Conductor crossing over a hole in the substrate

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CPC
H05K2201/0394

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0394Conductor crossing over a hole in the substrate

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Image forming apparatus including a printed circuit board connectab...
- Patent number 12,085,868
- Issue date Sep 10, 2024
- Canon Kabushiki Kaisha
- Shinsuke Serizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 11,956,896
- Issue date Apr 9, 2024
- Ibiden Co., Ltd.
- Tomohiko Murata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,665,833
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,224,125
- Issue date Jan 11, 2022
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 11,212,922
- Issue date Dec 28, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting unit with data lines and line ends thereof for a vehicle a...
- Patent number 11,148,590
- Issue date Oct 19, 2021
- Bayerische Motoren Werke Aktiengesellschaft
- Florian Altinger
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for reduction of interfacial stress accumulation between dou...
- Patent number 10,923,621
- Issue date Feb 16, 2021
- NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
- Chun-Te Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 10,887,986
- Issue date Jan 5, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi-Sun Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 10,660,201
- Issue date May 19, 2020
- DexCom, Inc.
- Sean Frick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Archimedean spiral design for deformable electronics
- Patent number 10,660,200
- Issue date May 19, 2020
- Arizona Board of Regents on behalf of Arizona State University
- Hanqing Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a connection support, connection support and op...
- Patent number 10,468,569
- Issue date Nov 5, 2019
- Osram Opto Semiconductor GmbH
- Jörg Erich Sorg
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed board and image forming apparatus
- Patent number 10,342,123
- Issue date Jul 2, 2019
- Canon Kabushiki Kaisha
- Shinsuke Serizawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Conformal electronics including nested serpentine interconnects
- Patent number 10,334,724
- Issue date Jun 25, 2019
- MC10, Inc.
- Yung-Yu Hsu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Apparatus and associated methods for deformable electronics
- Patent number 10,321,563
- Issue date Jun 11, 2019
- Nokia Technologies Oy
- Adam Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical interconnect
- Patent number 10,306,775
- Issue date May 28, 2019
- Xerox Corporation
- Chad David Freitag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a substrate core structure using microvia laser d...
- Patent number 10,306,760
- Issue date May 28, 2019
- Intel Corporation
- Yonggang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective deposition of thin film dielectrics using surface blockin...
- Patent number 10,219,373
- Issue date Feb 26, 2019
- Applied Materials, Inc.
- David Thompson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device having a single-sided printed circuit board
- Patent number 10,206,282
- Issue date Feb 12, 2019
- Home Control Singapore Pte. Ltd.
- Eng Kim Teo
- G08 - SIGNALLING
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 10,080,279
- Issue date Sep 18, 2018
- Nitto Denko Corporation
- Tomoaki Okuno
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit board secured to battery cell using a circuit board through...
- Patent number 10,034,373
- Issue date Jul 24, 2018
- Apple Inc.
- Charles W. Werley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, and lighting device and backlight unit inclu...
- Patent number 9,874,335
- Issue date Jan 23, 2018
- LG Innotek Co., Ltd
- Seung Kwon Hong
- G02 - OPTICS
Information Patent Grant
Printed board and image forming apparatus
- Patent number 9,844,132
- Issue date Dec 12, 2017
- Canon Kabushiki Kaisha
- Shinsuke Serizawa
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electronic device embedded substrate and manufacturing method thereof
- Patent number 9,743,525
- Issue date Aug 22, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Bong-Soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal electronics including nested serpentine interconnects
- Patent number 9,706,647
- Issue date Jul 11, 2017
- MC10, Inc.
- Yung-Yu Hsu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of forming a substrate core structure using microvia laser d...
- Patent number 9,648,733
- Issue date May 9, 2017
- Intel Corporation
- Yonggang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and image forming apparatus
- Patent number 9,606,496
- Issue date Mar 28, 2017
- Canon Kabushiki Kaisha
- Satoshi Ogawara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for producing a printed circuit, printed circuit obtained by...
- Patent number 9,583,459
- Issue date Feb 28, 2017
- Linxens Holding
- Severine Dieu-Gomont
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Suspension board with circuit
- Patent number 9,572,259
- Issue date Feb 14, 2017
- Nitto Denko Corporation
- Naohiro Terada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
IMAGE FORMING APPARATUS
- Publication number 20240369951
- Publication date Nov 7, 2024
- Canon Kabushiki Kaisha
- SHINSUKE SERIZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICULAR WIRING BOARD
- Publication number 20240365466
- Publication date Oct 31, 2024
