Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295

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H05K1/0296

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power system and method for controlling power modules
- Patent number 12,225,657
- Issue date Feb 11, 2025
- Transportation IP Holdings, LLC
- Alvaro Jorge Mari Curbelo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
PCB arrangement and wiring structure of LED lamp beads
- Patent number 12,219,713
- Issue date Feb 4, 2025
- Shenzhen HSG Electronics Co., LTD
- Wei Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board, COF module, and electronic device comprisin...
- Patent number 12,219,699
- Issue date Feb 4, 2025
- LG Innotek Co., Ltd
- Seung Soo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic extension module for electric pump
- Patent number 12,212,041
- Issue date Jan 28, 2025
- Wilo SE
- Stephan Karns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,213,247
- Issue date Jan 28, 2025
- Advanced Semiconductor Engineering, Inc.
- Jung Jui Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate
- Patent number 12,211,797
- Issue date Jan 28, 2025
- Japan Display Inc.
- Takumi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable circuit board
- Patent number 12,207,397
- Issue date Jan 21, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Fukao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device carrier structures including polymer layers as ba...
- Patent number 12,207,398
- Issue date Jan 21, 2025
- Georgia Tech Research Corporation
- Omkar Gupte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure, display substrate and display device
- Patent number 12,193,154
- Issue date Jan 7, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Zhifeng Zhan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrically conductive film
- Patent number 12,177,967
- Issue date Dec 24, 2024
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bushing
- Patent number 12,159,732
- Issue date Dec 3, 2024
- Schneider Electric Industries SAS
- Michael Karstens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and print head
- Patent number 12,160,951
- Issue date Dec 3, 2024
- Canon Kabushiki Kaisha
- Takuma Kodoi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Isolator
- Patent number 12,142,411
- Issue date Nov 12, 2024
- Kabushiki Kaisha Toshiba
- Ryohei Nega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layout structure and method for fabricating same
- Patent number 12,113,531
- Issue date Oct 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yingdong Guo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit board and probe card
- Patent number 12,114,423
- Issue date Oct 8, 2024
- Kyocera Corporation
- Youichiro Honda
- G01 - MEASURING TESTING
Information Patent Grant
Module and manufacturing method of the same
- Patent number 12,108,526
- Issue date Oct 1, 2024
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly and semi-finished product thereof, floodligh...
- Patent number 12,101,877
- Issue date Sep 24, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhen Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Massage roller and conductive structure thereof
- Patent number 12,090,108
- Issue date Sep 17, 2024
- Xiamen High Top Electronic Technology Co., Ltd.
- Liangsan Zhao
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Substrate module or light emitting module
- Patent number 12,096,560
- Issue date Sep 17, 2024
- Nichia Corporation
- Kazuma Kozuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,089,325
- Issue date Sep 10, 2024
- LG Innotek Co., Ltd
- Jae Hwa Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure sensing system and seat cushion having the pressure sensin...
- Patent number 12,083,989
- Issue date Sep 10, 2024
- Magna Seating Inc
- Bruno Carraro
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Pre-plating of solder layer on solderable elements for diffusion so...
- Patent number 12,069,802
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,063,737
- Issue date Aug 13, 2024
- LG Innotek Co., Ltd
- Hae Sik Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flexible wiring board, manufacturing method, electronic module, ele...
- Patent number 12,048,093
- Issue date Jul 23, 2024
- Canon Kabushiki Kaisha
- Toshiyuki Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,048,095
- Issue date Jul 23, 2024
- LG Innotek Co., Ltd
- Min Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system
- Patent number 12,041,719
- Issue date Jul 16, 2024
- Kioxia Corporation
- Gen Watari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 12,028,970
- Issue date Jul 2, 2024
- Kyocera Corporation
- Seiichirou Itou
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
MEMBRANE CIRCUIT BOARD
- Publication number 20250063655
- Publication date Feb 20, 2025
- Primax Electronics Ltd.
- Lei-Lung Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250040042
- Publication date Jan 30, 2025
- LG Innotek Co., Ltd.
- Hae Sik KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND FUNCTIONAL BACKP...
- Publication number 20250040049
- Publication date Jan 30, 2025
- BOE MLED TECHNOLOGY CO., LTD.
- Chao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20250029772
- Publication date Jan 23, 2025
- Kabushiki Kaisha Toshiba
- Ryohei NEGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20250024602
- Publication date Jan 16, 2025
- Amphenol Corporation
- Marc B. Cartier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
- Publication number 20250016916
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD FOR MANUFACT...
- Publication number 20250016922
- Publication date Jan 9, 2025
- OLYMPUS MEDICAL SYSTEMS CORP.
- Toshiyuki SHIMIZU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD, DISPLAY DEVICE COMPRISING THE PRINTED CIRCUI...
- Publication number 20250008642
- Publication date Jan 2, 2025
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunhua WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED ELECTRODE AND CABLE STRUCTURE
- Publication number 20250008643
- Publication date Jan 2, 2025
- Board of Regents, The University of Texas System
- Negar Geramifard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Display Panel and Display Device
- Publication number 20250008657
- Publication date Jan 2, 2025
- Mianyang HKC Optoelectronics Technology Co., Ltd.
- Rong TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE MODULE OR LIGHT EMITTING MODULE
- Publication number 20240414846
- Publication date Dec 12, 2024
- Nichia Corporation.
- Kazuma KOZURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240407084
- Publication date Dec 5, 2024
- HKC Corporation Limited
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate and Electronic Apparatus
- Publication number 20240407087
- Publication date Dec 5, 2024
- Hefei BOE Ruisheng Technology Co., Ltd.
- Hai Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS INCLUDING SELECTABLE CIRCUIT PLACEMENT MECHANISM AND METH...
- Publication number 20240404995
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD THEREOF, AND BATTERY PACK PROVID...
- Publication number 20240405345
- Publication date Dec 5, 2024
- Panasonic Energy Co.,Ltd.
- FUMIYA MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407085
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yosuke FUKAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407086
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yukie TSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD UNIT AND IMAGE FORMING APPARATUS
- Publication number 20240397615
- Publication date Nov 28, 2024
- Canon Kabushiki Kaisha
- MASAHIRO SHINOTSUKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSIN...
- Publication number 20240391415
- Publication date Nov 28, 2024
- Magna Seating Inc.
- Bruno Carraro
- B60 - VEHICLES IN GENERAL
Information Patent Application
PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSIN...
- Publication number 20240391416
- Publication date Nov 28, 2024
- Magna Sealing Inc.
- Bruno D. Carraro
- B60 - VEHICLES IN GENERAL
Information Patent Application
DISPLAY CARD MODULE AND ELECTRONIC DEVICE
- Publication number 20240377866
- Publication date Nov 14, 2024
- ASUS GLOBAL PTE. LTD.
- Jingwen Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240381527
- Publication date Nov 14, 2024
- LG Innotek Co., Ltd.
- Jae Hwa KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD
- Publication number 20240381526
- Publication date Nov 14, 2024
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20240373548
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LUBRICANT DISPENSER
- Publication number 20240353059
- Publication date Oct 24, 2024
- perma-tec GmbH & Co. KG
- Ralf ENGELHARDT
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
CURRENT SENSOR
- Publication number 20240345139
- Publication date Oct 17, 2024
- YAZAKI CORPORATION
- Yasunori KAWAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240339413
- Publication date Oct 10, 2024
- LG Innotek Co., Ltd.
- Myung Jae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240334596
- Publication date Oct 3, 2024
- TDK Corporation
- Mikihiro KUMON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRON...
- Publication number 20240306302
- Publication date Sep 12, 2024
- KYOCERA CORPORATION
- Takayuki SHIRASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20240304450
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS

Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and method of fabricating the same

Power system and method for controlling power modules

PCB arrangement and wiring structure of LED lamp beads

Flexible circuit board, COF module, and electronic device comprisin...

Electronic extension module for electric pump

Electronic device

Flexible substrate

Stretchable circuit board

Electronic device carrier structures including polymer layers as ba...

Wiring structure, display substrate and display device

Electrically conductive film

Bushing

Flexible printed circuit board and print head

Isolator

Patterned article including electrically conductive elements

Layout structure and method for fabricating same

Circuit board and probe card

Module and manufacturing method of the same

Circuit board assembly and semi-finished product thereof, floodligh...

Massage roller and conductive structure thereof

Substrate module or light emitting module

Printed circuit board

Pressure sensing system and seat cushion having the pressure sensin...

Pre-plating of solder layer on solderable elements for diffusion so...

Circuit board

Flexible wiring board, manufacturing method, electronic module, ele...

Circuit board

Patterned conductive article

Memory system

Wiring board, electronic device, and electronic module

Patents Applicationslast 30 patents

MEMBRANE CIRCUIT BOARD

CIRCUIT BOARD

WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND FUNCTIONAL BACKP...

ISOLATOR

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS

WIRING BOARD, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD FOR MANUFACT...

PRINTED CIRCUIT BOARD, DISPLAY DEVICE COMPRISING THE PRINTED CIRCUI...

INTEGRATED ELECTRODE AND CABLE STRUCTURE

Display Panel and Display Device

SUBSTRATE MODULE OR LIGHT EMITTING MODULE

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

Substrate and Electronic Apparatus

APPARATUS INCLUDING SELECTABLE CIRCUIT PLACEMENT MECHANISM AND METH...

WIRING BOARD, MANUFACTURING METHOD THEREOF, AND BATTERY PACK PROVID...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

CIRCUIT BOARD UNIT AND IMAGE FORMING APPARATUS

PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSIN...

PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSIN...

DISPLAY CARD MODULE AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

LUBRICANT DISPENSER

CURRENT SENSOR

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

CIRCUIT BOARD

WIRING BOARD, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRON...

ELECTRONIC PACKAGE STRUCTURE