Conductive parts

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H01L21/4814

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4814Conductive parts

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor package unit of surface mount technology includ...
- Patent number 12,148,675
- Issue date Nov 19, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a conductive layer stacking with an in...
- Patent number 12,136,586
- Issue date Nov 5, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,113,011
- Issue date Oct 8, 2024
- Fuji Electric Co., Ltd.
- Hiroto Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting electronic components to substrates
- Patent number 12,094,811
- Issue date Sep 17, 2024
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming contact structures and semiconductor devices in...
- Patent number 12,057,372
- Issue date Aug 6, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip encapsulation structure and encapsulation method
- Patent number 12,057,361
- Issue date Aug 6, 2024
- Epicmems (Xiamen) Co., Ltd.
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package architectures containing a die back side metal a...
- Patent number 12,040,246
- Issue date Jul 16, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable and wire bondable part marking
- Patent number 12,021,038
- Issue date Jun 25, 2024
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned contact openings for backside through substrate vias
- Patent number 11,973,006
- Issue date Apr 30, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices with backside bond pads under a memory array
- Patent number 11,935,853
- Issue date Mar 19, 2024
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed heat spreader structures and methods of providing same
- Patent number 11,923,268
- Issue date Mar 5, 2024
- Intel Corporation
- Jesus Gerardo Reyes Schuldes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting components of an electronic system by si...
- Patent number 11,919,083
- Issue date Mar 5, 2024
- Commissariat a l'Energie Atomique et aux Energies
- Céline Feautrier
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,923,272
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Zhuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having substrate with embedded elec...
- Patent number 11,881,448
- Issue date Jan 23, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting components of an electronic system by si...
- Patent number 11,876,002
- Issue date Jan 16, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Maxime Bronchy
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Mask design for improved attach position
- Patent number 11,862,478
- Issue date Jan 2, 2024
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding structures
- Patent number 11,855,022
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet for sintering bonding and sheet for sintering bonding with ba...
- Patent number 11,839,936
- Issue date Dec 12, 2023
- Nitto Denko Corporation
- Ryota Mita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,776,887
- Issue date Oct 3, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for semiconductor die edge protection and semiconductor die...
- Patent number 11,764,096
- Issue date Sep 19, 2023
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic structure, electronic package structure and method of ma...
- Patent number 11,749,593
- Issue date Sep 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded semiconductor packages with open terminals and methods of...
- Patent number 11,728,281
- Issue date Aug 15, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including TSV and method of manufacturing the...
- Patent number 11,705,386
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Kwang Wuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a slot in EMI shielding...
- Patent number 11,640,944
- Issue date May 2, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit (3D IC) power distribution net...
- Patent number 11,626,359
- Issue date Apr 11, 2023
- QUALCOMM Incorporated
- Biancun Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal plug through a hole in a device including a resistanc...
- Patent number 11,587,848
- Issue date Feb 21, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yi Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic switching device with a three-dimensionally prefor...
- Patent number 11,581,245
- Issue date Feb 14, 2023
- Semikron Elektronik GmbH & Co. KG
- Michael Schatz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a spacer structure in a conductive laye...
- Patent number 11,562,945
- Issue date Jan 24, 2023
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible and stretchable interconnects for flexible systems
- Patent number 11,538,764
- Issue date Dec 27, 2022
- The Regents of the University of California
- Subramanian S. Iyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,538,737
- Issue date Dec 27, 2022
- Samsung Electronics Co., Ltd.
- Myungsam Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20240332112
- Publication date Oct 3, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES WITH BACKSIDE BOND PADS UNDER A MEMORY ARRAY
- Publication number 20240312933
- Publication date Sep 19, 2024
- Lodestar Licensing Group LLC
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE AND WIRE BONDABLE PART MARKING
- Publication number 20240312926
- Publication date Sep 19, 2024
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED CONTACT OPENINGS FOR BACKSIDE THROUGH SUBSTRATE VIAS
- Publication number 20240297099
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jeffrey Peter GAMBINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONTACT STRUCTURES AND SEMICONDUCTOR DEVICES TH...
- Publication number 20240282673
- Publication date Aug 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEMICONDUCTOR DIE EDGE PROTECTION AND SEMICONDUCTOR DIE...
- Publication number 20240006223
- Publication date Jan 4, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20230411304
- Publication date Dec 21, 2023
- STATS ChipPAC Pte Ltd.
- Heeyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Reducing Metal Burrs Using Lase...
- Publication number 20230170245
- Publication date Jun 1, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH INTERFACE REGION
- Publication number 20230129699
- Publication date Apr 27, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230121889
- Publication date Apr 20, 2023
- Fuji Electric Co., Ltd.
- Hiroto WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CONTACT STRUCTURES AND SEMICONDUCTOR DEVICES TH...
- Publication number 20230118742
- Publication date Apr 20, 2023
- Yangtze Memory Technologies Co., Ltd.
- Linchun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR...
- Publication number 20230063723
- Publication date Mar 2, 2023
- Fuji Electric Co., Ltd.
- Daiki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC STRUCTURE, ELECTRONIC PACKAGE STRUCTURE AND METHOD OF MA...
- Publication number 20230018762
- Publication date Jan 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE AND WIRE BONDABLE PART MARKING
- Publication number 20220399280
- Publication date Dec 15, 2022
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220359363
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Slot in EMI Shielding...
- Publication number 20220359417
- Publication date Nov 10, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220359362
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) POWER DISTRIBUTION NET...
- Publication number 20220344249
- Publication date Oct 27, 2022
- QUALCOMM Incorporated
- Biancun XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package Unit of Surface Mount Technology and Ma...
- Publication number 20220344228
- Publication date Oct 27, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES WITH BACKSIDE BOND PADS UNDER A MEMORY ARRAY
- Publication number 20220336391
- Publication date Oct 20, 2022
- Micron Technology, Inc.
- Eric N. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING STRUCTURES
- Publication number 20220328440
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION OF CONDUCTIVE VIA OR TRENCH FOR INTRA MODULE EMI SHIELDING
- Publication number 20220310530
- Publication date Sep 29, 2022
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask Design for Improved Attach Position
- Publication number 20220310408
- Publication date Sep 29, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220238417
- Publication date Jul 28, 2022
- Micron Technology, Inc.
- Zhuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD
- Publication number 20220230931
- Publication date Jul 21, 2022
- Epicmems (Xiamen) Co., Ltd.
- Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE, INTEGRATED CIRCUIT PACKAGE UN...
- Publication number 20220208714
- Publication date Jun 30, 2022
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask Design for Improved Attach Position
- Publication number 20220199423
- Publication date Jun 23, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TSV AND METHOD OF MANUFACTURING THE...
- Publication number 20220173016
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- Kwang Wuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20220157761
- Publication date May 19, 2022
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH ISOLATION LAYER
- Publication number 20220122905
- Publication date Apr 21, 2022
- INFINEON TECHNOLOGIES AG
- Stefan SCHWAB
- H01 - BASIC ELECTRIC ELEMENTS

