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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/4814
Conductive parts
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Patents Grants
last 30 patents
Information
Patent Grant
Memory devices with backside bond pads under a memory array
Patent number
11,935,853
Issue date
Mar 19, 2024
Eric N. Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed heat spreader structures and methods of providing same
Patent number
11,923,268
Issue date
Mar 5, 2024
Intel Corporation
Jesus Gerardo Reyes Schuldes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated assemblies and methods of forming integrated assemblies
Patent number
11,923,272
Issue date
Mar 5, 2024
Micron Technology, Inc.
Zhuo Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for interconnecting components of an electronic system by si...
Patent number
11,919,083
Issue date
Mar 5, 2024
Commissariat a l'Energie Atomique et aux Energies
Céline Feautrier
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Semiconductor package structure having substrate with embedded elec...
Patent number
11,881,448
Issue date
Jan 23, 2024
Advanced Semiconductor Engineering, Inc.
You-Lung Yen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for interconnecting components of an electronic system by si...
Patent number
11,876,002
Issue date
Jan 16, 2024
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Maxime Bronchy
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Mask design for improved attach position
Patent number
11,862,478
Issue date
Jan 2, 2024
STATS ChipPAC Pte. Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielding structures
Patent number
11,855,022
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Fan Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sheet for sintering bonding and sheet for sintering bonding with ba...
Patent number
11,839,936
Issue date
Dec 12, 2023
Nitto Denko Corporation
Ryota Mita
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package structure and method for manufacturing the same
Patent number
11,776,887
Issue date
Oct 3, 2023
Advanced Semiconductor Engineering, Inc.
Wei-Wei Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for semiconductor die edge protection and semiconductor die...
Patent number
11,764,096
Issue date
Sep 19, 2023
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic structure, electronic package structure and method of ma...
Patent number
11,749,593
Issue date
Sep 5, 2023
Advanced Semiconductor Engineering, Inc.
Shun-Tsat Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielded semiconductor packages with open terminals and methods of...
Patent number
11,728,281
Issue date
Aug 15, 2023
STATS ChipPAC Pte. Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including TSV and method of manufacturing the...
Patent number
11,705,386
Issue date
Jul 18, 2023
Samsung Electronics Co., Ltd.
Kwang Wuk Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a slot in EMI shielding...
Patent number
11,640,944
Issue date
May 2, 2023
STATS ChipPAC Pte. Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three-dimensional integrated circuit (3D IC) power distribution net...
Patent number
11,626,359
Issue date
Apr 11, 2023
QUALCOMM Incorporated
Biancun Xie
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Forming metal plug through a hole in a device including a resistanc...
Patent number
11,587,848
Issue date
Feb 21, 2023
Semiconductor Manufacturing International (Shanghai) Corporation
Yi Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power electronic switching device with a three-dimensionally prefor...
Patent number
11,581,245
Issue date
Feb 14, 2023
Semikron Elektronik GmbH & Co. KG
Michael Schatz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a spacer structure in a conductive laye...
Patent number
11,562,945
Issue date
Jan 24, 2023
Yangtze Memory Technologies Co., Ltd.
Linchun Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible and stretchable interconnects for flexible systems
Patent number
11,538,764
Issue date
Dec 27, 2022
The Regents of the University of California
Subramanian S. Iyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,538,737
Issue date
Dec 27, 2022
Samsung Electronics Co., Ltd.
Myungsam Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and layout method of a semiconductor structure
Patent number
11,417,588
Issue date
Aug 16, 2022
Taiwan Semiconductor Manufacturing Company Ltd.
Wei-Ren Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor structure
Patent number
11,417,628
Issue date
Aug 16, 2022
AP Memory Technology Corporation
Wenliang Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package device and method for manufacturing the same
Patent number
11,411,073
Issue date
Aug 9, 2022
Advanced Semiconductor Engineering, Inc.
Shao Hsuan Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory devices with backside bond pads under a memory array
Patent number
11,410,949
Issue date
Aug 9, 2022
Micron Technology, Inc.
Eric N. Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe package with isolation layer
Patent number
11,404,359
Issue date
Aug 2, 2022
Infineon Technologies AG
Stefan Schwab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mask design for improved attach position
Patent number
11,393,698
Issue date
Jul 19, 2022
STATS ChipPAC Pte. Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating semiconductor device including etching an ed...
Patent number
11,387,207
Issue date
Jul 12, 2022
NANYA TECHNOLOGY CORPORATION
Sheng-Fu Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielding structures
Patent number
11,380,639
Issue date
Jul 5, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Chih-Fan Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated assemblies and methods of forming integrated assemblies
Patent number
11,335,626
Issue date
May 17, 2022
Micron Technology, Inc.
Zhuo Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR SEMICONDUCTOR DIE EDGE PROTECTION AND SEMICONDUCTOR DIE...
Publication number
20240006223
Publication date
Jan 4, 2024
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
Publication number
20230411304
Publication date
Dec 21, 2023
STATS ChipPAC Pte Ltd.
Heeyoun KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method for Reducing Metal Burrs Using Lase...
Publication number
20230170245
Publication date
Jun 1, 2023
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC PACKAGE WITH INTERFACE REGION
Publication number
20230129699
Publication date
Apr 27, 2023
TEXAS INSTRUMENTS INCORPORATED
Rafael Jose Lizares Guevara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20230121889
Publication date
Apr 20, 2023
Fuji Electric Co., Ltd.
Hiroto WATANABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR FORMING CONTACT STRUCTURES AND SEMICONDUCTOR DEVICES TH...
Publication number
20230118742
Publication date
Apr 20, 2023
Yangtze Memory Technologies Co., Ltd.
Linchun Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR...
Publication number
20230063723
Publication date
Mar 2, 2023
Fuji Electric Co., Ltd.
Daiki YOSHIDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC STRUCTURE, ELECTRONIC PACKAGE STRUCTURE AND METHOD OF MA...
Publication number
20230018762
Publication date
Jan 19, 2023
Advanced Semiconductor Engineering, Inc.
Shun-Tsat TU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDERABLE AND WIRE BONDABLE PART MARKING
Publication number
20220399280
Publication date
Dec 15, 2022
MACOM Technology Solutions Holdings, Inc.
Margaret Barter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20220359363
Publication date
Nov 10, 2022
Advanced Semiconductor Engineering, Inc.
You-Lung YEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a Slot in EMI Shielding...
Publication number
20220359417
Publication date
Nov 10, 2022
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20220359362
Publication date
Nov 10, 2022
Advanced Semiconductor Engineering, Inc.
Wei-Wei LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT (3D IC) POWER DISTRIBUTION NET...
Publication number
20220344249
Publication date
Oct 27, 2022
QUALCOMM Incorporated
Biancun XIE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Semiconductor Package Unit of Surface Mount Technology and Ma...
Publication number
20220344228
Publication date
Oct 27, 2022
PANJIT INTERNATIONAL INC.
Chung-Hsiung Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICES WITH BACKSIDE BOND PADS UNDER A MEMORY ARRAY
Publication number
20220336391
Publication date
Oct 20, 2022
Micron Technology, Inc.
Eric N. Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELDING STRUCTURES
Publication number
20220328440
Publication date
Oct 13, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chih-Fan Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPLICATION OF CONDUCTIVE VIA OR TRENCH FOR INTRA MODULE EMI SHIELDING
Publication number
20220310530
Publication date
Sep 29, 2022
Skyworks Solutions, Inc.
Anthony James LoBianco
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mask Design for Improved Attach Position
Publication number
20220310408
Publication date
Sep 29, 2022
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
Publication number
20220238417
Publication date
Jul 28, 2022
Micron Technology, Inc.
Zhuo Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD
Publication number
20220230931
Publication date
Jul 21, 2022
Epicmems (Xiamen) Co., Ltd.
Wei WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE, INTEGRATED CIRCUIT PACKAGE UN...
Publication number
20220208714
Publication date
Jun 30, 2022
Chengdu Monolithic Power Systems Co., Ltd.
Yingjiang Pu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mask Design for Improved Attach Position
Publication number
20220199423
Publication date
Jun 23, 2022
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING TSV AND METHOD OF MANUFACTURING THE...
Publication number
20220173016
Publication date
Jun 2, 2022
Samsung Electronics Co., Ltd.
Kwang Wuk Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
Publication number
20220157761
Publication date
May 19, 2022
NANYA TECHNOLOGY CORPORATION
Sheng-Fu HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADFRAME PACKAGE WITH ISOLATION LAYER
Publication number
20220122905
Publication date
Apr 21, 2022
INFINEON TECHNOLOGIES AG
Stefan SCHWAB
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR FORMING CONTACT STRUCTURES AND SEMICONDUCTOR DEVICES TH...
Publication number
20220102247
Publication date
Mar 31, 2022
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
Linchun Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
Publication number
20220084906
Publication date
Mar 17, 2022
Micron Technology, Inc.
Zhuo Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER ELECTRONIC SWITCHING DEVICE WITH A THREE-DIMENSIONALLY PREFOR...
Publication number
20220068768
Publication date
Mar 3, 2022
SEMIKRON ELEKTRONIK GMBH & CO. KG
MICHAEL SCHATZ
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR INTERCONNECTING COMPONENTS OF AN ELECTRONIC SYSTEM BY SI...
Publication number
20220068664
Publication date
Mar 3, 2022
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Maxime BRONCHY
B22 - CASTING POWDER METALLURGY
Information
Patent Application
METHOD FOR INTERCONNECTING COMPONENTS OF AN ELECTRONIC SYSTEM BY SI...
Publication number
20220062990
Publication date
Mar 3, 2022
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Céline FEAUTRIER
B22 - CASTING POWDER METALLURGY