Condensers

Industry

CPC
H05K7/20318

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20318Condensers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fluid phase change thermal management arrangement and method
- Patent number 12,284,786
- Issue date Apr 22, 2025
- Malcolm Barry James
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Cooling systems, cooling structures and electronic devices and meth...
- Patent number 12,284,793
- Issue date Apr 22, 2025
- Intel Corporation
- Ritu Bawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation member and electronic apparatus
- Patent number 12,270,609
- Issue date Apr 8, 2025
- Lenovo (Beijing) Limited
- Lianming Guo
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling device
- Patent number 12,274,029
- Issue date Apr 8, 2025
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Sviataslau Alehavich Filatau
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device
- Patent number 12,274,030
- Issue date Apr 8, 2025
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat pipe for improved thermal performance at cold plate interface
- Patent number 12,262,508
- Issue date Mar 25, 2025
- Intel Corporation
- Juha Paavola
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersion cooling system and immersion cooling method
- Patent number 12,256,519
- Issue date Mar 18, 2025
- Delta Electronics, Inc.
- Wei-Chih Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joint, cooling system, and computer apparatus
- Patent number 12,253,199
- Issue date Mar 18, 2025
- Huawei Technologies Co., Ltd.
- Xinhu Gong
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Systems and methods for recovering fluid in immersion-cooled datace...
- Patent number 12,250,791
- Issue date Mar 11, 2025
- Microsoft Technology Licensing, LLC
- Felipe Enrique Ortega Gutierrez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flow guiding device and liquid-cooled chassis with same
- Patent number 12,238,893
- Issue date Feb 25, 2025
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Sung Tsang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Refrigeration system for data center
- Patent number 12,238,902
- Issue date Feb 25, 2025
- BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
- Zhiming Luo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersion cooling for integrated circuit devices
- Patent number 12,238,892
- Issue date Feb 25, 2025
- Intel Corporation
- Raanan Sover
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor-air transition detection for two-phase liquid immersion cooling
- Patent number 12,238,896
- Issue date Feb 25, 2025
- Microsoft Technology Licensing, LLC
- Eric Clarence Peterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intelligent low pressure two-phase cold plate with flow stabilizati...
- Patent number 12,238,895
- Issue date Feb 25, 2025
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for cooling a substrate support
- Patent number 12,232,299
- Issue date Feb 18, 2025
- Applied Materials, Inc.
- Robert Irwin Decottignies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Water producing system for a liquid transfer mat
- Patent number 12,231,085
- Issue date Feb 18, 2025
- Enertopia Corp.
- Barry Richard Brooks
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Heat dissipation module
- Patent number 12,228,146
- Issue date Feb 18, 2025
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Device for thermal regulation of an electronic component
- Patent number 12,224,420
- Issue date Feb 11, 2025
- Valeo Systemes Thermiques
- Kamel Azzouz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Server rack using a passive internal return loop for two-phase flui...
- Patent number 12,219,741
- Issue date Feb 4, 2025
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flow rate sensing system for liquid coolant flow management of an i...
- Patent number 12,219,738
- Issue date Feb 4, 2025
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air transportable modular shipping container for data centers
- Patent number 12,213,275
- Issue date Jan 28, 2025
- Switch, LTD.
- Rob Roy
- E04 - BUILDING
Information Patent Grant
Method for manufacturing vapor chamber
- Patent number 12,213,284
- Issue date Jan 28, 2025
- Jentech Precision Industrial Co., LTD.
- Chun-Ta Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for an ion emitter-assisted heatpipe
- Patent number 12,204,385
- Issue date Jan 21, 2025
- Dell Products L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Housing comprising a composite wall integrating at least one coolin...
- Patent number 12,207,442
- Issue date Jan 21, 2025
- SAFRAN ELECTRONICS & DEFENSE
- Muriel Sabah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and communication device
- Patent number 12,207,447
- Issue date Jan 21, 2025
- Huawei Technologies Co., Ltd.
- Yuping Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for centralized and scalable vapor management s...
- Patent number 12,200,907
- Issue date Jan 14, 2025
- Microsoft Technology Licensing, LLC
- Ioannis Manousakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersion cooling system
- Patent number 12,193,188
- Issue date Jan 7, 2025
- Delta Electronics, Inc.
- Chia-Yi Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor cycle cooling system for high powered devices
- Patent number 12,181,193
- Issue date Dec 31, 2024
- Honeywell International Inc.
- Andrew Zug
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular, two-phase cooling systems
- Patent number 12,185,498
- Issue date Dec 31, 2024
- Coolit Systems, Inc.
- Mohammad Reza Najjari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Side fluid cooling apparatus for server racks
- Patent number 12,178,020
- Issue date Dec 24, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
VEHICLE THERMAL MANAGEMENT SYSTEM
- Publication number 20250153542
- Publication date May 15, 2025
- Hyundai Motor Company
- Gi Sang Yun
- B60 - VEHICLES IN GENERAL
Information Patent Application
WATER-COOLED SYSTEM FOR DATA CENTER ROOM
- Publication number 20250159847
- Publication date May 15, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINATION HEAT DISSIPATION UNIT
- Publication number 20250151231
- Publication date May 8, 2025
- ASIA VITAL COMPONENTS (CHINA) CO., LTD.
- XIWEN XIONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING MEDIUM DISTRIBUTION APPARATUS, HEAT DISSIPATION CABINET, AN...
- Publication number 20250142776
- Publication date May 1, 2025
- xFusion Digital Technologies Co., Ltd
- Hui Jia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY HEAT-DISSIPATION PROCESSING METHOD, ELECTRONIC DEVICE, AND...
- Publication number 20250140960
- Publication date May 1, 2025
- Xiamen Hithium Energy Storage Technology Co., Ltd.
- Yaqiang MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR, TWO-PHASE COOLING SYSTEMS
- Publication number 20250142777
- Publication date May 1, 2025
- COOLIT SYSTEMS, INC.
- Mohammad Reza Najjari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT PIPE FOR IMPROVED THERMAL PERFORMANCE AT COLD PLATE INTERFACE
- Publication number 20250142778
- Publication date May 1, 2025
- Intel Corporation
- Juha Paavola
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLOW GUIDING DEVICE AND LIQUID-COOLED CHASSIS WITH SAME
- Publication number 20250126750
- Publication date Apr 17, 2025
- Fulian Precision Electronics (Tianjin) Co., LTD.
- SUNG TSANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AIR TRANSPORTABLE MODULAR SHIPPING CONTAINER FOR DATA CENTERS
- Publication number 20250126739
- Publication date Apr 17, 2025
- Switch, Ltd.
- Rob Roy
- E04 - BUILDING
Information Patent Application
Cooling System With Strategically Located Bellow
- Publication number 20250126747
- Publication date Apr 17, 2025
- MARA Holdings, Inc.
- Ashu Swami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SYSTEM AND MEDICAL SYSTEM
- Publication number 20250126749
- Publication date Apr 17, 2025
- Shanghai United Imaging Healthcare Co., Ltd.
- Huaifang Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Active 2-Phase Mist-Stream Cooling System
- Publication number 20250113464
- Publication date Apr 3, 2025
- xMEMS Labs, Inc.
- Jemm Yue Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT CIRCUIT
- Publication number 20250113465
- Publication date Apr 3, 2025
- Toyota Jidosha Kabushiki Kaisha
- Hidefumi AIKAWA
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
IMMERSION HEAT EXCHANGE SYSTEM
- Publication number 20250107040
- Publication date Mar 27, 2025
- MAN ZAI INDUSTRIAL CO., LTD.
- CHENG-CHIEN WAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER ASSEMBLY WITH CLOSED CONDENSING CIRCUIT AND COOLING APPARATU...
- Publication number 20250107049
- Publication date Mar 27, 2025
- Fang-Shou LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES
- Publication number 20250107046
- Publication date Mar 27, 2025
- Microsoft Technology Licensing, LLC
- Kathryn M. OSEEN-SENDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT EXCHANGER MODULE FOR IMMERSION COOLING SYSTEM
- Publication number 20250107041
- Publication date Mar 27, 2025
- MAN ZAI INDUSTRIAL CO., LTD.
- CHENG-CHIEN WAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR CENTRALIZED AND SCALABLEVAPOR MANAGEMENT SY...
- Publication number 20250098115
- Publication date Mar 20, 2025
- Microsoft Technology Licensing, LLC
- Ioannis MANOUSAKIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DATE CENTER LOCAL COOLING SYSTEM WITH PRE-COOLING CHILLER
- Publication number 20250098125
- Publication date Mar 20, 2025
- SAMHWA ACE CO., LTD.
- Byoung Nam CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING VAPOR CHAMBER
- Publication number 20250089210
- Publication date Mar 13, 2025
- Jentech Precision Industrial Co., LTD.
- Chun-Ta YEH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOVEL HEAT PIPE CONFIGURATIONS
- Publication number 20250089213
- Publication date Mar 13, 2025
- Honeywell International Inc.
- Tao Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Integrated Vapor Chamber for Electronic Devices
- Publication number 20250081397
- Publication date Mar 6, 2025
- Google LLC
- Eric Chuang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ACTIVE/PASSIVE COOLING SYSTEM WITH PUMPED REFRIGERANT
- Publication number 20250071943
- Publication date Feb 27, 2025
- Munters Corporation
- Wei Fang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL DEVICE FOR HEAT DISSIPATION OF SERVER AND METHOD FOR CONTRO...
- Publication number 20250071942
- Publication date Feb 27, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Huanlai ZHU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIQUID COOLING SYSTEM FOR DATA CENTER AND CONTROL METHOD THEREOF
- Publication number 20250063702
- Publication date Feb 20, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING SYSTEM FOR DATA CENTER, CONTROL METHOD, AND EDGE DAT...
- Publication number 20250063701
- Publication date Feb 20, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING DEVICE AND COOLING SYSTEM
- Publication number 20250056765
- Publication date Feb 13, 2025
- Fujitsu Limited
- Hideo Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFRIGERATION DEVICE AND DATA CENTER
- Publication number 20250048602
- Publication date Feb 6, 2025
- Hebei Qinhuai Data Co., Limited.
- Binghua ZHANG
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
Vapor Chamber
- Publication number 20250048593
- Publication date Feb 6, 2025
- Razer (Asia-Pacific) Pte Ltd
- ChengYu CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM
- Publication number 20250040085
- Publication date Jan 30, 2025
- AEWIN TECHNOLOGIES CO., LTD.
- Cheng-En LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fluid phase change thermal management arrangement and method

Cooling systems, cooling structures and electronic devices and meth...

Heat dissipation member and electronic apparatus

Cooling device

Heat dissipation device

Heat pipe for improved thermal performance at cold plate interface

Immersion cooling system and immersion cooling method

Joint, cooling system, and computer apparatus

Systems and methods for recovering fluid in immersion-cooled datace...

Flow guiding device and liquid-cooled chassis with same

Refrigeration system for data center

Immersion cooling for integrated circuit devices

Vapor-air transition detection for two-phase liquid immersion cooling

Intelligent low pressure two-phase cold plate with flow stabilizati...

Methods and apparatus for cooling a substrate support

Water producing system for a liquid transfer mat

Heat dissipation module

Device for thermal regulation of an electronic component

Server rack using a passive internal return loop for two-phase flui...

Flow rate sensing system for liquid coolant flow management of an i...

Air transportable modular shipping container for data centers

Method for manufacturing vapor chamber

Method and apparatus for an ion emitter-assisted heatpipe

Housing comprising a composite wall integrating at least one coolin...

Heat sink and communication device

Systems and methods for centralized and scalable vapor management s...

Immersion cooling system

Vapor cycle cooling system for high powered devices

Modular, two-phase cooling systems

Side fluid cooling apparatus for server racks

Patents Applicationslast 30 patents

VEHICLE THERMAL MANAGEMENT SYSTEM

WATER-COOLED SYSTEM FOR DATA CENTER ROOM

COMBINATION HEAT DISSIPATION UNIT

COOLING MEDIUM DISTRIBUTION APPARATUS, HEAT DISSIPATION CABINET, AN...

BATTERY HEAT-DISSIPATION PROCESSING METHOD, ELECTRONIC DEVICE, AND...

MODULAR, TWO-PHASE COOLING SYSTEMS

HEAT PIPE FOR IMPROVED THERMAL PERFORMANCE AT COLD PLATE INTERFACE

FLOW GUIDING DEVICE AND LIQUID-COOLED CHASSIS WITH SAME

AIR TRANSPORTABLE MODULAR SHIPPING CONTAINER FOR DATA CENTERS

Cooling System With Strategically Located Bellow

HEAT DISSIPATION SYSTEM AND MEDICAL SYSTEM

Active 2-Phase Mist-Stream Cooling System

THERMAL MANAGEMENT CIRCUIT

IMMERSION HEAT EXCHANGE SYSTEM

SERVER ASSEMBLY WITH CLOSED CONDENSING CIRCUIT AND COOLING APPARATU...

SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES

HEAT EXCHANGER MODULE FOR IMMERSION COOLING SYSTEM

SYSTEMS AND METHODS FOR CENTRALIZED AND SCALABLEVAPOR MANAGEMENT SY...

DATE CENTER LOCAL COOLING SYSTEM WITH PRE-COOLING CHILLER

METHOD FOR MANUFACTURING VAPOR CHAMBER

NOVEL HEAT PIPE CONFIGURATIONS

Integrated Vapor Chamber for Electronic Devices

ACTIVE/PASSIVE COOLING SYSTEM WITH PUMPED REFRIGERANT

CONTROL DEVICE FOR HEAT DISSIPATION OF SERVER AND METHOD FOR CONTRO...

LIQUID COOLING SYSTEM FOR DATA CENTER AND CONTROL METHOD THEREOF

LIQUID COOLING SYSTEM FOR DATA CENTER, CONTROL METHOD, AND EDGE DAT...

COOLING DEVICE AND COOLING SYSTEM

REFRIGERATION DEVICE AND DATA CENTER

Vapor Chamber

IMMERSION COOLING SYSTEM