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Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295

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  • H05K1/0296
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

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H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CONDUCTIVE FILM AND TEST COMPONENT
    • Publication number 20240130040
    • Publication date Apr 18, 2024
    • Innolux Corporation
    • Ker-Yih Kao
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
    • Publication number 20240114628
    • Publication date Apr 4, 2024
    • Nitto Denko Corporation
    • Kenta FUKUSHIMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR PRODUCING WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD
    • Publication number 20240107664
    • Publication date Mar 28, 2024
    • Nitto Denko Corporation
    • Kenta FUKUSHIMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT B...
    • Publication number 20240098889
    • Publication date Mar 21, 2024
    • Sumitomo Electric Industries, Ltd.
    • Hiroshi UEDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DISPLAY PANEL AND DISPLAY APPARATUS
    • Publication number 20240080973
    • Publication date Mar 7, 2024
    • Wuhan Tianma Micro-Electronics Co., Ltd.
    • Yangzhao MA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHODS OF REDUCING DEFECTS FROM PATTERN MISALIGNMENT
    • Publication number 20240080994
    • Publication date Mar 7, 2024
    • Samsung Electronics Co., Ltd.
    • Gun Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    IMPEDANCE MATCHED VIA CONNECTIONS IN A PRINTED CIRCUIT BOARD
    • Publication number 20240074054
    • Publication date Feb 29, 2024
    • The Phoenix Company of Chicago, Inc.
    • Salvatore J. Gullotta
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240063104
    • Publication date Feb 22, 2024
    • LG Innotek Co., Ltd.
    • Se Woong NA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240057251
    • Publication date Feb 15, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Tae Hong MIN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD, ELECTRIC MOTOR, AND METHOD OF MANUFACTURING...
    • Publication number 20240048013
    • Publication date Feb 8, 2024
    • Honda Motor Co., Ltd.
    • Daiki Suetsugu
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240040691
    • Publication date Feb 1, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Kwon Su YUN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20240040692
    • Publication date Feb 1, 2024
    • IBIDEN CO., LTD.
    • Kentaro WADA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD ASSEMBLY SHEET
    • Publication number 20240040705
    • Publication date Feb 1, 2024
    • Nitto Denko Corporation
    • Rihito FUKUSHIMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240032201
    • Publication date Jan 25, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Do Jae Yoo
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BASE MEMBER, ELECTRONIC DEVICE, AND STRUCTURE
    • Publication number 20240032190
    • Publication date Jan 25, 2024
    • Canon Kabushiki Kaisha
    • KOICHI ODAGAKI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240023239
    • Publication date Jan 18, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Jung Jui KANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240015883
    • Publication date Jan 11, 2024
    • Shinko Electric Industries Co., LTD.
    • Shuhei Momose
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VERTICAL INTERCONNECT DESIGN FOR IMPROVED ELECTRICAL PERFORMANCE
    • Publication number 20240008177
    • Publication date Jan 4, 2024
    • Intel Corporation
    • Jackson Chung Peng KONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20230422396
    • Publication date Dec 28, 2023
    • Sumitomo Electric Industries, Ltd.
    • Kenji TAKAHASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LAYOUT STRUCTURE AND METHOD FOR FABRICATING SAME
    • Publication number 20230421157
    • Publication date Dec 28, 2023
    • Changxin Memory Technologies, Inc.
    • Yingdong GUO
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    WIRING BOARD AND MODULE
    • Publication number 20230413439
    • Publication date Dec 21, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Issei YAMAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230413429
    • Publication date Dec 21, 2023
    • IBIDEN CO., LTD.
    • Atsushi DEGUCHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONDUCTIVE SHEET AND TOUCH PANEL
    • Publication number 20230409152
    • Publication date Dec 21, 2023
    • FUJIFILM CORPORATION
    • Hiroshige NAKAMURA
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SENSING PCB STRUCTURE OF BATTERY UNIT
    • Publication number 20230411714
    • Publication date Dec 21, 2023
    • Elentec., LTD
    • Seung Tae JUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230403789
    • Publication date Dec 14, 2023
    • IBIDEN CO., LTD.
    • Hiroki WAKAMORI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONDUCTIVE AQUEOUS INK COMPOSITION FOR FILLING IN ENGRAVED MICROPAT...
    • Publication number 20230399533
    • Publication date Dec 14, 2023
    • DAEDONG CO., LTD.
    • Seung Taeg LEE
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20230380058
    • Publication date Nov 23, 2023
    • Nitto Denko Corporation
    • Hideki MATSUI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE INTERCONNECT CIRCUITS AND METHODS OF FABRICATION THEREOF
    • Publication number 20230371174
    • Publication date Nov 16, 2023
    • CelLink Corporation
    • Jean-Paul Ortiz
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT APPARATUS
    • Publication number 20230356590
    • Publication date Nov 9, 2023
    • AUTONETWORKS TECHNOLOGIES, LTD.
    • Shinnosuke NAKAGUCHI
    • B60 - VEHICLES IN GENERAL
  • Information Patent Application

    POWER MODULE
    • Publication number 20230337357
    • Publication date Oct 19, 2023
    • Rohm Co., Ltd.
    • Akihiro KOGA
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER