Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

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CPC
H01L2224/24151

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/24151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body

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Patents Grantslast 30 patents

Information Patent Grant
Substrate comprising a high-density interconnect portion embedded i...
- Patent number 11,552,015
- Issue date Jan 10, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-level packaging structures
- Patent number 10,741,499
- Issue date Aug 11, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local dense patch for board assembly utilizing laser structuring me...
- Patent number 9,824,962
- Issue date Nov 21, 2017
- Intel Corporation
- Fay Hua
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220415838
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- SANGJIN LEE
- H01 - BASIC ELECTRIC ELEMENTS