Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295

Industry

CPC
H05K1/0296

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Lighting device with connection to element electrodes using filler
- Patent number 12,302,494
- Issue date May 13, 2025
- Nichia Corporation
- Eiko Minato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having sealing structure
- Patent number 12,298,628
- Issue date May 13, 2025
- Innolux Corporation
- Fiona Jhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board
- Patent number 12,284,757
- Issue date Apr 22, 2025
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate
- Patent number 12,284,754
- Issue date Apr 22, 2025
- Japan Display Inc.
- Yasushi Kawata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board and method of manufacturing the same
- Patent number 12,267,952
- Issue date Apr 1, 2025
- Sumitomo Electric Industries, Ltd.
- Maki Ikebe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including an insulating layer and a metal post
- Patent number 12,262,467
- Issue date Mar 25, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Tae Hong Min
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board including a buffer layer for improving
- Patent number 12,256,489
- Issue date Mar 18, 2025
- LG Innotek Co., Ltd
- Yong Suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for fabricating 3D multielectrode arrays with 3...
- Patent number 12,245,369
- Issue date Mar 4, 2025
- University of Oregon
- Timothy Gardner
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Wiring circuit board
- Patent number 12,238,859
- Issue date Feb 25, 2025
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 12,238,857
- Issue date Feb 25, 2025
- Denso Corporation
- Tsuyoshi Tashima
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wiring circuit board
- Patent number 12,238,858
- Issue date Feb 25, 2025
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, display device comprising the printed circui...
- Patent number 12,238,860
- Issue date Feb 25, 2025
- Beijing Boe Display Technology Co., Ltd.
- Chunhua Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power system and method for controlling power modules
- Patent number 12,225,657
- Issue date Feb 11, 2025
- Transportation IP Holdings, LLC
- Alvaro Jorge Mari Curbelo
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
PCB arrangement and wiring structure of LED lamp beads
- Patent number 12,219,713
- Issue date Feb 4, 2025
- Shenzhen HSG Electronics Co., LTD
- Wei Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board, COF module, and electronic device comprisin...
- Patent number 12,219,699
- Issue date Feb 4, 2025
- LG Innotek Co., Ltd
- Seung Soo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic extension module for electric pump
- Patent number 12,212,041
- Issue date Jan 28, 2025
- Wilo SE
- Stephan Karns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,213,247
- Issue date Jan 28, 2025
- Advanced Semiconductor Engineering, Inc.
- Jung Jui Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate
- Patent number 12,211,797
- Issue date Jan 28, 2025
- Japan Display Inc.
- Takumi Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable circuit board
- Patent number 12,207,397
- Issue date Jan 21, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Fukao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device carrier structures including polymer layers as ba...
- Patent number 12,207,398
- Issue date Jan 21, 2025
- Georgia Tech Research Corporation
- Omkar Gupte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure, display substrate and display device
- Patent number 12,193,154
- Issue date Jan 7, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Zhifeng Zhan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrically conductive film
- Patent number 12,177,967
- Issue date Dec 24, 2024
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bushing
- Patent number 12,159,732
- Issue date Dec 3, 2024
- Schneider Electric Industries SAS
- Michael Karstens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and print head
- Patent number 12,160,951
- Issue date Dec 3, 2024
- Canon Kabushiki Kaisha
- Takuma Kodoi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Isolator
- Patent number 12,142,411
- Issue date Nov 12, 2024
- Kabushiki Kaisha Toshiba
- Ryohei Nega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layout structure and method for fabricating same
- Patent number 12,113,531
- Issue date Oct 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yingdong Guo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit board and probe card
- Patent number 12,114,423
- Issue date Oct 8, 2024
- Kyocera Corporation
- Youichiro Honda
- G01 - MEASURING TESTING
Information Patent Grant
Module and manufacturing method of the same
- Patent number 12,108,526
- Issue date Oct 1, 2024
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20250159815
- Publication date May 15, 2025
- Resonac Corporation
- Masashi OHKOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SUBSTRATE
- Publication number 20250151192
- Publication date May 8, 2025
- Japan Display Inc.
- Takumi SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE PRODUCTION METHOD, WIRING SUBSTRATE, RETICLE, AND...
- Publication number 20250142731
- Publication date May 1, 2025
- Resonac Corporation
- Kei TOGASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WEARABLE ELECTRONIC DEVICE
- Publication number 20250130533
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hansol KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250126705
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Eun Su KWON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POL INTEGRATED POWER SUPPLY MODULE AND PRODUCTION PROCESS
- Publication number 20250106990
- Publication date Mar 27, 2025
- SHANGHAI METAPWR ELECTRONICS CO., LTD
- Yahong Xiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250081332
- Publication date Mar 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Joo Yul Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250081334
- Publication date Mar 6, 2025
- IBIDEN CO., LTD.
- Katsuyuki SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250081333
- Publication date Mar 6, 2025
- Innolux Corporation
- Chin-Lung Ting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250081335
- Publication date Mar 6, 2025
- Industrial Technology Research Institute
- Yi-Rong Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20250071892
- Publication date Feb 27, 2025
- Sumitomo Electric Industries, Ltd.
- Kenji TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBRANE CIRCUIT BOARD
- Publication number 20250063655
- Publication date Feb 20, 2025
- Primax Electronics Ltd.
- Lei-Lung Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250040042
- Publication date Jan 30, 2025
- LG Innotek Co., Ltd.
- Hae Sik KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND FUNCTIONAL BACKP...
- Publication number 20250040049
- Publication date Jan 30, 2025
- BOE MLED TECHNOLOGY CO., LTD.
- Chao LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATOR
- Publication number 20250029772
- Publication date Jan 23, 2025
- Kabushiki Kaisha Toshiba
- Ryohei NEGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20250024602
- Publication date Jan 16, 2025
- Amphenol Corporation
- Marc B. Cartier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS
- Publication number 20250016916
- Publication date Jan 9, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD FOR MANUFACT...
- Publication number 20250016922
- Publication date Jan 9, 2025
- OLYMPUS MEDICAL SYSTEMS CORP.
- Toshiyuki SHIMIZU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD, DISPLAY DEVICE COMPRISING THE PRINTED CIRCUI...
- Publication number 20250008642
- Publication date Jan 2, 2025
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunhua WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED ELECTRODE AND CABLE STRUCTURE
- Publication number 20250008643
- Publication date Jan 2, 2025
- Board of Regents, The University of Texas System
- Negar Geramifard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Display Panel and Display Device
- Publication number 20250008657
- Publication date Jan 2, 2025
- Mianyang HKC Optoelectronics Technology Co., Ltd.
- Rong TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE MODULE OR LIGHT EMITTING MODULE
- Publication number 20240414846
- Publication date Dec 12, 2024
- Nichia Corporation.
- Kazuma KOZURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING SELECTABLE CIRCUIT PLACEMENT MECHANISM AND METH...
- Publication number 20240404995
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD THEREOF, AND BATTERY PACK PROVID...
- Publication number 20240405345
- Publication date Dec 5, 2024
- Panasonic Energy Co.,Ltd.
- FUMIYA MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240407084
- Publication date Dec 5, 2024
- HKC Corporation Limited
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate and Electronic Apparatus
- Publication number 20240407087
- Publication date Dec 5, 2024
- Hefei BOE Ruisheng Technology Co., Ltd.
- Hai Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407085
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yosuke FUKAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407086
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yukie TSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSIN...
- Publication number 20240391415
- Publication date Nov 28, 2024
- Magna Seating Inc.
- Bruno Carraro
- B60 - VEHICLES IN GENERAL
Information Patent Application
PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSIN...
- Publication number 20240391416
- Publication date Nov 28, 2024
- Magna Sealing Inc.
- Bruno D. Carraro
- B60 - VEHICLES IN GENERAL

Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lighting device with connection to element electrodes using filler

Electronic device having sealing structure

Wiring circuit board

Flexible substrate

Flexible printed wiring board and method of manufacturing the same

Printed circuit board including an insulating layer and a metal post

Circuit board including a buffer layer for improving

Methods and systems for fabricating 3D multielectrode arrays with 3...

Wiring circuit board

Electronic control device

Wiring circuit board

Printed circuit board, display device comprising the printed circui...

Printed circuit board and method of fabricating the same

Power system and method for controlling power modules

PCB arrangement and wiring structure of LED lamp beads

Flexible circuit board, COF module, and electronic device comprisin...

Electronic extension module for electric pump

Electronic device

Flexible substrate

Stretchable circuit board

Electronic device carrier structures including polymer layers as ba...

Wiring structure, display substrate and display device

Electrically conductive film

Bushing

Flexible printed circuit board and print head

Isolator

Patterned article including electrically conductive elements

Layout structure and method for fabricating same

Circuit board and probe card

Module and manufacturing method of the same

Patents Applicationslast 30 patents

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

FLEXIBLE SUBSTRATE

WIRING SUBSTRATE PRODUCTION METHOD, WIRING SUBSTRATE, RETICLE, AND...

WEARABLE ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

POL INTEGRATED POWER SUPPLY MODULE AND PRODUCTION PROCESS

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

PRINTED WIRING BOARD

MEMBRANE CIRCUIT BOARD

CIRCUIT BOARD

WIRING BOARD AND MANUFACTURING METHOD THEREOF, AND FUNCTIONAL BACKP...

ISOLATOR

MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR

PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS

WIRING BOARD, IMAGE PICKUP UNIT, ENDOSCOPE, AND METHOD FOR MANUFACT...

PRINTED CIRCUIT BOARD, DISPLAY DEVICE COMPRISING THE PRINTED CIRCUI...

INTEGRATED ELECTRODE AND CABLE STRUCTURE

Display Panel and Display Device

SUBSTRATE MODULE OR LIGHT EMITTING MODULE

APPARATUS INCLUDING SELECTABLE CIRCUIT PLACEMENT MECHANISM AND METH...

WIRING BOARD, MANUFACTURING METHOD THEREOF, AND BATTERY PACK PROVID...

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

Substrate and Electronic Apparatus

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSIN...

PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSIN...