Conductive organic material or pastes

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H01L23/4828

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/4828Conductive organic material or pastes

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices
- Patent number 11,996,457
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Hyuncheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,942,389
- Issue date Mar 26, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus for discharging heat
- Patent number 11,923,264
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Yongha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,842,939
- Issue date Dec 12, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,676,878
- Issue date Jun 13, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,646,242
- Issue date May 9, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,621,207
- Issue date Apr 4, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,476,177
- Issue date Oct 18, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,443,999
- Issue date Sep 13, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,410,904
- Issue date Aug 9, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, connection body, and manufacturing method for el...
- Patent number 11,404,353
- Issue date Aug 2, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,328,974
- Issue date May 10, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,296,003
- Issue date Apr 5, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,217,501
- Issue date Jan 4, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,158,559
- Issue date Oct 26, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package structure
- Patent number 11,139,177
- Issue date Oct 5, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,127,648
- Issue date Sep 21, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,107,789
- Issue date Aug 31, 2021
- Mitsui Chemicals Tohcello, Inc.
- Eiji Hayashishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,094,561
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,081,418
- Issue date Aug 3, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip transmitting sign...
- Patent number 11,049,806
- Issue date Jun 29, 2021
- Renesas Electronics Corporation
- Kazuyuki Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,043,439
- Issue date Jun 22, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and connection body
- Patent number 10,910,292
- Issue date Feb 2, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for semiconductor sensor chip mounting, and semiconductor...
- Patent number 10,790,217
- Issue date Sep 29, 2020
- Sekisui Chemical Co., Ltd.
- Saori Ueda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Joined body, method for producing joined body, and projector
- Patent number 10,747,093
- Issue date Aug 18, 2020
- Seiko Epson Corporation
- Yohei Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for semiconductor mounting, and semiconductor sensor
- Patent number 10,679,925
- Issue date Jun 9, 2020
- Sekisui Chemical Co., Ltd.
- Saori Ueda
- G01 - MEASURING TESTING
Information Patent Grant
Interconnect structure for semiconductor package and method of fabr...
- Patent number 10,679,866
- Issue date Jun 9, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,600,712
- Issue date Mar 24, 2020
- Shindengen Electric Manufacturing Co., Ltd.
- Yuji Morinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device for chip on film and display panel and bonding metho...
- Patent number 10,395,945
- Issue date Aug 27, 2019
- BOE Technology Group Co., Ltd.
- Lili Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing display panel, and display device
- Patent number 10,217,955
- Issue date Feb 26, 2019
- BOE Technology Group Co., Ltd.
- Leilei Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Conductive Features with Air Spacer and Method of Forming Same
- Publication number 20240387332
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240047323
- Publication date Feb 8, 2024
- WISTRON NEWEB CORPORATION
- KUO-HUA HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE
- Publication number 20230275069
- Publication date Aug 31, 2023
- RENESAS ELECTRONICS CORPORATION
- Hiroshi YANAGIGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE BY USING A REA...
- Publication number 20230187319
- Publication date Jun 15, 2023
- INFINEON TECHNOLOGIES AG
- Anita Herzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURES WITH AIR SPACER AND METHOD OF FORMING SAME
- Publication number 20230038952
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20220199793
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- Hyuncheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED SEMICONDUCTOR PACKAGE WITH AT LEAST ONE HEAT EXT...
- Publication number 20210296199
- Publication date Sep 23, 2021
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS SEMICONDUCTOR APPARATUS HAVING A SEMICONDUC...
- Publication number 20210090968
- Publication date Mar 25, 2021
- Samsung Electronics Co., Ltd.
- Yongha Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200312810
- Publication date Oct 1, 2020
- MITSUI CHEMICALS TOHCELLO, INC.
- Eiji Hayashishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200303214
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20200303213
- Publication date Sep 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, CONNECTION BODY, AND MANUFACTURING METHOD FOR EL...
- Publication number 20200219797
- Publication date Jul 9, 2020
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro UMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED PACKAGE AND PROCESS FOR MAKING THE SAME
- Publication number 20200176347
- Publication date Jun 4, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND CONNECTION BODY
- Publication number 20190378782
- Publication date Dec 12, 2019
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro UMEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR MOUNTING, AND SEMICONDUCTOR SENSOR
- Publication number 20190088573
- Publication date Mar 21, 2019
- Sekisui Chemical Co., Ltd.
- Saori UEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20190051577
- Publication date Feb 14, 2019
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Yuji MORINAGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE AND SOLAR CELL
- Publication number 20190044005
- Publication date Feb 7, 2019
- NAMICS CORPORATION
- Kenichi SAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE FOR CHIP ON FILM AND DISPLAY PANEL AND BONDING METHO...
- Publication number 20180053664
- Publication date Feb 22, 2018
- BOE TECHNOLOGY GROUP CO., LTD.
- Lili Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF FABR...
- Publication number 20160240451
- Publication date Aug 18, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Ling HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF
- Publication number 20160190059
- Publication date Jun 30, 2016
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- CHAO-TSUNG TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Paste for Forming Conductive Film for Semiconductor Devi...
- Publication number 20150159025
- Publication date Jun 11, 2015
- KYOTO ELEX CO., LTD.
- Kazuya Takagi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THE SAME
- Publication number 20140346505
- Publication date Nov 27, 2014
- Yoshinobu ASAMI
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELECTRODE, ELECTRODE MATERIAL, AND ELECTRODE FORMATION METHOD
- Publication number 20140034354
- Publication date Feb 6, 2014
- ZyCube Co., Ltd.
- Manabu Bonkohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THE SAME
- Publication number 20140014953
- Publication date Jan 16, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Yoshinobu Asami
- B82 - NANO-TECHNOLOGY
Information Patent Application
SILICON/GERMANIUM NANOPARTICLE INKS, LASER PYROLYSIS REACTORS FOR T...
- Publication number 20130221286
- Publication date Aug 29, 2013
- NanoGram Corporation
- Shivkumar Chiruvolu
- B82 - NANO-TECHNOLOGY
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE
- Publication number 20130161838
- Publication date Jun 27, 2013
- Jae Sun HAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FASTENING DEVICE
- Publication number 20130140702
- Publication date Jun 6, 2013
- Micronas GmbH
- Christoph WILBERTZ
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE A...
- Publication number 20130113119
- Publication date May 9, 2013
- Hyun Hee NAMKUNG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THE SAME
- Publication number 20120273778
- Publication date Nov 1, 2012
- Semiconductor Energy Laboratory Co., Ltd.
- Yoshinobu Asami
- G11 - INFORMATION STORAGE
Information Patent Application
SILICON/GERMANIUM NANOPARTICLE INKS, LASER PYROLYSIS REACTORS FOR T...
- Publication number 20110318905
- Publication date Dec 29, 2011
- Shivkumar Chiruvolu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Conductive organic material or pastes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor devices

Thermally enhanced semiconductor package with at least one heat ext...

Semiconductor apparatus for discharging heat

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Electronic device, connection body, and manufacturing method for el...

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Thermally enhanced semiconductor package with at least one heat ext...

Method of fabricating semiconductor package structure

Thermally enhanced semiconductor package with at least one heat ext...

Method for manufacturing semiconductor device

Semiconductor package structure

Thermally enhanced semiconductor package with at least one heat ext...

Semiconductor device including semiconductor chip transmitting sign...

Thermally enhanced semiconductor package with at least one heat ext...

Electronic device and connection body

Adhesive for semiconductor sensor chip mounting, and semiconductor...

Joined body, method for producing joined body, and projector

Adhesive for semiconductor mounting, and semiconductor sensor

Interconnect structure for semiconductor package and method of fabr...

Electronic device

Bonding device for chip on film and display panel and bonding metho...

Method for manufacturing display panel, and display device

Patents Applicationslast 30 patents

Conductive Features with Air Spacer and Method of Forming Same

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE BY USING A REA...

CONDUCTIVE FEATURES WITH AIR SPACER AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICES

THERMALLY ENHANCED SEMICONDUCTOR PACKAGE WITH AT LEAST ONE HEAT EXT...

SEMICONDUCTOR APPARATUS SEMICONDUCTOR APPARATUS HAVING A SEMICONDUC...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE STRUCTURE

ELECTRONIC DEVICE, CONNECTION BODY, AND MANUFACTURING METHOD FOR EL...

THERMALLY ENHANCED PACKAGE AND PROCESS FOR MAKING THE SAME

ELECTRONIC DEVICE AND CONNECTION BODY

ADHESIVE FOR SEMICONDUCTOR MOUNTING, AND SEMICONDUCTOR SENSOR

ELECTRONIC DEVICE

CONDUCTIVE PASTE AND SOLAR CELL

BONDING DEVICE FOR CHIP ON FILM AND DISPLAY PANEL AND BONDING METHO...

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF FABR...

PACKAGE APPARATUS AND MANUFACTURING METHOD THEREOF

Conductive Paste for Forming Conductive Film for Semiconductor Devi...

MEMORY DEVICE AND MANUFACTURING METHOD THE SAME

ELECTRODE, ELECTRODE MATERIAL, AND ELECTRODE FORMATION METHOD

MEMORY DEVICE AND MANUFACTURING METHOD THE SAME

SILICON/GERMANIUM NANOPARTICLE INKS, LASER PYROLYSIS REACTORS FOR T...

ANISOTROPIC CONDUCTIVE FILM AND SEMICONDUCTOR DEVICE

FASTENING DEVICE

SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE A...

MEMORY DEVICE AND MANUFACTURING METHOD THE SAME

SILICON/GERMANIUM NANOPARTICLE INKS, LASER PYROLYSIS REACTORS FOR T...