Conductive materials

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H01L23/53204

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/53204Conductive materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic devices and memory devices including conductive lev...
- Patent number 12,170,250
- Issue date Dec 17, 2024
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 12,074,193
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices and methods of manufacturing electronic devices
- Patent number 12,040,277
- Issue date Jul 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Young Ju Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and method of manufacturing the same, and...
- Patent number 12,027,457
- Issue date Jul 2, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure including graphene-metal barrier and method...
- Patent number 12,014,991
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Keunwook Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect, electrode for semiconductor device, and...
- Patent number 12,014,985
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Youngjae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management semiconductor package and manufacturing method the...
- Patent number 12,002,770
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Chih Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including under bump metallization pad
- Patent number 11,990,439
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection liner on interconnect wire to enlarge processing window...
- Patent number 11,908,794
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical interconnect elevator based on through silicon vias
- Patent number 11,887,930
- Issue date Jan 30, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symbiotic network on layers
- Patent number 11,824,046
- Issue date Nov 21, 2023
- Invensas LLC
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 11,749,711
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensated alternating polarity capacitive structures
- Patent number 11,728,336
- Issue date Aug 15, 2023
- NXP USA, INC.
- Robert S. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect, electrode for semiconductor device, and...
- Patent number 11,728,270
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Youngjae Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,721,622
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Junghoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (POP) electronic device and manufacturing method...
- Patent number 11,670,593
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,670,697
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 11,670,581
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element covered by pol...
- Patent number 11,621,317
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and method of manufacturing the same
- Patent number 11,600,569
- Issue date Mar 7, 2023
- Samsung Electronics Co., Ltd.
- Su-Hyun Bark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including conductive levels having varying...
- Patent number 11,594,495
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding pad device and method for forming the same
- Patent number 11,569,150
- Issue date Jan 31, 2023
- Winbond Electronics Corp.
- Hsi-Kai Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Titanium-containing diffusion barrier for CMP removal rate enhancem...
- Patent number 11,545,389
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having contact layers and manufacturing method
- Patent number 11,532,508
- Issue date Dec 20, 2022
- Infineon Technologies AG
- Holger Huesken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure including graphene-metal barrier and method...
- Patent number 11,508,664
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Keunwook Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for microstructure modification of conducting lines
- Patent number 11,430,693
- Issue date Aug 30, 2022
- Yuan Ze University
- Cheng En Ho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,387,233
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and method of manufacturing the same, and...
- Patent number 11,373,948
- Issue date Jun 28, 2022
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection liner on interconnect wire to enlarge processing window...
- Patent number 11,309,241
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symbiotic network on layers
- Patent number 11,270,979
- Issue date Mar 8, 2022
- Invensas Corporation
- Javier A. Delacruz
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240379536
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20240363676
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20240347445
- Publication date Oct 17, 2024
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240304558
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240258391
- Publication date Aug 1, 2024
- SK HYNIX INC.
- Rho Gyu KWAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Symbiotic Network On Layers
- Publication number 20240250071
- Publication date Jul 25, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VERTICAL INTERCONNECT ELEVATOR BASED ON THROUGH SILICON VIAS
- Publication number 20240203874
- Publication date Jun 20, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- G11 - INFORMATION STORAGE
Information Patent Application
PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...
- Publication number 20240145381
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-MOLD ELECTRONICS DEVICE
- Publication number 20240112969
- Publication date Apr 4, 2024
- Industrial Technology Research Institute
- Yu-Ming Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISTEP ETCH FOR DIRECT CHIP ATTACH (DCA) SUBSTRATES, AND ASSOCIA...
- Publication number 20240047351
- Publication date Feb 8, 2024
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20230361156
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECT, ELECTRODE FOR SEMICONDUCTOR DEVICE, AND...
- Publication number 20230343709
- Publication date Oct 26, 2023
- Samsung Electronics Co., Ltd.
- Youngjae KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AIR CAVITY
- Publication number 20230326789
- Publication date Oct 12, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230326845
- Publication date Oct 12, 2023
- DENSO CORPORATION
- YOSHITAKA KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230317613
- Publication date Oct 5, 2023
- CHENGDU ESWIN SYSTEM IC CO., LTD.
- Cheng-Tar WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268406
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Che CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260911
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20230238422
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME
- Publication number 20230189516
- Publication date Jun 15, 2023
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE STRUCTURE AND METHOD FOR...
- Publication number 20230178487
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Jungha HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230154787
- Publication date May 18, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Songmei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING CONDUCTIVE LEV...
- Publication number 20230154856
- Publication date May 18, 2023
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
FIRST LEVEL INTERCONNECT UNDER BUMP METALLIZATIONS FOR FINE PITCH H...
- Publication number 20230091379
- Publication date Mar 23, 2023
- Intel Corporation
- Liang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH TOPOLOGICAL SEMIMETAL INTERCONNECTS
- Publication number 20230030586
- Publication date Feb 2, 2023
- Yale University
- HyeukJin Han
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING GRAPHENE-METAL BARRIER AND METHOD...
- Publication number 20230012899
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- Keunwook SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure
- Publication number 20220384335
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lin-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TITANIUM-CONTAINING DIFFUSION BARRIER FOR CMP REMOVAL RATE ENHANCEM...
- Publication number 20220367244
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Kang Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20220367365
- Publication date Nov 17, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Ju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE LEVELS HAVING VARYING...
- Publication number 20220310522
- Publication date Sep 29, 2022
- Micron Technology, Inc.
- Jordan D. Greenlee
- G11 - INFORMATION STORAGE
Information Patent Application
INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20220310510
- Publication date Sep 29, 2022
- Institute of Microelectronics, Chinese Academy of Sciences
- Huilong Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Conductive materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microelectronic devices and memory devices including conductive lev...

Semiconductor device structure with magnetic element

Electronic devices and methods of manufacturing electronic devices

Interconnection structure and method of manufacturing the same, and...

Interconnect structure including graphene-metal barrier and method...

Semiconductor interconnect, electrode for semiconductor device, and...

Power management semiconductor package and manufacturing method the...

Semiconductor package including under bump metallization pad

Protection liner on interconnect wire to enlarge processing window...

Vertical interconnect elevator based on through silicon vias

Symbiotic network on layers

Semiconductor device structure with magnetic element

Compensated alternating polarity capacitive structures

Semiconductor interconnect, electrode for semiconductor device, and...

Semiconductor devices

Package-on-package (POP) electronic device and manufacturing method...

Semiconductor device and manufacturing method thereof

Interconnect structure

Semiconductor device structure with magnetic element covered by pol...

Integrated circuit device and method of manufacturing the same

Microelectronic devices including conductive levels having varying...

Semiconductor bonding pad device and method for forming the same

Titanium-containing diffusion barrier for CMP removal rate enhancem...

Semiconductor device having contact layers and manufacturing method

Interconnect structure including graphene-metal barrier and method...

Method for microstructure modification of conducting lines

Semiconductor device structure and methods of forming the same

Interconnection structure and method of manufacturing the same, and...

Protection liner on interconnect wire to enlarge processing window...

Symbiotic network on layers

Patents Applicationslast 30 patents

METHOD OF FORMING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Symbiotic Network On Layers

VERTICAL INTERCONNECT ELEVATOR BASED ON THROUGH SILICON VIAS

PROTECTION LINER ON INTERCONNECT WIRE TO ENLARGE PROCESSING WINDOW...

IN-MOLD ELECTRONICS DEVICE

MULTISTEP ETCH FOR DIRECT CHIP ATTACH (DCA) SUBSTRATES, AND ASSOCIA...

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

SEMICONDUCTOR INTERCONNECT, ELECTRODE FOR SEMICONDUCTOR DEVICE, AND...

SEMICONDUCTOR DEVICE HAVING AIR CAVITY

CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

VERTICAL MEMORY DEVICES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE STRUCTURE AND METHOD FOR...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

MICROELECTRONIC DEVICES AND MEMORY DEVICES INCLUDING CONDUCTIVE LEV...

FIRST LEVEL INTERCONNECT UNDER BUMP METALLIZATIONS FOR FINE PITCH H...

INTEGRATED CIRCUIT WITH TOPOLOGICAL SEMIMETAL INTERCONNECTS

INTERCONNECT STRUCTURE INCLUDING GRAPHENE-METAL BARRIER AND METHOD...

Interconnect Structure

TITANIUM-CONTAINING DIFFUSION BARRIER FOR CMP REMOVAL RATE ENHANCEM...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE LEVELS HAVING VARYING...

INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND...