compressed cooling

Device for transferring heat between a first module and a second mo...

Device for regulating the temperature of an electronic component

Active/passive cooling system

Pump drive device

Vapor chamber and manufacturing method of the same

Conversion of immersion cooling systems for use with single-phase o...

Cooling of power semiconductors

Electronics cabinet cooling system

Liquid cooling head with a heat dissipating liquid flowing from a c...

High cooling efficiency data center including different server clus...

Cooling device for use in alternating magnetic fields, coil arrange...

Cooling system in electronics cabinet comprising thermally coupled...

Separate immersion cooling device and separate immersion cooling sy...

Thermal management device for high density processing unit

Heat pipe, heat dissipation module, and terminal device

Cooling system and data center

Patents Applicationslast 30 patents

Coolant Flow Enhancement

COOLING SYSTEM FOR ELECTRONIC COMPONENT RACKS

VAPOR CHAMBER AND MANUFACTURING METHOD OF THE SAME

CHASSIS, ELECTRONIC APPARATUS AND CHASSIS EXHAUST METHOD

HEAT EXCHANGER

ELECTRONIC DEVICES WITH A LOOPED THERMAL MODULE HAVING A UNIDIRECTI...

COOLING APPARATUS AND ELECTRONIC DEVICE

HEAT DISSIPATION SYSTEM, POWER SUPPLY SYSTEM, AND CHARGING PILE

SYSTEMS AND METHODS FOR COOLING ELECTRONIC DEVICES

DATA CENTER COOLING SYSTEM, CONTROL METHOD, AND DATA CENTER

POWER ELECTRONICS COOLING LOOP FOR REFRIGERANT COMPRESSOR

IMMERSION COOLING DEVICE

SYSTEM AND METHOD FOR TESTING TWO-PHASE LIQUID COOLING

ELECTRONIC APPARATUS AND COOLING SYSTEM FOR HEAT DISSIPATION OF HEA...

TRANSMISSION ELECTRON MICROSCOPE

Air Conditioner for Sealed Enclosures

ELECTRONIC APPARATUS, COOLING SYSTEM AND LIQUID AMOUNT ADJUSTING MO...

HEAT EXCHANGE DEVICE AND HEAT EXCHANGE SYSTEM

FLUID BREAKDOWN DETECTION SYSTEMS AND PROCESSES USEFUL FOR LIQUID I...

METHOD AND APPARATUS FOR A PUMPED LIQUID COOLING SYSTEM USING A PHA...

VAPOR CHAMBER WITH INTEGRATED BUBBLE PUMP

IMMERSION LIQUID COOLING DEVICE

REFRIGERATION CYCLE APPARATUS

LIQUID COOLING STRUCTURE AND ELECTRONIC APPARATUS

Electronic Package Construction for Immersion Cooling of Integrated...

FLUID IMMERSION COOLING SYSTEM WITH MULTIPLE LAYERS OF COOLANT FLUIDS

SYSTEM AND METHOD FOR COOLING DATA CENTERS AND ENERGY RECOVERY

Modular Liquid Cooling Architecture for Liquid Cooling

SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS

PUMP-DRIVEN TWO-PHASE LIQUID COOLING SYSTEM, AND LIQUID SUPPLEMENTA...