Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295

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H05K1/0296

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bushing
- Patent number 12,159,732
- Issue date Dec 3, 2024
- Schneider Electric Industries SAS
- Michael Karstens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and print head
- Patent number 12,160,951
- Issue date Dec 3, 2024
- Canon Kabushiki Kaisha
- Takuma Kodoi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Isolator
- Patent number 12,142,411
- Issue date Nov 12, 2024
- Kabushiki Kaisha Toshiba
- Ryohei Nega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned article including electrically conductive elements
- Patent number 12,133,327
- Issue date Oct 29, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layout structure and method for fabricating same
- Patent number 12,113,531
- Issue date Oct 8, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yingdong Guo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit board and probe card
- Patent number 12,114,423
- Issue date Oct 8, 2024
- Kyocera Corporation
- Youichiro Honda
- G01 - MEASURING TESTING
Information Patent Grant
Module and manufacturing method of the same
- Patent number 12,108,526
- Issue date Oct 1, 2024
- Japan Aviation Electronics Industry, Limited
- Junya Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly and semi-finished product thereof, floodligh...
- Patent number 12,101,877
- Issue date Sep 24, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhen Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Massage roller and conductive structure thereof
- Patent number 12,090,108
- Issue date Sep 17, 2024
- Xiamen High Top Electronic Technology Co., Ltd.
- Liangsan Zhao
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Substrate module or light emitting module
- Patent number 12,096,560
- Issue date Sep 17, 2024
- Nichia Corporation
- Kazuma Kozuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,089,325
- Issue date Sep 10, 2024
- LG Innotek Co., Ltd
- Jae Hwa Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure sensing system and seat cushion having the pressure sensin...
- Patent number 12,083,989
- Issue date Sep 10, 2024
- Magna Seating Inc
- Bruno Carraro
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Pre-plating of solder layer on solderable elements for diffusion so...
- Patent number 12,069,802
- Issue date Aug 20, 2024
- Infineon Technologies AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,063,737
- Issue date Aug 13, 2024
- LG Innotek Co., Ltd
- Hae Sik Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Flexible wiring board, manufacturing method, electronic module, ele...
- Patent number 12,048,093
- Issue date Jul 23, 2024
- Canon Kabushiki Kaisha
- Toshiyuki Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,048,095
- Issue date Jul 23, 2024
- LG Innotek Co., Ltd
- Min Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned conductive article
- Patent number 12,048,092
- Issue date Jul 23, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system
- Patent number 12,041,719
- Issue date Jul 16, 2024
- Kioxia Corporation
- Gen Watari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 12,028,970
- Issue date Jul 2, 2024
- Kyocera Corporation
- Seiichirou Itou
- G01 - MEASURING TESTING
Information Patent Grant
Rearview assembly having capacitive touch zone
- Patent number 12,017,586
- Issue date Jun 25, 2024
- Gentex Corporation
- Joseph P. Brigham
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,022,621
- Issue date Jun 25, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Jeong Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with a conductive bump mounted on an adhesive layer
- Patent number 12,016,133
- Issue date Jun 18, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extensible and contractible mounting board
- Patent number 12,016,117
- Issue date Jun 18, 2024
- Murata Manufacturing Co., Ltd.
- Takahito Tomoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible interconnect circuits and methods of fabrication thereof
- Patent number 12,010,792
- Issue date Jun 11, 2024
- CelLink Corporation
- Jean-Paul Ortiz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystal polymer embedded microelectronics device
- Patent number 11,997,786
- Issue date May 28, 2024
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and electronic device
- Patent number 11,991,821
- Issue date May 21, 2024
- Kioxia Corporation
- Yuta Tsubouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 11,979,981
- Issue date May 7, 2024
- Kyocera Corporation
- Takayuki Umemoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Security element, electronic card, electronic payment terminal, cor...
- Patent number 11,974,395
- Issue date Apr 30, 2024
- BANKS AND ACQUIRERS INTERNATIONAL HOLDING
- Stéphane Pavageau
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible printed circuit board, COF module, and electronic device c...
- Patent number 11,968,779
- Issue date Apr 23, 2024
- LG Innotek Co., Ltd
- Ki Tae Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having sealing structure
- Patent number 11,947,222
- Issue date Apr 2, 2024
- Innolux Corporation
- Fiona Jhan
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE MODULE OR LIGHT EMITTING MODULE
- Publication number 20240414846
- Publication date Dec 12, 2024
- Nichia Corporation.
- Kazuma KOZURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING SELECTABLE CIRCUIT PLACEMENT MECHANISM AND METH...
- Publication number 20240404995
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD THEREOF, AND BATTERY PACK PROVID...
- Publication number 20240405345
- Publication date Dec 5, 2024
- Panasonic Energy Co.,Ltd.
- FUMIYA MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240407084
- Publication date Dec 5, 2024
- HKC Corporation Limited
- Yao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate and Electronic Apparatus
- Publication number 20240407087
- Publication date Dec 5, 2024
- Hefei BOE Ruisheng Technology Co., Ltd.
- Hai Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407085
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yosuke FUKAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240407086
- Publication date Dec 5, 2024
- Sumitomo Electric Industries, Ltd.
- Yukie TSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSIN...
- Publication number 20240391415
- Publication date Nov 28, 2024
- Magna Seating Inc.
- Bruno Carraro
- B60 - VEHICLES IN GENERAL
Information Patent Application
PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSIN...
- Publication number 20240391416
- Publication date Nov 28, 2024
- Magna Sealing Inc.
- Bruno D. Carraro
- B60 - VEHICLES IN GENERAL
Information Patent Application
CIRCUIT BOARD UNIT AND IMAGE FORMING APPARATUS
- Publication number 20240397615
- Publication date Nov 28, 2024
- Canon Kabushiki Kaisha
- MASAHIRO SHINOTSUKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY CARD MODULE AND ELECTRONIC DEVICE
- Publication number 20240377866
- Publication date Nov 14, 2024
- ASUS GLOBAL PTE. LTD.
- Jingwen Yao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240381527
- Publication date Nov 14, 2024
- LG Innotek Co., Ltd.
- Jae Hwa KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD
- Publication number 20240381526
- Publication date Nov 14, 2024
- Cisco Technology, Inc.
- Shadi Ebrahimi Asl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...
- Publication number 20240373548
- Publication date Nov 7, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LUBRICANT DISPENSER
- Publication number 20240353059
- Publication date Oct 24, 2024
- perma-tec GmbH & Co. KG
- Ralf ENGELHARDT
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
CURRENT SENSOR
- Publication number 20240345139
- Publication date Oct 17, 2024
- YAZAKI CORPORATION
- Yasunori KAWAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME
- Publication number 20240339413
- Publication date Oct 10, 2024
- LG Innotek Co., Ltd.
- Myung Jae KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240334596
- Publication date Oct 3, 2024
- TDK Corporation
- Mikihiro KUMON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRON...
- Publication number 20240306302
- Publication date Sep 12, 2024
- KYOCERA CORPORATION
- Takayuki SHIRASAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20240304450
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CONDUCTIVE ARTICLE
- Publication number 20240306290
- Publication date Sep 12, 2024
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible printed circuit
- Publication number 20240292526
- Publication date Aug 29, 2024
- AAC MICROTECH (CHANGZHOU) CO., LTD.
- Zhigao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Interconnect Circuits And Methods Of Fabrication Thereof
- Publication number 20240292527
- Publication date Aug 29, 2024
- CelLink Corporation
- Jean-Paul Ortiz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240292528
- Publication date Aug 29, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MODULE, AND IMAGE DISPLAY APPARATUS
- Publication number 20240258690
- Publication date Aug 1, 2024
- DAI NIPPON PRINTING CO., LTD.
- Keita IIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20240251503
- Publication date Jul 25, 2024
- Shenzhen Jufei Optoelectronics Co., Ltd.
- Mingquan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240244742
- Publication date Jul 18, 2024
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240237200
- Publication date Jul 11, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240237201
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET
- Publication number 20240215155
- Publication date Jun 27, 2024
- Nitto Denko Corporation
- Makoto TSUNEKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bushing

Flexible printed circuit board and print head

Isolator

Patterned article including electrically conductive elements

Layout structure and method for fabricating same

Circuit board and probe card

Module and manufacturing method of the same

Circuit board assembly and semi-finished product thereof, floodligh...

Massage roller and conductive structure thereof

Substrate module or light emitting module

Printed circuit board

Pressure sensing system and seat cushion having the pressure sensin...

Pre-plating of solder layer on solderable elements for diffusion so...

Circuit board

Flexible wiring board, manufacturing method, electronic module, ele...

Circuit board

Patterned conductive article

Memory system

Wiring board, electronic device, and electronic module

Rearview assembly having capacitive touch zone

Printed circuit board and method for manufacturing the same

Circuit board with a conductive bump mounted on an adhesive layer

Extensible and contractible mounting board

Flexible interconnect circuits and methods of fabrication thereof

Liquid crystal polymer embedded microelectronics device

Printed wiring board and electronic device

Wiring board

Security element, electronic card, electronic payment terminal, cor...

Flexible printed circuit board, COF module, and electronic device c...

Electronic device having sealing structure

Patents Applicationslast 30 patents

SUBSTRATE MODULE OR LIGHT EMITTING MODULE

APPARATUS INCLUDING SELECTABLE CIRCUIT PLACEMENT MECHANISM AND METH...

WIRING BOARD, MANUFACTURING METHOD THEREOF, AND BATTERY PACK PROVID...

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

Substrate and Electronic Apparatus

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSIN...

PRESSURE SENSING SYSTEM AND SEAT CUSHION HAVING THE PRESSURE SENSIN...

CIRCUIT BOARD UNIT AND IMAGE FORMING APPARATUS

DISPLAY CARD MODULE AND ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

TRACE ARRANGEMENT FOR PRINTED CIRCUIT BOARD

Pre-Plating of Solder Layer on Solderable Elements for Diffusion So...

LUBRICANT DISPENSER

CURRENT SENSOR

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE COMPRISING SAME

CIRCUIT BOARD

WIRING BOARD, PACKAGE FOR CONTAINING ELECTRONIC COMPONENT, ELECTRON...

ELECTRONIC PACKAGE STRUCTURE

PATTERNED CONDUCTIVE ARTICLE

Flexible printed circuit

Flexible Interconnect Circuits And Methods Of Fabrication Thereof

WIRING CIRCUIT BOARD

WIRING BOARD, MODULE, AND IMAGE DISPLAY APPARATUS

CIRCUIT BOARD AND ELECTRONIC DEVICE

WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEET

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET

PRINTED WIRING BOARD

ASSEMBLY SHEET AND METHOD FOR PRODUCING ASSEMBLY SHEET