Conductor-insulator-semiconductor capacitors

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H01L29/66181

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier

Current Industry

H01L29/66181Conductor-insulator-semiconductor capacitors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Chip parts
- Patent number 12,218,123
- Issue date Feb 4, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench pattern for trench capacitor yield improvement
- Patent number 12,205,982
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor film scheme to reduce substrate warpage
- Patent number 12,199,139
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET MOS capacitor
- Patent number 12,199,193
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor profile to decrease substrate warpage
- Patent number 12,176,387
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embeddable semiconductor-based capacitor
- Patent number 12,159,945
- Issue date Dec 3, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacitance MIM device with self aligned spacer
- Patent number 12,154,939
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor trench capacitor structure and manufacturing method t...
- Patent number 12,119,414
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,100,671
- Issue date Sep 24, 2024
- Murata Manufacturing Co., Ltd.
- Yohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, memory device, and method
- Patent number 12,101,926
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-oxide-semiconductor capacitor and circuit board including the...
- Patent number 12,080,809
- Issue date Sep 3, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including deep trench capacitors and via contacts
- Patent number 12,074,227
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor inside gate cut trench
- Patent number 12,057,387
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D capacitor and method of manufacturing same
- Patent number 12,040,379
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming monolithic surge protect...
- Patent number 12,015,051
- Issue date Jun 18, 2024
- MACOM Technology Solutions Holdings, Inc.
- James J. Brogle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor including a compact contact region and method...
- Patent number 12,009,405
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for semiconductor device
- Patent number 11,961,921
- Issue date Apr 16, 2024
- Lapis Semiconductor Co., Ltd.
- Hiroshi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for producing same
- Patent number 11,948,995
- Issue date Apr 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazushi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated filler capacitor cell device and corresponding manufactu...
- Patent number 11,935,828
- Issue date Mar 19, 2024
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making decoupling capacitor
- Patent number 11,901,463
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Lin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor assembly for high capacitance density
- Patent number 11,894,366
- Issue date Feb 6, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided stacked DTC structure
- Patent number 11,869,988
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,854,928
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for producing the same
- Patent number 11,854,890
- Issue date Dec 26, 2023
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Florian Krach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench pattern for trench capacitor yield improvement
- Patent number 11,855,133
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D capacitor and method of manufacturing same
- Patent number 11,837,646
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,830,909
- Issue date Nov 28, 2023
- Murata Manufacturing Co., Ltd.
- Tomoyuki Ashimine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-digitated capacitor in flash technology
- Patent number 11,832,448
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor trench capacitor structure and manufacturing method t...
- Patent number 11,817,510
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses including capacitors including multiple dielectric mate...
- Patent number 11,799,038
- Issue date Oct 24, 2023
- Lodestar Licensing Group LLC
- Michael A. Smith
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250056818
- Publication date Feb 13, 2025
- UNITED MICROELECTRONICS CORP.
- Chang-Yih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250048659
- Publication date Feb 6, 2025
- UNITED MICROELECTRONICS CORP.
- Chang-Yih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...
- Publication number 20250006665
- Publication date Jan 2, 2025
- Intel Corporation
- Gang Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED STACKED DTC STRUCTURE
- Publication number 20240395948
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET MOS CAPACITOR
- Publication number 20240395947
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING
- Publication number 20240387614
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR DEVICE WITH SELF ALIGNED SPACER
- Publication number 20240387613
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Sheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR, MEMORY DEVICE, AND METHOD
- Publication number 20240381621
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE FOR CONNECTED CAPACITANCES AND METHOD OF FORMING SAME
- Publication number 20240371879
- Publication date Nov 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Germain Bossu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS
- Publication number 20240372013
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20240372014
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- FU-CHIANG KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CAPACITOR AND METHOD OF MANUFACTURING SAME
- Publication number 20240347619
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240332395
- Publication date Oct 3, 2024
- GUANGZHOU CANSEMI TECHNOLOGY INC.
- Yohtz Julian CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES
- Publication number 20240332433
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Li Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A TRENCH CAPA...
- Publication number 20240322001
- Publication date Sep 26, 2024
- SK keyfoundry Inc.
- Jong Hyuk OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR INCLUDING A COMPACT CONTACT REGION AND METHOD...
- Publication number 20240304700
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELEMENT AND ELECTRONIC DEVICE
- Publication number 20240282866
- Publication date Aug 22, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kento KAWASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING CAPACITOR INSIDE BACKSIDE POWER DISTRIBUTION NETWORK POW...
- Publication number 20240203982
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT COMPRISING A CAPACITIVE TRANSISTOR
- Publication number 20240186318
- Publication date Jun 6, 2024
- STMicroelectronics (Rousset) SAS
- Christian RIVERO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FILLER CAPACITOR CELL DEVICE AND CORRESPONDING MANUFACTU...
- Publication number 20240186236
- Publication date Jun 6, 2024
- STMicroelectronics (Rousset) SAS
- Abderrezak Marzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...
- Publication number 20240170584
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-HSUAN TAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURAL ELEMENT WITH IMPROVED FERROELECTRIC POLARISATION SWITCHI...
- Publication number 20240145572
- Publication date May 2, 2024
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- David LEHNINGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR AND METHOD FOR FORMING THE SAME
- Publication number 20240147689
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED TRENCH CAPACITOR
- Publication number 20240113102
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Umamaheswari Aghoram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH PATTERN FOR TRENCH CAPACITOR YIELD IMPROVEMENT
- Publication number 20240088210
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-ELECTRON-MOBILITY TRANSISTOR
- Publication number 20240079405
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Santosh SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240055470
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Deep Trench Capacitor with Reduced Deforma...
- Publication number 20240047552
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING CAPACITORS INCLUDING MULTIPLE DIELECTRIC MATE...
- Publication number 20240038904
- Publication date Feb 1, 2024
- Lodestar Licensing Group LLC
- Michael A. Smith
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME
- Publication number 20240030359
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHU-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS

Conductor-insulator-semiconductor capacitors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip parts

Trench pattern for trench capacitor yield improvement

Trench capacitor film scheme to reduce substrate warpage

FinFET MOS capacitor

Trench capacitor profile to decrease substrate warpage

Embeddable semiconductor-based capacitor

High capacitance MIM device with self aligned spacer

Semiconductor trench capacitor structure and manufacturing method t...

Semiconductor device

Capacitor, memory device, and method

Metal-oxide-semiconductor capacitor and circuit board including the...

Semiconductor device including deep trench capacitors and via contacts

Decoupling capacitor inside gate cut trench

3D capacitor and method of manufacturing same

Semiconductor device and method of forming monolithic surge protect...

Deep trench capacitor including a compact contact region and method...

Semiconductor device and manufacturing method for semiconductor device

Capacitor and method for producing same

Integrated filler capacitor cell device and corresponding manufactu...

Method of making decoupling capacitor

Trench capacitor assembly for high capacitance density

Double-sided stacked DTC structure

Semiconductor package and manufacturing method thereof

Capacitor and method for producing the same

Trench pattern for trench capacitor yield improvement

3D capacitor and method of manufacturing same

Semiconductor device

Inter-digitated capacitor in flash technology

Semiconductor trench capacitor structure and manufacturing method t...

Apparatuses including capacitors including multiple dielectric mate...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHODS AND APPARATUS FOR STACKS OF GLASS LAYERS INCLUDING DEEP TRE...

DOUBLE-SIDED STACKED DTC STRUCTURE

FINFET MOS CAPACITOR

METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING

CAPACITOR DEVICE WITH SELF ALIGNED SPACER

CAPACITOR, MEMORY DEVICE, AND METHOD

IC STRUCTURE FOR CONNECTED CAPACITANCES AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE INCLUDING DEEP TRENCH CAPACITORS AND VIA CONTACTS

SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...

3D CAPACITOR AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING SAME

CAPACITOR EMBEDDING FOR FLIP CHIP PACKAGES

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A TRENCH CAPA...

DEEP TRENCH CAPACITOR INCLUDING A COMPACT CONTACT REGION AND METHOD...

PASSIVE ELEMENT AND ELECTRONIC DEVICE

DECOUPLING CAPACITOR INSIDE BACKSIDE POWER DISTRIBUTION NETWORK POW...

INTEGRATED CIRCUIT COMPRISING A CAPACITIVE TRANSISTOR

INTEGRATED FILLER CAPACITOR CELL DEVICE AND CORRESPONDING MANUFACTU...

SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...

STRUCTURAL ELEMENT WITH IMPROVED FERROELECTRIC POLARISATION SWITCHI...

DEEP TRENCH CAPACITOR AND METHOD FOR FORMING THE SAME

BURIED TRENCH CAPACITOR

TRENCH PATTERN FOR TRENCH CAPACITOR YIELD IMPROVEMENT

HIGH-ELECTRON-MOBILITY TRANSISTOR

DEEP TRENCH CAPACITOR STRUCTURE AND METHOD FOR FORMING THE SAME

Structure and Method for Deep Trench Capacitor with Reduced Deforma...

APPARATUSES INCLUDING CAPACITORS INCLUDING MULTIPLE DIELECTRIC MATE...

SEMICONDUCTOR DEVICE WITH CAPACITOR AND METHOD FOR FORMING THE SAME