- YAZAKI CORPORATION
- Hideaki Kikuchi
- B60 - VEHICLES IN GENERAL
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240196531
- Publication date Jun 13, 2024
- Dexcom, Inc.
- Sean Frick
- G01 - MEASURING TESTING
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20220287175
- Publication date Sep 8, 2022
- IBIDEN CO., LTD.
- Tomohiko MURATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20220078922
- Publication date Mar 10, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MING-JAAN HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20210235590
- Publication date Jul 29, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MING-JAAN HO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200178390
- Publication date Jun 4, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Mi-Sun HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Selective Deposition of Thin Film Dielectrics Using Surface Blockin...
- Publication number 20180199432
- Publication date Jul 12, 2018
- Applied Materials, Inc.
- David Thompson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL ELECTRONICS INCLUDING NESTED SERPENTINE INTERCONNECTS
- Publication number 20180092205
- Publication date Mar 29, 2018
- MC10, Inc.
- YUNG-YU HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD SECURED TO BATTERY CELL USING A CIRCUIT BOARD THROUGH...
- Publication number 20180063955
- Publication date Mar 1, 2018
- Apple Inc.
- Charles W. WERLEY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED BOARD AND IMAGE FORMING APPARATUS
- Publication number 20180049317
- Publication date Feb 15, 2018
- Canon Kabushiki Kaisha
- Shinsuke Serizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND ASSOCIATED METHODS FOR DEFORMABLE ELECTRONICS
- Publication number 20170257944
- Publication date Sep 7, 2017
- Nokia Technologies Oy
- Adam ROBINSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SUBSTRATE CORE STRUCTURE USING MICROVIA LASER D...
- Publication number 20170231092
- Publication date Aug 10, 2017
- Intel Corporation
- Yonggang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device Having A Single-Sided Printed Circuit Board
- Publication number 20170215283
- Publication date Jul 27, 2017
- Home Control Singapore Pte. Ltd.
- Eng Kim Teo
- G08 - SIGNALLING
Information Patent Application
METHOD FOR FORMING A VIA STRUCTURE USING A DOUBLE-SIDE LASER PROCESS
- Publication number 20150257281
- Publication date Sep 10, 2015
- Marvell World Trade Ltd.
- Huahung Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRED CIRCUIT BOARD
- Publication number 20140353007
- Publication date Dec 4, 2014
- Nitto Denko Corporation
- Kouji ICHINOSE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically Insulating Elements And Electrically Conductive Elemen...
- Publication number 20140321032
- Publication date Oct 30, 2014
- Nathan S. Lazarus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE FOR SUSPENSION, AND PRODUCTION PROCESS THEREOF
- Publication number 20140246224
- Publication date Sep 4, 2014
- DAI NIPPON PRINTING CO., LTD.
- Yoichi MIURA
- G11 - INFORMATION STORAGE
Information Patent Application
RECHARGEABLE BATTERY PACK
- Publication number 20140205864
- Publication date Jul 24, 2014
- Samsung SDI Co., Ltd.
- Sang-Il Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION DEVICE FOR ELECTRONIC CIRCUITS, NOTABLY MICROWAVE E...
- Publication number 20140179127
- Publication date Jun 26, 2014
- THALES
- Stéphane DENIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD, AND LIGHTING DEVICE AND BACKLIGHT UNIT INCLU...
- Publication number 20140153221
- Publication date Jun 5, 2014
- LG Innotek Co., Ltd.
- Seung Kwon HONG
- G02 - OPTICS
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20140144680
- Publication date May 29, 2014
- Nitto Denko Corporation
- Tomoaki OKUNO
- G11 - INFORMATION STORAGE
Information Patent Application
Component Mounting Structures with Breakaway Support Tabs
- Publication number 20140063769
- Publication date Mar 6, 2014
- Michael B. Wittenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT
- Publication number 20140029398
- Publication date Jan 30, 2014
- Nitto Denko Corporation
- Tetsuya Ohsawa
- G11 - INFORMATION STORAGE
Information Patent Application
CONNECTOR ASSEMBLY AND FEMALE CONNECTOR USED FOR THE SAME
- Publication number 20140017938
- Publication date Jan 16, 2014
- Hiroshi IWANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit for a Light Emitting Component and Method of Manufacturing...
- Publication number 20140011309
- Publication date Jan 9, 2014
- Francois Lechleiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Surface Mounted Device and Corresponding...
- Publication number 20130322034
- Publication date Dec 5, 2013
- Linxens Holding
- Francois Lechleiter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-SIDE-CONDUCTING FLEXIBLE-CIRCUIT FLAT CABLE WITH CLUSTER SEC...
- Publication number 20130277095
- Publication date Oct 24, 2013
- GWUN-JIN LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Deformable Apparatus and Method
- Publication number 20130256004
- Publication date Oct 3, 2013
- Nokia Corporation
- Darryl COTTON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A SUBSTRATE CORE STRUCTURE USING MICROVIA LASER D...
- Publication number 20130242498
- Publication date Sep 19, 2013
- Yonggang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Conductor crossing over a hole in the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Image forming apparatus including a printed circuit board connectab...

Printed wiring board

Sensor interposer employing castellated through-vias

Method for manufacturing an electronic module and electronic module

Circuit board and manufacturing method thereof

Sensor interposer employing castellated through-vias

Circuit board and manufacturing method thereof

Lighting unit with data lines and line ends thereof for a vehicle a...

Method for reduction of interfacial stress accumulation between dou...

Printed circuit board and method of manufacturing the same

Sensor interposer employing castellated through-vias

Archimedean spiral design for deformable electronics

Method of producing a connection support, connection support and op...

Printed board and image forming apparatus

Conformal electronics including nested serpentine interconnects

Apparatus and associated methods for deformable electronics

Method of forming an electrical interconnect

Method of forming a substrate core structure using microvia laser d...

Selective deposition of thin film dielectrics using surface blockin...

Device having a single-sided printed circuit board

Wired circuit board and producing method thereof

Circuit board secured to battery cell using a circuit board through...

Printed circuit board, and lighting device and backlight unit inclu...

Printed board and image forming apparatus

Electronic device embedded substrate and manufacturing method thereof

Conformal electronics including nested serpentine interconnects

Method of forming a substrate core structure using microvia laser d...

Printed circuit board and image forming apparatus

Method for producing a printed circuit, printed circuit obtained by...

Suspension board with circuit

Patents Applicationslast 30 patents

IMAGE FORMING APPARATUS

VEHICULAR WIRING BOARD

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

PRINTED WIRING BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Selective Deposition of Thin Film Dielectrics Using Surface Blockin...

CONFORMAL ELECTRONICS INCLUDING NESTED SERPENTINE INTERCONNECTS

CIRCUIT BOARD SECURED TO BATTERY CELL USING A CIRCUIT BOARD THROUGH...

PRINTED BOARD AND IMAGE FORMING APPARATUS

APPARATUS AND ASSOCIATED METHODS FOR DEFORMABLE ELECTRONICS

METHOD OF FORMING A SUBSTRATE CORE STRUCTURE USING MICROVIA LASER D...

Device Having A Single-Sided Printed Circuit Board

METHOD FOR FORMING A VIA STRUCTURE USING A DOUBLE-SIDE LASER PROCESS

WIRED CIRCUIT BOARD

Electrically Insulating Elements And Electrically Conductive Elemen...

SUBSTRATE FOR SUSPENSION, AND PRODUCTION PROCESS THEREOF

RECHARGEABLE BATTERY PACK

INTERCONNECTION DEVICE FOR ELECTRONIC CIRCUITS, NOTABLY MICROWAVE E...

PRINTED CIRCUIT BOARD, AND LIGHTING DEVICE AND BACKLIGHT UNIT INCLU...

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

Component Mounting Structures with Breakaway Support Tabs

SUSPENSION BOARD WITH CIRCUIT

CONNECTOR ASSEMBLY AND FEMALE CONNECTOR USED FOR THE SAME

Circuit for a Light Emitting Component and Method of Manufacturing...

Method of Manufacturing a Surface Mounted Device and Corresponding...

DOUBLE-SIDE-CONDUCTING FLEXIBLE-CIRCUIT FLAT CABLE WITH CLUSTER SEC...

Deformable Apparatus and Method

METHOD OF FORMING A SUBSTRATE CORE STRUCTURE USING MICROVIA LASER D...