Conductive parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor package unit of surface mount technology includ...

Semiconductor devices having a conductive layer stacking with an in...

Semiconductor device and method of manufacturing the same

Connecting electronic components to substrates

Methods for forming contact structures and semiconductor devices in...

Chip encapsulation structure and encapsulation method

Chip-scale package architectures containing a die back side metal a...

Solderable and wire bondable part marking

Self-aligned contact openings for backside through substrate vias

Memory devices with backside bond pads under a memory array

Printed heat spreader structures and methods of providing same

Method for interconnecting components of an electronic system by si...

Integrated assemblies and methods of forming integrated assemblies

Semiconductor package structure having substrate with embedded elec...

Method for interconnecting components of an electronic system by si...

Mask design for improved attach position

Shielding structures

Sheet for sintering bonding and sheet for sintering bonding with ba...

Semiconductor package structure and method for manufacturing the same

Method for semiconductor die edge protection and semiconductor die...

Electronic structure, electronic package structure and method of ma...

Shielded semiconductor packages with open terminals and methods of...

Semiconductor device including TSV and method of manufacturing the...

Semiconductor device and method of forming a slot in EMI shielding...

Three-dimensional integrated circuit (3D IC) power distribution net...

Forming metal plug through a hole in a device including a resistanc...

Power electronic switching device with a three-dimensionally prefor...

Semiconductor device having a spacer structure in a conductive laye...

Flexible and stretchable interconnects for flexible systems

Semiconductor package

Patents Applicationslast 30 patents

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

MEMORY DEVICES WITH BACKSIDE BOND PADS UNDER A MEMORY ARRAY

SOLDERABLE AND WIRE BONDABLE PART MARKING

SELF-ALIGNED CONTACT OPENINGS FOR BACKSIDE THROUGH SUBSTRATE VIAS

METHODS FOR FORMING CONTACT STRUCTURES AND SEMICONDUCTOR DEVICES TH...

METHOD FOR SEMICONDUCTOR DIE EDGE PROTECTION AND SEMICONDUCTOR DIE...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method for Reducing Metal Burrs Using Lase...

IC PACKAGE WITH INTERFACE REGION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHODS FOR FORMING CONTACT STRUCTURES AND SEMICONDUCTOR DEVICES TH...

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR...

ELECTRONIC STRUCTURE, ELECTRONIC PACKAGE STRUCTURE AND METHOD OF MA...

SOLDERABLE AND WIRE BONDABLE PART MARKING

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device and Method of Forming a Slot in EMI Shielding...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) POWER DISTRIBUTION NET...

Power Semiconductor Package Unit of Surface Mount Technology and Ma...

MEMORY DEVICES WITH BACKSIDE BOND PADS UNDER A MEMORY ARRAY

SHIELDING STRUCTURES

APPLICATION OF CONDUCTIVE VIA OR TRENCH FOR INTRA MODULE EMI SHIELDING

Mask Design for Improved Attach Position

Integrated Assemblies and Methods of Forming Integrated Assemblies

CHIP ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD

INTEGRATED CIRCUIT PACKAGE STRUCTURE, INTEGRATED CIRCUIT PACKAGE UN...

Mask Design for Improved Attach Position

SEMICONDUCTOR DEVICE INCLUDING TSV AND METHOD OF MANUFACTURING THE...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

LEADFRAME PACKAGE WITH ISOLATION LAYER