Connecting between different semiconductor or solid-state bodies

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H01L2224/40135

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/40135Connecting between different semiconductor or solid-state bodies

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages including routing dies and methods of formin...
- Patent number 11,177,201
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip stack structure using conductive film bridge adhesive technology
- Patent number 9,553,073
- Issue date Jan 24, 2017
- Lingsen Precision Industries, Ltd.
- Chien-Ko Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor device
- Patent number 8,669,650
- Issue date Mar 11, 2014
- Alpha & Omega Semiconductor, Inc.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140054757
- Publication date Feb 27, 2014
- PANASONIC CORPORATION
- Keiko Ikuta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FLIP CHIP SEMICONDUCTOR DEVICE
- Publication number 20120248539
- Publication date Oct 4, 2012
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS